Patents by Inventor Wei Hao

Wei Hao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20260151362
    Abstract: The pharmaceutical composition capable of effectively preventing deactivation and enhancing targeting activity of SN triple-bond structured compound, comprises an SN triple-bond structured compound, a stabilizer protectant, and a pharmaceutical excipient. The pharmaceutical composition of the present disclosure can ensure that the SN triple-bond structured compound is located in the environment lacking proton and water and being hydrophobic, improve its targeting ability and acid avoidance properties, and avoid its reaction with other easy-to-react reactants, thus laying the foundation for applying the pharmaceutical composition to medications for resisting tumors and the like.
    Type: Application
    Filed: October 18, 2022
    Publication date: June 4, 2026
    Applicant: SHANGHAI JZIY BIOTECHNOLOGY CO., LTD.
    Inventors: Wei HAO, Yangfan HAO, Yali QIAO
  • Publication number: 20260105879
    Abstract: The present disclosure provides a driving chip, which includes: a first signal port and a second signal port; a logic control module connected to the first signal port and the second signal port, the logic control module being configured to configure, according to a configuration signal received by the first signal port or the second signal port, one of the first signal port or the second signal port as a signal input port, configure the other of the first signal port or the second signal port as a signal output port, and output the configuration signal or an updated configuration signal through the signal output port. The present disclosure further provides a method for configuring ports of the driving chip, a light emission driver, a backlight module and a display apparatus.
    Type: Application
    Filed: December 12, 2025
    Publication date: April 16, 2026
    Inventors: Junwei ZHANG, Wei HAO, Lingyun SHI, Xiaoyu ZHANG
  • Patent number: 12525568
    Abstract: A backplane and a glass-based circuit board. The backplane includes: a base substrate and a plurality of light-emitting units, arranged in an array on the base substrate. Each of the light-emitting units includes at least one light-emitting sub-unit; the light-emitting sub-unit includes a connection line and a plurality of light-emitting diode chips connected with the connection line, and the light-emitting diode chips are located on a side of the connection line away from the base substrate. The connection line includes a first connection portion, a second connection portion and a third connection portion; in each of the light-emitting sub-units, the third connection portion includes a plurality of connection sub-portions, each of the connection sub-portions includes at least one electrical contact point; the electrical contact points at adjacent ends of adjacent connection sub-portions constitute an electrical contact point pair.
    Type: Grant
    Filed: April 29, 2024
    Date of Patent: January 13, 2026
    Assignees: BEIJING BOE DISPLAY TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Wengang Su, Wei Hao, Haiwei Sun, Lingyun Shi, Feifei Wang, Rui Shi
  • Patent number: 12518672
    Abstract: The present disclosure provides a driving chip, which includes: a first signal port and a second signal port; a logic control module connected to the first signal port and the second signal port, the logic control module being configured to configure, according to a configuration signal received by the first signal port or the second signal port, one of the first signal port or the second signal port as a signal input port, configure the other of the first signal port or the second signal port as a signal output port, and output the configuration signal or an updated configuration signal through the signal output port. The present disclosure further provides a method for configuring ports of the driving chip, a light emission driver, a backlight module and a display apparatus.
    Type: Grant
    Filed: January 19, 2023
    Date of Patent: January 6, 2026
    Assignees: BOE MLED Technology Co., Ltd., Beijing BOE Technology Development Co., Ltd.
    Inventors: Junwei Zhang, Wei Hao, Lingyun Shi, Xiaoyu Zhang
  • Patent number: 12503404
    Abstract: A method for preparing an ablation-resistant high-entropy carbide-high-entropy diboride-silicon carbide (SiC) multiphase ceramic, including: (S1) mixing a transition metal oxide mixed powder, nano carbon black and a silicon hexaboride (SiB6) powder to obtain a precursor powder; and (S2) subjecting the precursor powder to pressureless sintering to obtain the high-entropy carbide-high-entropy diboride-SiC multiphase ceramic with a relative density of 96% or more.
    Type: Grant
    Filed: January 11, 2023
    Date of Patent: December 23, 2025
    Assignee: Zhejiang Normal University
    Inventors: Wei Hao, Xinyue Chen, Chunni Zhou, Xiaoxian Qin, Dongyun Wang
  • Publication number: 20250314928
    Abstract: A substrate, which has edges, a device region, and at least one bonding region, includes a base, device groups, signal line groups, and bridging parts. The device groups are located in the device region, and arranged along first and second directions. The signal line groups are located on the same side of the base as the device groups. A signal line group includes signal lines extending along the second direction, and arranged at intervals along the first direction. Any signal line extends from a bonding region on the device region, and is electrically connected to a column of device groups along the second direction. The bridging parts are located on the same side as the device groups. At least one bridging part is located in the device region. At least two signal lines in at least one signal line group are electrically connected together through a bridging part.
