Patents by Inventor Wei-Han Lai

Wei-Han Lai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230157277
    Abstract: The antimicrobial coating material for surface coating is formed from encapsulated biocides. The biocides include at least one antimicrobial component. The biocides are encapsulated in inorganic-organic shells which are permeable to the biocides. The organic materials may include at least one nonionic polymer. The inorganic-organic shells encapsulate and contain the biocides to form capsule structures for storage and release of the biocides. The capsule structures may be single capsules or capsule-in-capsule structures. The inorganic materials may be present in a concentration of 0.5-95 wt % of the inorganic-organic shells. Alternatively, the inorganic materials may be present in a concentration of 5-60 wt %. The inorganic materials and the organic materials are each intermixed, with respect to one another, in structures of the inorganic-organic shells. These structures may be an attachment structure, a hybrid structure or a multi-layered structure.
    Type: Application
    Filed: July 14, 2022
    Publication date: May 25, 2023
    Applicant: THE HONG KONG UNIVERSITY OF SCIENCE AND TECHNOLOGY
    Inventors: King Lun YEUNG, Yue Tak LAI, Wei HAN, Ying LI, Yan LI
  • Publication number: 20230142787
    Abstract: A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight per cent of a total weight of the negative tone photoresist.
    Type: Application
    Filed: January 6, 2023
    Publication date: May 11, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Li-Po YANG, Wei-Han LAI, Ching-Yu CHANG
  • Patent number: 11626293
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.
    Type: Grant
    Filed: April 4, 2022
    Date of Patent: April 11, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yen-Hao Chen, Wei-Han Lai, Ching-Yu Chang, Chin-Hsiang Lin
  • Publication number: 20230102166
    Abstract: A method of manufacturing a semiconductor device includes forming a protective layer over a substrate. The hydrophilicity of the protective layer is reduced. A resist layer is formed over the protective layer, and the resist layer is patterned.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 30, 2023
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20230063073
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer including an organic material over a substrate. A second layer including a reaction product of a silicon-containing material and a photoacid generator is formed over the first layer. A photosensitive layer is formed over the second layer, and the second layer is patterned.
    Type: Application
    Filed: August 27, 2021
    Publication date: March 2, 2023
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Patent number: 11594511
    Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.
    Type: Grant
    Filed: April 8, 2021
    Date of Patent: February 28, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chih-Cheng Hung, Wei-Han Lai
  • Publication number: 20230036859
    Abstract: A photoresist includes a polymer and a photoactive compound. The photoactive compound contains a sensitizer component. The photoactive compound contains an acid generator or a base molecular. The acid generator or the base molecular bonds the sensitizer component. The photoactive compound is within a polymer backbone. The sensitizer component is configured to absorb an EUV light to produce electrons.
    Type: Application
    Filed: July 16, 2021
    Publication date: February 2, 2023
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chieh-Hsin HSIEH, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20230028006
    Abstract: Novel photoresist additive compositions including developer solubility groups which enhance the solubility of the photoresist additive in a developer, such as a TMAH developer. The novel photoresist additive compositions also include functional groups to address outgassing and out-of-band issues.
    Type: Application
    Filed: May 5, 2022
    Publication date: January 26, 2023
    Inventors: Yen-Hao CHEN, Wei-Han LAI, Ching-Yu CHANG
  • Patent number: 11550220
    Abstract: A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight per cent of a total weight of the negative tone photoresist.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: January 10, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Li-Po Yang, Wei-Han Lai, Ching-Yu Chang
  • Publication number: 20220406593
    Abstract: Methods for making a semiconductor device using an improved BARC (bottom anti-reflective coating) are provided herein. The improved BARC comprises a polymer formed from at least a styrene monomer having at least one or two hydrophilic substituents. The monomer(s) and substituents can be varied as desired to obtain a balance between film adhesion and wet etch resistance. Also provided is a semiconductor device produced using such methods.
    Type: Application
    Filed: July 27, 2021
    Publication date: December 22, 2022
    Inventors: Ya-Ting Lin, Yen-Ting Chen, Wei-Han Lai
  • Publication number: 20220392764
    Abstract: A method includes providing a layered structure on a substrate, the layered structure including a bottom layer formed over the substrate and a photoresist layer formed over the bottom layer, exposing the photoresist layer to a radiation source, developing the photoresist layer, patterning the bottom layer and removing portions of the substrate through openings in the patterned bottom layer. In some embodiments, a middle layer is provided between the bottom layer and the photoresist layer. The material of the bottom layer includes at least one cross-linking agent that has been functionalized to decrease its affinity to other materials in the bottom layer.
    Type: Application
    Filed: September 22, 2021
    Publication date: December 8, 2022
    Inventors: Jing-Hong HUANG, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20220382156
    Abstract: A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.
