Patents by Inventor Wei-Han Chen
Wei-Han Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230067752Abstract: A method of fabricating a semiconductor device is described. A plurality of semiconductor fins is formed in a first region on a substrate. An isolation region is formed around the plurality of semiconductor fins. Dummy fins are formed extending above the isolation region and laterally adjacent the plurality of semiconductor fins. A first etch is performed to etch the plurality of semiconductor fins such that a top surface of the plurality of semiconductor fins has a same height as a top surface of the isolation region. A second etch is performed selectively etching the isolation region to form a first recess in the isolation region laterally adjacent the semiconductor fins. A third etch is performed selectively etching the plurality of semiconductor fins to remove the plurality of semiconductor fins and to etch a second recess through the isolation region into the semiconductor substrate.Type: ApplicationFiled: August 28, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Ya-Yi Tsai, Yi-Chun Chen, Wei-Han Chen, Wei-Ting Guo, Shu-Yuan Ku
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Patent number: 11586948Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.Type: GrantFiled: October 20, 2019Date of Patent: February 21, 2023Assignee: National Yang Ming Chiao Tung UniversityInventors: Wen-Liang Chen, Lung-Chieh Chen, Szu-Chia Chen, Wei-Han Chen, Chun-Yu Chu, Yu-Chi Shih, Yu-Ci Chang, Tzu-I Hsieh, Yen-Ling Chen, Li-Chi Peng, Meng-Zhan Lee, Jui-Yu Ho, Chi-Yao Ku, Nian-Ruei Deng, Yuan-Yao Chan, Erick Wang, Tai-Hsiang Yen, Shao-Yu Chiu, Jiun-Yi Lin, Yun-Wei Lin, Fung Ling Ng, Yi-Bing Lin, Chin-Cheng Wang
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Patent number: 11364413Abstract: A reaction force detection system for treadmills and detection method thereof is disclosed, wherein the system detects the current data generated by a user running on a treadmill comprising a running belt, a motor and an electronic circuit device by means of a current sensor, and then determines a current peak based on the current data, such that a ground reaction force peak can be determined according to the acquired current peak. Therefore, the present invention allows to determine the ground reaction force of the human body during running through the changes of the motor current signals inside the treadmill, such that these parameters can be further presented, analyzed, and stored in order to provide more scientific feedbacks for running trainings.Type: GrantFiled: May 21, 2020Date of Patent: June 21, 2022Assignee: NATIONAL TAIWAN NORMAL UNIVERSITYInventors: Tzyy-Yuang Shiang, Wen-Wen Yang, Wei-Han Chen, En-Tzu Wang
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Publication number: 20210004694Abstract: An IoT system includes a computing module for controlling an integral function of the system and including an analysis unit and a machine learning unit. The analysis unit is capable of operational analysis and creating a predictive model and creating a predictive model according to the data analyzed. The machine learning unit has an algorithm function to create a corresponding learning model. An IoT module is electrically connected to the computing module to serve as an intermediate role. At least one detection unit is electrically connected to the IoT module and disposed in soil to detect data of environmental and soil conditions and sends the data detected to the computing module for subsequent analysis.Type: ApplicationFiled: October 20, 2019Publication date: January 7, 2021Applicant: NATIONAL CHIAO TUNG UNIVERSITYInventors: Wen-Liang Chen, Lung-Chieh Chen, Szu-Chia Chen, Wei-Han Chen, Chun-Yu Chu, Yu-Chi Shih, Yu-Ci Chang, Tzu-I Hsieh, Yen-Ling Chen, Li-Chi Peng, Meng-Zhan Lee, Jui-Yu Ho, Chi-Yao Ku, Nian-Ruei Deng, Yuan-Yao Chan, Erick Wang, Tai-Hsiang Yen, Shao-Yu Chiu, Jiun-Yi Lin, Yun-Wei Lin, Fung Ling Ng, Yi-Bing Lin, Chin-Cheng Wang
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Publication number: 20200376330Abstract: A reaction force detection system for treadmills and detection method thereof is disclosed, wherein the system detects the current data generated by a user running on a treadmill comprising a running belt, a motor and an electronic circuit device by means of a current sensor, and then determines a current peak based on the current data, such that a ground reaction force peak can be determined according to the acquired current peak. Therefore, the present invention allows to determine the ground reaction force of the human body during running through the changes of the motor current signals inside the treadmill, such that these parameters can be further presented, analyzed, and stored in order to provide more scientific feedbacks for running trainings.Type: ApplicationFiled: May 21, 2020Publication date: December 3, 2020Inventors: Tzyy-Yuang SHIANG, Wen-Wen YANG, Wei-Han CHEN, En-Tzu WANG