    Type: Application
    Filed: August 9, 2022
    Publication date: October 9, 2025
    Inventors: Wengang Su, Feifei Wang, Kaimin Yin, Zhitao Zhang, Jiajia Gai, Wei Hao, Huangfei Cha, Lingyun Shi, Ningyu Luo, Zouming Xu, Xintao Wu, Jie Wang, Jiawei Xu, Tingwei Han
  • Publication number: 20250285569
    Abstract: A driver chip is disclosed. The driver chip includes: a logic control module, at least one output pin and a first functional pin. The at least one output pin is electrically connected to the logic control module, and the first functional pin is electrically connected to the logic control module. The first functional pin is capable of receiving a test signal, and the logic control module is configured to generate, according to the test signal, a test current flowing through each output pin.
    Type: Application
    Filed: May 23, 2025
    Publication date: September 11, 2025
    Inventors: Wei HAO, Junwei ZHANG, Xiaoyu ZHANG, Lingyun SHI
  • Patent number: 12396309
    Abstract: The present disclosure provides an array substrate, a backlight and a display device which both include the array substrate. The array substrate includes multiple light-emitting units arranged in M rows and N columns and multiple first signal lines. Multiple first signal lines are divided into N groups, and each group of first signal lines is electrically connected to a column of light-emitting units. Each group of first signal lines includes at least two first signal lines, for each column of light-emitting units, at least two consecutive rows of light-emitting units are electrically connected to one of the at least two first signal lines, and the remaining at least one row of light-emitting unit is electrically connected to the other one of the at least two first signal lines, M is a positive integer greater than or equal to 3, N is a positive integer greater than or equal to 1.
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: August 19, 2025
    Assignee: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming Yang, Xingce Shang, Wei Hao, Zhenyu Zhang, Fuqiang Li, Wanzhi Chen
  • Publication number: 20250252263
    Abstract: Disclosed are systems, methods, and other implementations, including a method for detecting machine-generated content that includes receiving written source input at a machine learning system configured to transform written content into resultant transformed content, and generating by the machine learning system one or more rewritten versions of the written source input, with the one or more rewritten versions being semantically similar to the written source input. The method further includes deriving one or more rewriting change measurements, for the one or more rewritten versions, representing extent of differences between the one or more rewritten versions and the written source input, and determining likelihood that the written source input was machine generated based at least on the derived one or more rewriting change measurements.
    Type: Application
    Filed: January 28, 2025
    Publication date: August 7, 2025
    Applicant: The Trustees of Columbia University in the City of New York
    Inventors: Junfeng YANG, Chengzhi MAO, Carl VONDRICK, Wei HAO
  • Publication number: 20250219296
    Abstract: Embodiments of this application provide a transmission line, a feed network, and an antenna apparatus. The transmission line is used for a radio frequency device. The transmission line includes a reflector, an insulation support, and a transmission structure. The transmission structure includes at least two side walls. The transmission structure is disposed on a surface of the insulation support, an included angle between two adjacent side walls of the transmission structure is greater than zero, and different side walls of the transmission structure are located on different surfaces of the insulation support. At least one surface of the transmission structure is disposed opposite to a part of a structure of the reflector, and a gap exists between the at least one surface of the transmission structure and the reflector. The transmission line has a small signal loss and occupies a small space.
    Type: Application
    Filed: March 19, 2025
    Publication date: July 3, 2025
    Inventors: Minghua YIN, Zhongwei PENG, Junlang WU, Wei HAO, Wen WU
  • Patent number: 12347352
    Abstract: A driver chip is disclosed. The driver chip includes: a logic control module, at least one output pin and a first functional pin. The at least one output pin is electrically connected to the logic control module, and the first functional pin is electrically connected to the logic control module. The first functional pin is capable of receiving a test signal, and the logic control module is configured to generate, according to the test signal, a test current flowing through each output pin.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: July 1, 2025
    Assignees: BOE MLED Technology Co., Ltd., ROE TECHNOLOGY GROUP CO., LTD
    Inventors: Wei Hao, Junwei Zhang, Xiaoyu Zhang, Lingyun Shi
  • Patent number: 12347310
    Abstract: Disclosed is a method for short-term traffic risk prediction of road sections by using roadside observation data.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: July 1, 2025
    Assignee: WUHAN UNIVERSITY OF TECHNOLOGY
    Inventors: Nengchao Lyu, Jiaqiang Wen, Lingfeng Peng, Wei Hao, Haoran Wu, Yugang Wang
  • Publication number: 20250140210
    Abstract: The present disclosure provides a driver circuit, a driving method of the driver circuit, an array substrate and a display device, belonging to the field of display technology. The driver circuit provided by the present disclosure includes a logic control module, a data pin and at least two output pins. The data pin is configured to receive driving data. The logic control module is configured to generate driving control signals in a one-to-one correspondence with the at least two output pins according to the driving data. The driving control signals are configured to control the current flowing through the corresponding output pins.
