Abstract: The invention relates to an apparatus for measuring the human body temperature. It comprises of an infrared temperature sensor for performing temperature sampling on a plurality M×N of sampling points, M?3, N?3. The temperatures of the sampling points with temperatures within the effective temperature range of the human body are averaged to obtain the body temperature of the human body. By collecting the temperatures of a plurality of sampling points of the measured object, the invention effectively avoids the errors that measurement of single point may produce (as may be caused by factors such as the environment); by screening for temperatures within the effective temperature range of the human body, the invention effectively avoids errors or interference produced by factors such as clothing or the environment. The improved accuracy and real-time measurement of body temperature bring convenience to people's lives.

Abstract: The utility model relates to a device for measuring the heartbeat, respiration, and body temperature of a human body, comprising of a shell and a base, wherein a PCB board, a buzzer, and a multi-point infrared temperature sensor and a camera are arranged in the shell. The infrared temperature sensor is used for temperature sampling of M×N sampling points, where M?3, N?3, and the camera is used for acquiring the video image of the measured object.

Abstract: A semiconductor package includes a substrate and a flip-chip on the substrate The flip-chip includes first bump pads and second bump pads on an active surface of the flip-chip. Vias are disposed on the second bump pads. The first bump pads have a pad size that is smaller than that of the second bump pads. An underfill layer is disposed between the flip-chip and the substrate to surround the vias. The underfill layer is in direct contact with a surface of each of the first bump pads.

Abstract: An optical fingerprint imaging system and an optical assembly are provided. The optical fingerprint imaging system includes: a sensor including a substrate and a photosensitive layer, wherein the substrate has a first surface and a second surface which is opposite to and lower than the first surface, and the photosensitive layer is in contact with the first surface of the substrate; a light source disposed at a position lower than the first surface and higher than the second surface, and light emitted from the light source is adapted to be guided by the substrate of the sensor to the first surface of the substrate; and a mounting element adapted to mount the light source at a fixed position. Accordingly, the optical fingerprint imaging system has high light use efficiency and stable light source.

Abstract: A device and method for power loss protection in solid state drive are provided. A power loss region is created in a flash memory array and reserved as an independent storage space for storing power loss backup. When the power is interrupted, the SSD halts the operation of the host. Before the backup power is used up, the buffered data is directly written to a blank power loss block of the power loss region to form a power loss backup, and an auxiliary mark is created for confirming the most updated power loss backup. After the power is resumed, the power loss backup is directly read from the power loss region according to the most updated power loss auxiliary mark of the power loss backup to restore the original state of the SSD before the power is interrupted.

Abstract: The present invention provides a lubricating composition comprising an alginic acid or a salt or ester thereof, which is effective in reducing frictions in artificial joints and wear of artificial joint implants. Also provided is a method for lubricating artificial joints comprising administering said composition to a synovial cavity of a subject. In another aspect, the present invention provides use of an alginic acid or a salt or ester thereof in manufacturing a lubricating composition.

Abstract: Systems and methods are provided for annealing a semiconductor structure. In one embodiment, the method includes providing an energy-converting structure proximate a semiconductor structure, the energy-converting structure comprising a material having a loss tangent larger than that of the semiconductor structure; providing a heat reflecting structure between the semiconductor structure and the energy-converting structure; and providing microwave radiation to the energy-converting structure and the semiconductor structure. The semiconductor structure may include at least one material selected from the group consisting of boron-doped silicon germanium, silicon phosphide, titanium, nickel, silicon nitride, silicon dioxide, silicon carbide, n-type doped silicon, and aluminum capped silicon carbide. The heat reflecting structure may include a material substantially transparent to microwave radiation and having substantial reflectivity with respect to infrared radiation.

Abstract: The present invention illustrates a configuration adjustment system of personal vehicle and a method thereof. In the system, a client can transmit vehicle hardware information and personal identity information to a server via an in-vehicle computer. The server obtains personalization vehicle configuration parameter information and vehicle hardware configuration adjustment parameter information according to the first vehicle hardware information and the personal identity information, and then adjusts vehicle hardware configuration adjustment parameter information according to the personalization vehicle configuration parameter information to generate and return first vehicle hardware adjustment parameter information to the first in-vehicle computer. The first in-vehicle computer adjusts the hardware configuration of a first vehicle according to the first vehicle hardware adjustment parameter information.

Abstract: The present disclosure provides a scanning bed control apparatus of medical imaging equipment. According to an example of the present disclosure, this scanning bed control apparatus comprises a support table and a drive mechanism connected between the support table and the scanning bed of medical imaging equipment. This drive mechanism comprises a drive motor, a central frame and a drive unit set on the central frame. Where, an output end of the drive motor is connected with a gear, and a rack joggled with the gear is fixed on the central frame. When the drive motor drives the central frame to move back and forth by joggle between the gear and the rack, the drive unit may proceed two-stage drive following the back and forth movement of the central frame.