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Patent number: 10418435Abstract: A pixel structure including a substrate, a power wire, a planarization layer, a drive circuit and a conductive structure is provided. The substrate has a layout area and a light-transmitting area located outside the layout area. The power wire is disposed on the layout area of the substrate. The power wire includes a shielding layer. The planarization layer is disposed on the substrate and covers the power wire. The drive circuit is disposed on the planarization layer and corresponds to the layout area. The drive circuit includes a first active device. The shielding layer overlaps with the first active device. The conductive structure is disposed in the planarization layer and distributed corresponding to the layout area. The power wire is electrically connected with the drive circuit through the conductive structure. A display panel is also provided.Type: GrantFiled: August 31, 2017Date of Patent: September 17, 2019Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Tai-Jui Wang, Chieh-Wei Feng, Meng-Jung Yang, Wei-Han Chen, Shao-An Yan, Tsu-Chiang Chang
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Patent number: 10363448Abstract: A liquid buoyancy muscle training device includes a liquid receiving tank receiving and holding liquid therein. A buoyantly submergible member is buoyantly submergible in the liquid contained in the liquid receiving tank and includes a regulation chamber formed therein. A bottom pulley is mounted inside the liquid receiving tank. A rope is connected to the buoyantly submergible member and wrapped around the bottom pulley and extends upward to project outside the liquid receiving tank. A liquid regulation tank is connected through a liquid supply tube to the regulation chamber to allow liquid to flow therebetween. A gas supplier is connected through a gas supply tube to the regulation chamber to selectively supply gas into the regulation chamber to change a ratio between liquid and gas inside the regulation chamber so as to change buoyance applied to the buoyantly submergible member by the liquid contained in the liquid receiving tank.Type: GrantFiled: August 9, 2017Date of Patent: July 30, 2019Inventors: Chiang Liu, Ya-Chen Liu, Wei-Han Chen, Wen-Hsuan Pan
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Patent number: 10276761Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.Type: GrantFiled: April 12, 2018Date of Patent: April 30, 2019Assignees: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yi-Hsiang Huang, Cheng-Chung Lee, Jia-Chong Ho, Wei-Han Chen, Shin-Hong Kuo
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Publication number: 20190046826Abstract: A liquid buoyancy muscle training device includes a liquid receiving tank receiving and holding liquid therein. A buoyantly submergible member is buoyantly submergible in the liquid contained in the liquid receiving tank and includes a regulation chamber formed therein. A bottom pulley is mounted inside the liquid receiving tank. A rope is connected to the buoyantly submergible member and wrapped around the bottom pulley and extends upward to project outside the liquid receiving tank. A liquid regulation tank is connected through a liquid supply tube to the regulation chamber to allow liquid to flow therebetween. A gas supplier is connected through a gas supply tube to the regulation chamber to selectively supply gas into the regulation chamber to change a ratio between liquid and gas inside the regulation chamber so as to change buoyance applied to the buoyantly submergible member by the liquid contained in the liquid receiving tank.Type: ApplicationFiled: August 9, 2017Publication date: February 14, 2019Inventors: Chiang Liu, Ya-Chen Liu, Wei-Han Chen, Wen-Hsuan Pan
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Publication number: 20190013378Abstract: A pixel structure including a substrate, a power wire, a planarization layer, a drive circuit and a conductive structure is provided. The substrate has a layout area and a light-transmitting area located outside the layout area. The power wire is disposed on the layout area of the substrate. The power wire includes a shielding layer. The planarization layer is disposed on the substrate and covers the power wire. The drive circuit is disposed on the planarization layer and corresponds to the layout area. The drive circuit includes a first active device. The shielding layer overlaps with the first active device. The conductive structure is disposed in the planarization layer and distributed corresponding to the layout area. The power wire is electrically connected with the drive circuit through the conductive structure. A display panel is also provided.Type: ApplicationFiled: August 31, 2017Publication date: January 10, 2019Applicants: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Tai-Jui Wang, Chieh-Wei Feng, Meng-Jung Yang, Wei-Han Chen, Shao-An Yan, Tsu-Chiang Chang