    Type: Application
    Filed: July 29, 2022
    Publication date: December 1, 2022
    Inventors: Wei-Han Lai, Chin-Hsiang Lin, Chien-Wei Wang
  • Publication number: 20220365430
    Abstract: A negative tone photoresist and method for developing the negative tone photoresist is disclosed. For example, the negative tone photoresist includes a solvent, a dissolution inhibitor, and a polymer. The polymer includes a hydroxyl group. The polymer may be greater than 40 weight percent of a total weight of the negative tone photoresist.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Li-Po YANG, Wei-Han LAI, Ching-Yu CHANG
  • Publication number: 20220367178
    Abstract: A spin on carbon composition, comprises: a carbon backbone polymer; a first crosslinker; and a second crosslinker. The first crosslinker reacts with the carbon backbone polymer to partially crosslink the carbon backbone polymer at a first temperature, and the second crosslinker reacts with the carbon backbone polymer to further crosslink the carbon backbone polymer at a second temperature higher than the first temperature. The first crosslinker is a monomer, oligomer, or polymer. The second crosslinker is a monomer, oligomer, or polymer. The first and second crosslinkers are different from each other. When either of the first crosslinker or the second crosslinker is a polymer, the polymer is a different polymer than the carbon backbone polymer.
    Type: Application
    Filed: July 13, 2022
    Publication date: November 17, 2022
    Inventors: Jing Hong HUANG, Ching-Yu CHANG, Wei-Han LAI
  • Publication number: 20220359190
    Abstract: Method of manufacturing a semiconductor device, includes forming a protective layer over substrate having a plurality of protrusions and recesses. The protective layer includes polymer composition including polymer having repeating units of one or more of: Wherein a, b, c, d, e, f, g, h, and i are each independently H, —OH, —ROH, —R(OH)2, —NH2, —NHR, —NR2, —SH, —RSH, or —R(SH)2, wherein at least one of a, b, c, d, e, f, g, h, and i on each repeating unit is not H. R, R1, and R2 are each independently a C1-C10 alkyl group, a C3-C10 cycloalkyl group, a C1-C10 hydroxyalkyl group, a C2-C10 alkoxy group, a C2-C10 alkoxy alkyl group, a C2-C10 acetyl group, a C3-C10 acetylalkyl group, a C1-C10 carboxyl group, a C2-C10 alkyl carboxyl group, or a C4-C10 cycloalkyl carboxyl group, and n is 2-1000. A resist layer is formed over the protective layer, and the resist layer is patterned.
    Type: Application
    Filed: April 23, 2021
    Publication date: November 10, 2022
    Inventors: Jing Hong Huang, Wei-Han Lai, Ching-Yu Chang
  • Patent number: 11476108
    Abstract: A method of manufacturing a semiconductor device includes forming a spin on carbon layer comprising a spin on carbon composition over a semiconductor substrate. The spin on carbon layer is first heated at a first temperature to partially crosslink the spin on carbon layer. The spin on carbon layer is second heated at a second temperature to further crosslink the spin on carbon layer. An overlayer is formed over the spin on carbon layer. The second temperature is higher than the first temperature.
    Type: Grant
    Filed: August 3, 2020
    Date of Patent: October 18, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jing Hong Huang, Ching-Yu Chang, Wei-Han Lai
  • Publication number: 20220328446
    Abstract: A bonding device for bonding an electronic element includes an engaging component. The engaging component has a first surface and a second surface opposite to the first surface. The engaging component includes a plurality of recesses at the second surface. The plurality of recesses are configured to cover a plurality of projections of an electronic element. The engaging component is coupled to a heating component.
    Type: Application
    Filed: April 8, 2021
    Publication date: October 13, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chih-Cheng HUNG, Wei-Han LAI
  • Publication number: 20220282196
    Abstract: A perfusion cell culture device includes a driving module and a plurality of cell culture modules. The driving module includes a driving source connecting opening and a chamber. The chamber and the driving source connecting opening are connected. Each of the culture modules includes a fluid channel, a first elastic element, two flow direction controlling units and a cell culture zone. The fluid channel is disposed above the chamber, the first elastic element is disposed between the fluid channel and the chamber, the two flow direction controlling units are respectively disposed on two ends of the fluid channel and connected to the fluid channel selectively, and the cell culture zone is connected to the two flow direction controlling units.
    Type: Application
    Filed: June 22, 2021
    Publication date: September 8, 2022
    Inventors: Wei-Han Lai, Jen-Huang Huang, Yu-Lun Lu
  • Patent number: 11422465
    Abstract: A method includes forming a photoresist layer over a substrate, wherein the photoresist layer includes a polymer, a sensitizer, and a photo-acid generator (PAG), wherein the sensitizer includes a resonance ring that includes nitrogen and at least one double bond. The method further includes performing an exposing process to the photoresist layer. The method further includes developing the photoresist layer, thereby forming a patterned photoresist layer.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: August 23, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Wei-Han Lai, Chin-Hsiang Lin, Chien-Wei Wang
  • Publication number: 20220230889
    Abstract: A method of manufacturing a semiconductor device includes forming a first layer of a first planarizing material over a patterned surface of a substrate, forming a second layer of a second planarizing material over the first planarizing layer, crosslinking a portion of the first planarizing material and a portion of the second planarizing material, and removing a portion of the second planarizing material that is not crosslinked. In an embodiment, the method further includes forming a third layer of a third planarizing material over the second planarizing material after removing the portion of the second planarizing material that is not crosslinked. The third planarizing material can include a bottom anti-reflective coating or a spin-on carbon, and an acid or an acid generator. The first planarizing material can include a spin-on carbon, and an acid, a thermal acid generator or a photoacid generator.
    Type: Application
    Filed: April 4, 2022
    Publication date: July 21, 2022
    Inventors: Yen-Hao CHEN, Wei-Han LAI, Ching-Yu CHANG, Chin-Hsiang LIN