Abstract: A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a semiconductor component embedded in the package body and electrically connected to the first conductive pads; and a plurality of conductive elements embedded in the package body, each of the conductive elements having a first end electrically connected to a corresponding one of the second conductive pads and a second end opposing the first end and exposed from the second surface of the package body. Since the semiconductor component is embedded in the package body, the thickness of the semiconductor package structure is reduced.

Abstract: A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the wiring layer a dielectric body that has a first side having a first opening, from which a portion of the wiring layer is exposed, and a second side opposing the first side and disposed at the same side as the second surface of the wiring layer; and removing the carrier, with the second side of the dielectric body and the second surface of the wiring layer exposed. Therefore, a coreless package substrate is fabricated, and the overall thickness and cost of the substrate are reduced.

Abstract: The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

Abstract: A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer, thereby providing a large contact area so as to strengthen bonding between a semiconductor chip and the first circuit layer of the package structure.

Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a laminate on the carrier, wherein the laminate has a built-up portion and a release portion smaller in size than the built-up portion, the release portion covering the bonding pads and the built-up portion being laminated on the release portion and the carrier; forming a plurality of conductive posts in the built-up portion; and removing the release portion and the built-up portion on the release portion such that a cavity is formed in the laminate to expose the bonding pads, the conductive posts being positioned around a periphery of the cavity. Therefore, the present invention has simplified processes.

Abstract: A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality of protruding elements formed on the first conductive pads, respectively, wherein each of the protruding elements has contact surfaces to be encapsulated by an external conductive element; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer for electrically connecting the first circuit layer and the second circuit layer. The present invention strengthens the bonding between the first conductive pads and the conductive elements due to a large contact area between the protruding elements and the conductive elements.

Abstract: A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer, thereby providing a large contact area so as to strengthen bonding between a semiconductor chip and the first circuit layer of the package structure.

Abstract: A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality of protruding elements formed on the first conductive pads, respectively, wherein each of the protruding elements has contact surfaces to be encapsulated by an external conductive element; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer for electrically connecting the first circuit layer and the second circuit layer. The present invention strengthens the bonding between the first conductive pads and the conductive elements due to a large contact area between the protruding elements and the conductive elements.

Abstract: A package structure is provided, which includes: a substrate having opposite top and bottom surfaces and a plurality of conductive pads and a plurality of conductive posts formed therein, wherein the conductive pads are exposed from the bottom surface of the substrate, and the conductive posts are electrically connected to the conductive pads and each of the conductive posts has an end surface exposed from the top surface of the substrate; a plurality of first conductive bumps formed on the end surfaces of the conductive posts; a plurality of second conductive bumps formed on the top surface of the substrate, wherein the second conductive bumps are higher than the first conductive bumps; and at least a first electronic element disposed on and electrically connected to the first conductive bumps, thereby increasing the wiring flexibility and facilitating subsequent disposing of electronic elements without changing existing machines.

Abstract: A decryption method for use in displaying data includes the steps of executing a display instruction of an object inclusive of a plurality of data, displaying an unencrypted data, but not an encrypted data, of the data on a display unit according to the display instruction, detecting a trigger signal during the state of displaying the unencrypted data but not displaying the encrypted data, entering a password-receiving state in response to the trigger signal and detecting a password signal during the password-receiving state, determining whether the password signal matches a default password, and displaying the unencrypted data and the encrypted data on the display unit when the password signal matches the default password. Therefore, with the decryption method, no person other than the object owner is aware of the encrypted data.

Abstract: A single-layer wiring package substrate and a method of fabricating the same are provided, the method including: forming on a carrier a wiring layer having a first surface and a second surface opposing the first surface and being in contact with the carrier; forming on the carrier and on the wiring layer a dielectric body that has a first side having a first opening, from which a portion of the wiring layer is exposed, and a second side opposing the first side and disposed at the same side as the second surface of the wiring layer; and removing the carrier, with the second side of the dielectric body and the second surface of the wiring layer exposed. Therefore, a coreless package substrate is fabricated, and the overall thickness and cost of the substrate are reduced.

Abstract: A package structure is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and having a surface exposed from the first surface of the dielectric layer; a plurality of conductive posts embedded in the dielectric layer and electrically connected to the first circuit layer and having one ends exposed from the second surface of the dielectric layer; a second circuit layer formed on the second surface of the dielectric layer and electrically connected the ends of the conductive posts exposed from the second surface of the dielectric layer; and a plurality of protruding elements formed on the surface of the first circuit layer exposed from the first surface of the dielectric layer, thereby providing a large contact area so as to strengthen bonding between a semiconductor chip and the first circuit layer of the package structure.