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Publication number: 20180351056Abstract: A photoelectric device package including a substrate, a first circuit layer, a carrier structure, a second circuit layer, at least one photoelectric device, and a first encapsulation layer is provided. The first circuit layer is disposed on the substrate. The carrier structure is disposed on the substrate and covers the first circuit layer. The carrier structure includes a first dielectric layer, a second dielectric layer, and an elastic layer disposed between the first dielectric layer and the second dielectric layer. The Young's modulus of the elastic layer is less than the Young's modulus of the first dielectric layer and the second dielectric layer. The second circuit layer is disposed on the carrier structure. The photoelectric device is disposed on the carrier structure and is electrically connected to the first and second circuit layers. The first encapsulation layer is disposed on the carrier structure and encapsulates the photoelectric device.Type: ApplicationFiled: April 12, 2018Publication date: December 6, 2018Applicants: Industrial Technology Research Institute, Intellectual Property Innovation CorporationInventors: Yi-Hsiang Huang, Cheng-Chung Lee, Jia-Chong Ho, Wei-Han Chen, Shin-Hong Kuo
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Patent number: 10083989Abstract: A semiconductor device is provided to include a flexible substrate, a barrier layer, a heat insulating layer, a device layer, a dielectric material later and a stress absorbing layer. The barrier layer is disposed on the flexible substrate. The heat insulating layer is disposed on the barrier layer, wherein the heat insulating layer has a thermal conductivity of less than 20 W/mK. The device layer is disposed on the heat insulating layer. The dielectric material layer is disposed on the device layer, and the dielectric material layer and the heat insulating layer include at least one trench. The stress absorbing layer is disposed on the dielectric material layer, and the stress absorbing layer fills into the at least one trench.Type: GrantFiled: July 14, 2016Date of Patent: September 25, 2018Assignee: Industrial Technology Research InstituteInventors: Tai-Jui Wang, Tsu-Chiang Chang, Yu-Hua Chung, Wei-Han Chen, Hsiao-Chiang Yao
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Patent number: 9960245Abstract: A transistor device including a semiconductor material layer, a gate layer, and an insulation layer between the gate layer and the semiconductor material layer is provided. The semiconductor material layer includes a first conductive portion, a second conductive portion, a channel portion between the first conductive portion and the second conductive portion, and a first protruding portion formed integrally. The channel portion has a first boundary adjacent to the first conductive portion, a second boundary adjacent to the second conductive portion, a third boundary, and a fourth boundary. The third boundary and the fourth boundary connect the terminals of the first boundary and the second boundary. The first protruding portion is protruded outwardly from the third boundary of the channel portion. The first gate boundary and the second gate boundary are overlapped with the first boundary and the second boundary of the channel portion.Type: GrantFiled: March 15, 2017Date of Patent: May 1, 2018Assignee: Industrial Technology Research InstituteInventors: Tai-Jui Wang, Tsu-Chiang Chang, Chieh-Wei Feng, Shao-An Yan, Wei-Han Chen
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Publication number: 20170170207Abstract: A semiconductor device is provided to include a flexible substrate, a barrier layer, a heat insulating layer, a device layer, a dielectric material later and a stress absorbing layer. The barrier layer is disposed on the flexible substrate. The heat insulating layer is disposed on the barrier layer, wherein the heat insulating layer has a thermal conductivity of less than 20 W/mK. The device layer is disposed on the heat insulating layer. The dielectric material layer is disposed on the device layer, and the dielectric material layer and the heat insulating layer include at least one trench. The stress absorbing layer is disposed on the dielectric material layer, and the stress absorbing layer fills into the at least one trench.Type: ApplicationFiled: July 14, 2016Publication date: June 15, 2017Inventors: Tai-Jui Wang, Tsu-Chiang Chang, Yu-Hua Chung, Wei-Han Chen, Hsiao-Chiang Yao
