Abstract: A composition containing: (a) a polysiloxane resin, wherein the polysiloxane resin contains the following siloxane units: [R3SiO1/2], [(OZ)qSiO(4-q)/2] and at least one of [(OZ)tREPSiO(3-t)/2] and [(OZ)dRREPSiO(2-d)/2]; where: each R is independently in each occurrence selected from hydrocarbyls, REP is an epoxy functional hydrocarbyl group, subscript q is in each occurrence a number selected from a range of 0-3, subscript t is in each occurrence a number selected from a range of 0-2, and subscript d is in each occurrence a number selected from a range of 0-1 provided that the average concentration of OZ groups is at least 15 mole-percent relative to moles of silicon atoms in the polysiloxane resin; (b) a photo acid generator; (c) a moisture cure catalyst; and (d) optionally, an epoxy functional diluent.

Abstract: An inspection method and an inspection platform applicable for inspecting a light source used to expose a substrate. The light source is adapted to form an illuminated area on a surface of the substrate. The inspection method includes the following steps: placing at least one inspection component on the surface of the substrate; causing the at least one inspection component and the illuminated area to have a relative movement and a relative speed in a specific direction so as to make the illuminated area move across the at least one inspection component, wherein in the specific direction, the illuminated area is smaller in size than the at least one inspection component; inspecting photon energy of incident light in the illuminated area by the at least one inspection component during the relative movement; and determining optical values of the light source according to the photon energy and the relative speed.

Abstract: A stacked via structure disposed on a conductive pillar of a semiconductor die is provided. The stacked via structure includes a first dielectric layer, a first conductive via, a first redistribution wiring, a second dielectric layer, a second conductive via, and a second redistribution wiring. The first dielectric layer covers the semiconductor die. The first conductive via is embedded in the first dielectric layer and electrically connected to the conductive pillar. The first redistribution wiring covers the first conductive via and the first dielectric layer. The second dielectric layer covers the first dielectric layer and the first redistribution wiring. The second conductive via is embedded in the second dielectric layer and landed on the first redistribution wiring. The second redistribution wiring covers the second conductive via and the second dielectric layer. A lateral dimension of the first conductive via is greater than a lateral dimension of the second conductive via.

Abstract: A Ginkgo biloba wuschel-related homeobox 3A (GbWOX3A) gene and an application thereof in plant tissue culture are provided. The GbWOX3A gene is derived from a Ginkgo biloba embryo, the gene sequence of the GbWOX3A gene is SEQ ID NO: 1, and the amino acid sequence encoded by the GbWOX3A gene is SEQ ID NO: 2. An expression of the GbWOX3A gene in developing embryo of Ginkgo biloba and regenerating a callus has specificity, and transgenic function verification experiments prove that overexpression of the GbWOX3A gene can promote regeneration of adventitious buds during the plant tissue culture. Therefore, the GbWOX3A gene has important theoretical significance and application value in the plant tissue culture, and especially plays an important role in improving the regeneration efficiency of gymnosperms.

Abstract: The present invention relates to a target-oriented seismic acquisition method and apparatus, a medium and a device. The target-oriented seismic acquisition method comprises the steps of: giving parameters of an initial velocity model and a three-dimensional seismic layout aiming to an underground target position; conducting wave field continuation and focusing analysis on the three-dimensional seismic layout, and calculating distribution of seismic energy on the ground in an underground target region; conducting normalization processing on distribution of the seismic energy on the ground, and then conducting level partitioning to obtain a primary energy region and a secondary energy region; adding the number of shot points in the primary energy region to achieve target-oriented acquisition, and obtaining a target-oriented inhomogeneous laying acquired data imaging result.

Abstract: The optical system includes a projector, a deflector, a polarizer, a first grating coupler structure, and a second grating coupler structure. The projector emits three beams having different wavelengths. The deflector is disposed below the projector and is configured to change incident angles of the three beams and to focus the three beams at the same region of the first grating coupler structure. The first grating coupler structure is below the deflector and is configured to couple the three beams into a light-guide lens such that the three beams travel the same optical path within the light-guide lens. The light-guide lens is connected to the first grating coupler structure and is configured to transmit the three beams. The polarizer is disposed between the projector and the deflector and is configured to filter out transverse electric (TE) modes or transverse magnetic (TM) modes of the three beams.

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a plurality of adhesive rings disposed on the sensor chip, a plurality of filtering lenses respectively adhered to the adhesive rings, and an encapsulant that surrounds the above components. A sensing region of the sensor chip has a layout boundary and a plurality of sub-regions that are defined by the layout boundary and that are separate from each other. The adhesive rings are disposed on the sensing region, and each of the adhesive rings surrounds one of the sub-regions. Each of the filtering lenses, a corresponding one of the adhesive rings, and a corresponding one of the sub-regions jointly define a buffering space. The encapsulant is formed on the substrate and covers the layout boundary of the sensor chip.

Abstract: A door handle assembly for a vehicle has a handle structure with an arcuate side edge. A light is coupled with the handle structure. An inner handle structure is coupled with the handle structure sandwiching the light between the handle structure and the inner handle structure. A single attachment member secures the door handle assembly with the vehicle door.

Abstract: A method for calibrating a functional icon display position of a control device is provided. The control device includes a transparent key and a display panel. The method includes the following steps. Firstly, an image capturing device is used to photograph a functional icon, and thus a real spatial relationship of the functional icon in a visible region of the transparent key is obtained. Then, a position offset amount is obtained according to a result of comparing the real spatial relationship with a reference spatial relationship. If the position offset amount is larger than the enable calibration threshold value, a calibrated icon display start coordinate position is obtained according to the position offset amount. The present invention also provides a control device using the calibrating method.