Abstract: A semiconductor package structure and a method of fabricating the same are provided. The semiconductor package structure includes a package body having opposing first and second surfaces; a plurality of first conductive pads and a plurality of second conductive pads formed on the first surface of the package body; a semiconductor component embedded in the package body and electrically connected to the first conductive pads; and a plurality of conductive elements embedded in the package body, each of the conductive elements having a first end electrically connected to a corresponding one of the second conductive pads and a second end opposing the first end and exposed from the second surface of the package body. Since the semiconductor component is embedded in the package body, the thickness of the semiconductor package structure is reduced.

Abstract: The present invention provides a package structure with an embedded electronic component and a method of fabricating the package structure. The method includes: forming a first wiring layer on a carrier; removing the carrier and forming the first wiring layer on a bonding carrier; disposing an electronic component on the first wiring layer; forming an encapsulating layer, a second wiring layer and an insulating layer on the first wiring layer; disposing a chip on the electronic component and the second wiring layer; and forming a covering layer that covers the chip. The present invention can effectively reduce the thickness of the package structure and the electronic component without using adhesives.

Abstract: A coreless packaging substrate is provided, which includes: a dielectric layer having opposite first and second surfaces; a first circuit layer embedded in the dielectric layer and exposed from the first surface of the dielectric layer, wherein the first circuit layer has a plurality of first conductive pads; a plurality of protruding elements formed on the first conductive pads, respectively, wherein each of the protruding elements has contact surfaces to be encapsulated by an external conductive element; a second circuit layer formed on the second surface of the dielectric layer; and a plurality of conductive vias formed in the dielectric layer for electrically connecting the first circuit layer and the second circuit layer. The present invention strengthens the bonding between the first conductive pads and the conductive elements due to a large contact area between the protruding elements and the conductive elements.

Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a dielectric layer on the carrier; forming a plurality of conductive posts in the dielectric layer; and forming a cavity in the dielectric layer to expose the bonding pads, wherein the conductive posts are positioned around a periphery of the cavity, thereby simplifying the fabrication process.

Abstract: A package structure is provided, which includes: a substrate having opposite top and bottom surfaces and a plurality of conductive pads and a plurality of conductive posts formed therein, wherein the conductive pads are exposed from the bottom surface of the substrate, and the conductive posts are electrically connected to the conductive pads and each of the conductive posts has an end surface exposed from the top surface of the substrate; a plurality of first conductive bumps formed on the end surfaces of the conductive posts; a plurality of second conductive bumps formed on the top surface of the substrate, wherein the second conductive bumps are higher than the first conductive bumps; and at least a first electronic element disposed on and electrically connected to the first conductive bumps, thereby increasing the wiring flexibility and facilitating subsequent disposing of electronic elements without changing existing machines.

Abstract: A package substrate and a method of fabricating the same are provided. The method includes providing a substrate body having a first surface, a second surface opposing the first surface, a plurality of first electrical connecting pads disposed on the first surface; mounting a metal board on the first electrical connecting pads; and patterning the metal board so as to define a plurality of metal pillars corresponding to the first electrical connecting pads. Therefore, drawbacks of raw edges and unequal heights of the metal pillars can be obviated.

Abstract: A method of fabricating a packaging substrate is provided, including: providing a carrier having two carrying portions, each of the carrying portions having a first side and a second side opposite to the first side and the carrying portions are bonded through the second sides thereof; forming a circuit layer on the first side of each of the carrying portions; and separating the two carrying portions from each other to form two packaging substrates. The carrying portions facilitate the thinning of the circuit layers and provide sufficient strength for the packaging substrates to undergo subsequent packaging processes. The carrying portions can be removed after the packaging processes to reduce the thickness of packages and thereby meet the miniaturization requirement.

Abstract: A method for fabricating a package structure is provided, which includes the steps of: providing a carrier having a plurality of bonding pads; laminating a laminate on the carrier, wherein the laminate has a built-up portion and a release portion smaller in size than the built-up portion, the release portion covering the bonding pads and the built-up portion being laminated on the release portion and the carrier; forming a plurality of conductive posts in the built-up portion; and removing the release portion and the built-up portion on the release portion such that a cavity is formed in the laminate to expose the bonding pads, the conductive posts being positioned around a periphery of the cavity. Therefore, the present invention has simplified processes.