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Patent number: 9391208Abstract: An electronic device including at least one electronic component and a method of manufacturing the same are provided. The electronic device may include a substrate, a semiconductor layer disposed on the substrate, an insulating layer disposed on the semiconductor layer, and a first metal layer disposed on the insulating layer. The insulating layer may have a pattern corresponding to a pattern of the semiconductor layer or the first metal layer. The flexible layer has a Young's modulus less than 40 GPa and is disposed on the substrate to encapsulate the semiconductor layer. At least one first opening penetrates the flexible layer. At least one second metal layer is disposed on the flexible layer and in the first opening and electrically connected to the semiconductor layer.Type: GrantFiled: October 17, 2014Date of Patent: July 12, 2016Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Wu-Wei Tsai, Wei-Cheng Kao, Wei-Han Chen
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Patent number: 9381599Abstract: A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.Type: GrantFiled: May 16, 2014Date of Patent: July 5, 2016Assignee: QUANTA COMPUTER INC.Inventors: Chi-Hsueh Yang, Ming-Chang Tsai, Wei-Han Chen, Hsiao-Fan Chang
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Patent number: 9368441Abstract: An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.Type: GrantFiled: December 4, 2014Date of Patent: June 14, 2016Assignee: Industrial Technology Research InstituteInventors: Jing-Yi Yan, Wu-Wei Tsai, Wei-Cheng Kao, Wei-Han Chen
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Publication number: 20160111551Abstract: An electronic device including at least one electronic component and a method of manufacturing the same are provided. The electronic device may include a substrate, a semiconductor layer disposed on the substrate, an insulating layer disposed on the semiconductor layer, and a first metal layer disposed on the insulating layer. The insulating layer may have a pattern corresponding to a pattern of the semiconductor layer or the first metal layer. The flexible layer has a Young's modulus less than 40 GPa and is disposed on the substrate to encapsulate the semiconductor layer. At least one first opening penetrates the flexible layer. At least one second metal layer is disposed on the flexible layer and in the first opening and electrically connected to the semiconductor layer.Type: ApplicationFiled: October 17, 2014Publication date: April 21, 2016Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jing-Yi Yan, Wu-Wei Tsai, Wei-Cheng Kao, Wei-Han Chen
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Publication number: 20150348894Abstract: An electronic component and a method for fabricating the electronic component are provided. The electronic component includes a carrier, a first metal layer, a dielectric layer, a semiconductor layer, a flexible layer, at least one first opening, and at least one second metal layer. The first metal layer is disposed on the carrier. The dielectric layer is disposed on the first metal layer, and has a pattern consistent with a pattern of the dielectric layer. The semiconductor layer is disposed on the dielectric layer. The flexible layer is disposed on the carrier and encapsulates the first metal layer, the dielectric layer and the semiconductor layer. The flexible layer has a Young's modulus less than 40 GPa. The first opening penetrates the flexible layer. The second metal layer is disposed on the flexible layer and in the first opening and is electrically connected with the semiconductor layer.Type: ApplicationFiled: December 4, 2014Publication date: December 3, 2015Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTEInventors: Jing-Yi Yan, Wu-Wei Tsai, Wei-Cheng Kao, Wei-Han Chen
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Publication number: 20150165572Abstract: A manufacturing method of a heat dissipation assembly includes the following steps: an accommodating concave portion and hollow areas are formed on a board body, and the hollow areas are through the board body located in the accommodating concave portion. The board body located in the accommodating concave portion is extended, such that the hollow areas are closed by the board body adjacent to the hollow areas. A heat pipe is placed in the accommodating concave portion, and the width of the heat pipe and the width of the accommodating concave portion are substantially the same. A stamping treatment is performed on the board body surrounding the accommodating concave portion to form positioning protruding portions, and the positioning protruding portions protrude toward the accommodating concave portion, such that the heat pipe is fixed between the positioning protruding portions and the accommodating concave portion.Type: ApplicationFiled: May 16, 2014Publication date: June 18, 2015Applicant: Quanta Computer Inc.Inventors: Chi-Hsueh YANG, Ming-Chang TSAI, Wei-Han CHEN, Hsiao-Fan CHANG