Abstract: Methods, apparatus, and systems that relate to rate matching scheme design for polar coding, PAC coding, or other pre-transformed polar coding are disclosed. In one example aspect, a method for digital communication includes determining, by a first node, an output bit sequence having E bits based on an input bit sequence c having K bits, wherein the output bit sequence is determined based on an output of a polar transform and an output of a repetition operation, and wherein the input of the repetition operation is a portion of a bit sequence before the polar transform. The method also includes transmitting, by the first node, a signal including the output bit sequence to a second node.

Abstract: A method for preparing FCBGA package substrate can effectively reduce the size of the connecting hole by using the inductively coupled plasma etching, where the connecting hole having minimum width of 40 ?m or less can be manufactured, and multiple connecting holes having different sizes and/or different shapes can be formed at one time, which can effectively reduce the cost and increase the wiring-density of the FCBGA package substrate. The inductively coupled plasma etching applied to the build-up layer is a chemical reaction, which can avoid the problems of black edges and heat-affected zones caused by thermal ablation and form a metal connecting layer with good adhesion without slag removal, therefore, the present disclosure can prepare the FCBGA package substrate with good reliability and electrical performance by utilizing the inductively coupled plasma etching.

Abstract: An air-cooled electric vibrating table: an improvement of an air-cooled part on an existing basis is that three or more flow guide air duct structural blocks are evenly distributed along the circumferential direction and flatly attached on the surface of an excitation coil or the bottom side thereof, the air duct structural blocks are provided with semi-open grooves that are axially coincident with or close to air inlets, and the grooves of all the air duct structural blocks are oriented to be consistent along the circumferential direction of a cavity; and a positioning block is adjusted to be flow guide blocks inserted obliquely with the axial direction of the vibrating table.

Abstract: Provided is a display module. The display module includes a protective cover plate and a flexible display panel. The protective cover plate includes a body portion in a shape of a circular plate and a bent portion disposed around the body portion, the bent portion being fixedly connected to an edge of the body portion; and a light exit side of the flexible display panel faces the protective cover plate, and the flexible display panel includes a first panel portion attached to the body portion and a second panel portion disposed around the first panel portion, an orthographic projection of the second panel portion on the protective cover plate being within the bent portion.

Abstract: Apparatuses, systems, and methods for transferring fluid to a stage in a charged particle beam system are disclosed. In some embodiments, a stage may be configured to secure a wafer; a chamber may be configured to house the stage; and a tube may be provided within the chamber to transfer fluid between the stage and outside of the chamber. The tube may include a first tubular layer of first material, wherein the first material is a flexible polymer; and a second tubular layer of second material, wherein the second material is configured to reduce permeation of fluid or gas through the tube. In some embodiments, a system may include a degasser system outside of the chamber, where the degasser system may be configured to remove gases from the transfer fluid before the transfer fluid enters the tube.

Abstract: Disclosed is an optical module, including a lower housing, an upper housing covering the lower housing, a circuit board, a first metal base, a second metal base, a silicon photonic chip, and a light emission module including a laser chip and an optical path assembly. The first metal base is disposed on one side of the upper housing. The second metal base is disposed on one side of the lower housing. The circuit board with a hollow region is disposed on the second metal base. The silicon photonic chip is disposed on the second metal base exposed from the hollow region. The laser chip is disposed on the first metal base. The optical path assembly is disposed on the first metal base and/or on the second metal base exposed from the hollow region, and guides a third optical signal emitted by the laser chip to the silicon photonic chip.

Abstract: Disclosed are a series of compounds with a nitrogen-containing spiro structure and an application thereof in the preparation of an RET kinase inhibitor. Specifically, disclosed is a compound as shown in formula (II) or a pharmaceutically acceptable salt thereof.

Abstract: An apparatus to facilitate supporting 8-bit floating point format operands in a computing architecture is disclosed. The apparatus includes a processor comprising: a decoder to decode an instruction fetched for execution into a decoded instruction, wherein the decoded instruction is a matrix instruction that operates on 8-bit floating point operands to cause the processor to perform a parallel dot product operation; a controller to schedule the decoded instruction and provide input data for the 8-bit floating point operands in accordance with an 8-bit floating data format indicated by the decoded instruction; and systolic dot product circuitry to execute the decoded instruction using systolic layers, each systolic layer comprises one or more sets of interconnected multipliers, shifters, and adder, each set of multipliers, shifters, and adders to generate a dot product of the 8-bit floating point operands.

Abstract: Methods, apparatus, and systems that relate to rate matching scheme design for polar coding, PAC coding, or other pre-transformed polar coding are described. One example method includes determining, by a first node, an output bit sequence having E bits based on an input bit sequence having K bits, wherein the output bit sequence is determined by 1) performing a polar transform with H components and 2) performing either no pre-transform or at least two pre-transform operations; wherein the polar transform is based on H polar matrices G(N0), G(N1), . . . , G(NH?1), wherein H, K and E are integers greater than 1, wherein a polar matrix G(Ni) is of size Ni. The method also includes transmitting, by the first node, a signal including the output bit sequence to a second node.

Abstract: Described herein is a graphics processor comprising first circuitry configured to execute a decoded instruction and second circuitry configured to second circuitry configured to decode an instruction into the decoded instruction. The second circuitry is configured to determine a number of registers within a register file that are available to a thread of the processing resource and decode the instruction based on that number of registers.

Abstract: A light emitting substrate is provided. The light emitting substrate includes light emitting elements of multiple types. The light emitting elements of different types are configured to emit light of a same color but different wavelength ranges. Light emitting elements of a respective type of the light emitting elements of multiple types are substantially evenly distributed in the light emitting substrate.