    Type: Application
    Filed: January 6, 2025
    Publication date: May 1, 2025
    Inventors: Kaimin YIN, Wei HAO, Lingyun SHI, Wenchieh HUANG, Feifei WANG, Wengang SU, Rui SHI, Xingce SHANG, Junwei ZHANG, Taotao DUAN
  • Publication number: 20250140214
    Abstract: A driver circuit includes a logic control component and a plurality of pins coupled to the logic control component. The plurality of pins include a clock pin, a data pin and at least two output pins. The clock pin is configured to receive a clock signal. The data pin is configured to receive, under control of the logic control component, a data signal in a period of an active level of the clock signal. The logic control component is configured to generate a driving control signal corresponding to each output pin according to the data signal, so as to control an electrical signal flowing through the output pin.
    Type: Application
    Filed: January 6, 2025
    Publication date: May 1, 2025
    Inventors: Junwei ZHANG, Wei HAO, Feifei WANG, Wengang SU, Kaimin YIN, Xingce SHANG, Taotao DUAN, Liguang GENG, Huangfei CHA, Yu DENG
  • Publication number: 20250133893
    Abstract: A wiring substrate, an electronic element and an electronic apparatus is provided according to the disclosure, the wiring substrate includes: a base substrate; connection lines located on the substrate, wherein at least two connection lines are configured to transmit different signals; a plurality of pads, wherein any two pads are distributed at intervals, and the pads include first pads; a first pad group composed of at least three first pads; wherein the connection lines include a first type of connection line, which includes a plurality of branch portions, different branch portions are connected with different first pads, and any two branch portions are arranged at intervals.
    Type: Application
    Filed: January 19, 2023
    Publication date: April 24, 2025
    Inventors: Hai TANG, Wei HAO, Yiding SUN, Yongle FANG, Liang GAO, Xiaolin GENG
  • Patent number: 12217715
    Abstract: A driver circuit includes a logic control component and a plurality of pins coupled to the logic control component. The plurality of pins include a clock pin, a data pin and at least two output pins. The clock pin is configured to receive a clock signal. The data pin is configured to receive, under control of the logic control component, a data signal in a period of an active level of the clock signal. The logic control component is configured to generate a driving control signal corresponding to each output pin according to the data signal, so as to control an electrical signal flowing through the output pin.
    Type: Grant
    Filed: November 16, 2021
    Date of Patent: February 4, 2025
    Assignees: BOE MLED Technology Co., Ltd., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Junwei Zhang, Wei Hao, Feifei Wang, Wengang Su, Kaimin Yin, Xingce Shang, Taotao Duan, Liguang Geng, Huangfei Cha, Yu Deng
  • Patent number: 12211453
    Abstract: The present disclosure provides a driver circuit, a driving method of the driver circuit, an array substrate and a display device, belonging to the field of display technology. The driver circuit provided by the present disclosure includes a logic control module, a data pin and at least two output pins. The data pin is configured to receive driving data. The logic control module is configured to generate driving control signals in a one-to-one correspondence with the at least two output pins according to the driving data. The driving control signals are configured to control the current flowing through the corresponding output pins.
    Type: Grant
    Filed: June 21, 2021
    Date of Patent: January 28, 2025
    Assignees: BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD., BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Kaimin Yin, Wei Hao, Lingyun Shi, Wenchieh Huang, Feifei Wang, Wengang Su, Rui Shi, Xingce Shang, Junwei Zhang, Taotao Duan
  • Publication number: 20250006774
    Abstract: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.
    Type: Application
    Filed: September 13, 2024
    Publication date: January 2, 2025
    Applicant: BOE TECHNOLOGY GROUP CO., LTD.
    Inventors: Ming YANG, Wei HAO, Qibing GU, Guofeng HU, Lingyun SHI, Minghua XUAN, Can ZHANG
  • Patent number: D1058412
    Type: Grant
    Filed: April 3, 2024
    Date of Patent: January 21, 2025
    Inventor: Wei Hao
  • Patent number: D1090447
    Type: Grant
    Filed: January 15, 2025
    Date of Patent: August 26, 2025
    Assignee: Shenzhen S&J Christmas Decoration Co., Ltd
    Inventor: Wei Hao