Abstract: An over-current protection device comprises a PTC device and a first external lead. The PTC device comprises first and second conductive layers and a PTC material layer laminated therebetween. The first conductive layer forms an upper surface of the PTC device. The first external lead has a lower surface soldered to the first conductive layer. The lower surface is provided with a plurality of protrusions of which tops are in direct contact with the first conductive layer to form a gap between the first external lead and the first conductive layer. Solder paste fills the gap to form an electrically conductive connecting layer. The over-current protection device may further comprise a second external lead with protrusions soldered to the second conductive layer to form an axial-lead or a radial-lead type device.

Abstract: A semiconductor package includes a packaging substrate having a first surface and a second surface opposite to the first surface; and a semiconductor die assembled on the first surface of the packaging substrate. The semiconductor die includes a plurality of first bump pads and second bump pads on an active surface of the semiconductor die, a plurality of first copper pillars on the first bump pads, and a plurality of second copper pillars on the second bump pads. The first copper pillars have a diameter that is smaller than that of the second copper pillars.

Abstract: A microelectronic package includes a packaging substrate having a chip mounting surface; a chip mounted on the chip mounting surface of the packaging substrate with the chip's active surface facing down to the chip mounting surface; a plurality of input/output (I/O) pads distributed on the active surface of the chip; and a discrete passive element mounted on the active surface of the chip. The discrete passive element may be a decoupling capacitor, a resistor, or an inductor.

Abstract: The invention is related to a manufacturing method for enhancing an ordered structure of block copolymers, and more particularly to a thermal annealing process for block copolymers having conducting polymers and rod segments. The manufacturing method includes the following steps: (A) providing a block copolymer and a small molecule additive, wherein the block copolymer is formed of first monomers containing at least one aromatic ring and second monomers optionally containing at least one aromatic ring; and the small molecule additive is a aliphatic molecule, an aromatic molecule or a combination thereof; (B) blending the block copolymer and the small molecule additive to form a mixture; and (C) treating the mixture with a thermal annealing process to manufacture and facilitate the ordered structure of the block copolymers.

Abstract: A method for treatment of hyperproliferative tissue by injection of and subsequently exposing the hyperproliferative tissue to a frequency of ultrasound. The invention further includes purified bis [1-[6,7-bis [2-(sodium carbonate ethyl]-1,3,5,8,-tetramethyl-2-vinyl-porphin-4-yl]ethyl]ether (DVDMS) for use in sonodynamic treatment of hyperproliferative tissue including cancer and further includes a kit including a dosage controllable injection device charged with a biologically compatible fluid containing DVDMS.

Abstract: A kit for introducing a bladder into a body pocket is provided. The kit comprises a holder having an interior surface, an exterior surface and at least one open end, a balloon catheter, a needle and a bladder. The holder includes a needle sheath formed on the exterior surface. The balloon catheter comprises a balloon and a tube. The needle is secured to the bladder by a suture. The bladder may be positioned in the holder with the needle received in the needle sheath. The bladder may have an inlet and an opening. Through the inlet the balloon catheter and a body prosthesis are introducible into the bladder after the bladder is placed into the body pocket, and through the opening the tube of the balloon catheter is introducible out of the bladder.

Abstract: An electronic circuit includes a clock control unit having a first input for receiving a first clock signal, a second input for receiving a second clock signal, a first clock output, and a second clock output, a first flip-flop having a first data input, a first clock input connected to the first clock output, and a first output, and a second flip-flop having a second data input, a second clock input connected to the second clock output, and a second data input connected to the first output of the first flip-flop. The clock control unit provides the first clock signal to the first clock input of the first flip-flop through the first clock output and the second clock signal to the clock input of the second flip-flop through the second clock output terminal in a sequential order.

Abstract: An organic light-emitting display panel and a fabrication method thereof include using an inkjet printing process to form the organic emission material of the display panel and providing a specific design of the relative position of the spacer and the planarization layer with ink-repellent material such that the spacer can be effectively fixed on the array substrate without falling from the planarization layer.

Abstract: A method for co-designing a flip-chip and an interposer is provided. Information regarding I/O pads, power pins and IR constraints of the flip-chip is obtained. A bump planning procedure is performed to obtain a total number of micro bumps of the flip-chip according to the information, and obtain a minimum conductance of each of the power pins of the flip-chip according to a bump placement of the micro bumps of the flip-chip. A chip-interposer routing procedure is performed to obtain a Re-Distribution Layer (RDL) routing of the flip-chip and an interposer routing of the interposer according to the minimum conductance of the power pins of the flip-chip.

Abstract: The present invention provides a method for flip chip packaging co-design. The method comprises steps of: providing an I/O pad information of a chip and a connection information of a PCB; performing a first I/O pad placement according to the I/O pad information of the chip and the connection information of the PCB; utilizing a RDL routing analysis device to perform a bump pad pitch analysis for the first I/O pad placement of the chip to generate a bump pad pitch analysis result; performing a bump pad planning for a package according to the bump pad pitch analysis result to generate a bump pad planning result; and performing a second I/O pad placement for the chip according to the bump pad planning result to generate an I/O pad placement result.

Abstract: A method and system for inspecting defects saves scanned raw data as an original image so as to save time for repeated scanning and achieve faster defect inspection and lower false rate by reviewing suspicious defects and other regions of interest in the original image by using the same or different image-processing algorithm with the same or different parameters.