Abstract: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes multiple ridges extending from an outside thereof and two clamps clamp two ends of the two heat dispensing plates. Each clamp includes two side plates and a flexible plate which is connected between the two side plates, two protrusions extend from two respective insides of the two side plates so as to be engaged with two holes in the two heat dispensing plates to securely connect the two heat dispensing plates. The clamps each have two hooks to hook the notches in two ends of the chip.

Abstract: A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.

Abstract: A heat dispensing unit includes two heat dispensing plates between which the memory chip is clamped. Each heat dispensing plate has a plurality of bending plates which split from an inside of each of the heat dispensing plates and each bending plate has an insertion and a hole. When connecting the two heat dispensing plates, the first insertions on one of the two heat dispensing plates are engaged with the first holes of the other heat dispending plate. The heat dispensing plates have a flange on a top thereof so as to cover the gap between the two heat dispensing plates.

Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The clamping members each have a first portion fixed to the base board and a second board which is removably connected to the first portion. The second portion is connected to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and a second heat dispensing unit is fixed on a top of the base board. The base board is connected to the first heat dispensing unit by two clamping members. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped therebetween. A base board has a first extension portion and a second extension portion extending from two ends thereof. A second heat dispensing unit is fixed on a top of the base board. A first clamping member is integrally connected to the first extension portion and a second clamping member is removably connected to the second extension portion. The first and second clamping members connect the base board to the first heat dispensing unit.

Abstract: A heat sink includes a first heat dispensing unit including multiple heat dispensing plates between which chips are clamped. A base board is connected on a top of the first heat dispensing unit and two engaging portions are connected to two ends of the base board. A second heat dispensing unit is fixed on a top of the base board. Two clamps connect the base board to the first heat dispensing unit. The second heat dispensing unit can be a fan, a water-cooling unit or an aluminum extruding member.

Abstract: A heat sink for chips includes two heat dispensing units and each heat dispensing unit includes multiple fins between which passages are defined. Each heat dispensing unit includes a flat surface defined in an inside thereof and a heat conducting member is connected to the flat surface. The chip is in contact between the two heat conducting members so that the heat generated from the chip is contacted to the heat conducting members and the fins and escapes to the air.

Abstract: A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation holes are defined through each the elongate plates and located between the fins. The memory chip is sandwiched between the first and second elongate plates of the first and second parts, and the fins of the two parts are arranged alternatively.

Abstract: A cooling device for memory chip includes a first part and a second part which is pivotably connected to the first part at a top thereof. Each of the first and second parts includes an elongate plate and fins extend from each of the elongate plates. Ventilation holes are defined through each the elongate plates and located between the fins. The memory chip is sandwiched between the first and second elongate plates of the first and second parts, and the fins of the two parts are arranged alternatively.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: An auxiliary cooling device includes two side boards with a space defined therebetween and the existed memory chips and the cooling plates on two sides of the memory chips are received in the space. A cooling fan is connected between the two side boards and sends air flows toward the memory chips and the cooling plates to remove heat via air paths defined in the inside of each side board.

Abstract: A cooling device includes a base connected on a CPU and a pipe unit 2 includes a plurality of absorbing pipes which are engaged with the base. A plurality of cooling pipes are connected to two ends of the absorbing pipes and extend upward in V-shape. Two cooling units are connected to the cooling pipes and each cooling unit includes fins and a cooling fan which generates air flows toward the fins and cooling the parts around the CPU.

Abstract: A cooling device includes two side boards and a memory device is clamped between the two side boards. A cooling unit is positioned above the two side boards by two clips and includes a plurality of fins. A heat conduction member is connected with the cooling unit and inserted into a slot defined in one of the two side boards so as to directly in contact with the memory chips of the memory device. The heat is directly conducted to the heat conduction member and can be dispensed by the fins of the cooling unit.

Abstract: A memory cooling device includes two symmetrically formed cooling foils, which sandwich a memory therebetween. The inner surfaces of the two cooling foils touch the two sides of the memory. Further, at least a folded portion formed on the cooling foils includes a buckling element and a buckling hole formed thereon. Therefore, the memory cooling device is structurally simple and easy to assemble, which can largely simplify the fabrication process thereof.

Abstract: A memory cooling device includes two symmetrically formed cooling foils, which sandwich a memory therebetween. The inner surfaces of the two cooling foils touch the two sides of the memory. Further, at least a folded portion formed on the cooling foils includes a buckling element and a buckling hole formed thereon. Therefore, the memory cooling device is structurally simple and easy to assemble, which can largely simplify the fabrication process thereof.