Abstract: A packaging tray for a hard disk drive has a plurality of positioning holes. The packaging tray includes a box body, and the box body has a plurality of frame walls and an accommodating space surrounded by the frame walls. The box body has formed a plurality of positioning posts at a bottom of the accommodating space, and the positioning posts are disposed corresponding to the positioning holes of the hard disk drive. Therefore, the hard disk drive placed in the accommodating space will not contact dust in the box body, and the hard disk drive in the box body can avoid scratching.

Abstract: A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.

Abstract: A heat sink device of solid state disk module includes a heat sink and at least one fixture. The heat sink includes a heat sink body heat conducting with the solid state disk and a pair of sliding slots disposed on the heat sink body. The fixture includes a bottom plate and a pair of side plates. The bottom plate has at least one rib, and the pair of side plates have pressing structures corresponding to the pair of the sliding slots. The pressing structure includes a flap being capable of pressing in the sliding slot and a pull-ab located at a side of the flap. The heat sink body is fixed on the solid state disk through the fixture, and an interval is maintained between the bottom plate and the solid state disk by the at least one rib.

Abstract: A hard disk includes a first cover member including a first cover plate and a pair of first lateral walls extended from edges of thereof, each of the first lateral wall is formed with a support piece and a latch hook respectively protruded towards inward, the support piece and the latch hook are not arranged at same horizontal level in a direction perpendicular to the first cover plate; a second cover member, disposed at the outer side of the first cover member and engaged with the first cover member; and a storage module, accommodated inside the first cover member and including a circuit board having edges thereof clamped between distal ends of the latch hooks and the support pieces. Accordingly, the assembly can be easily achieved through fastening the storage module in the first cover member then sleeving the first cover member and the second cover member.

Abstract: A heat dissipation unit used in a memory device includes two heat dissipation sheets, two sides at the top edge of each heat dissipation sheet are bent for respectively forming two lugs having a height difference, and two buckle pieces having a height difference between the two lugs, wherein each lug and each buckle piece of a heat dissipating sheet is mutually stacked onto a corresponding lug and buckle piece of the other heat dissipating sheet, respectively.

Abstract: A housing structure for enclosing a solid-state drive (SSD) is disclosed. The housing structure includes a housing and a height adjustment plate. The housing is used for receiving the SSD and has a plurality of engagement recesses on a surface thereof. The height adjustment plate includes a plate body having a predetermined height and a plurality of hooks formed on the plate body. The hooks correspond to the engagement recesses in position and the height adjustment plate is fastened to the housing by engaging the hooks with the engagement recesses for adjusting an overall height of the SSD.

Abstract: A solid state disk includes a circuit board and a casing. The casing comprises a first cover and a second cover. The circuit board is provided in the first cover. Each side of the first cover is provided with a plurality of first combining portions. Each side of the second cover is provided with a plurality of second combining portions at positions corresponding to those of the first combining portions respectively. The second combining portions are buckled to the first combining portions respectively. Each first combining portion has an extension section extending from the first cover. The extension section of the first combining portion extends to be buckled to the second combining portion. Thus, the first cover and the second cover cannot be detached easily. When the casing is detached, the extension section will get broken, thereby preventing undesired detachment.

Abstract: A solid state disk includes a circuit board and a casing. The casing comprises a first cover and a second cover. The circuit board is provided in the first cover. Each side of the first cover is provided with a plurality of first combining portions. Each side of the second cover is provided with a plurality of second combining portions at positions corresponding to those of the first combining portions respectively. The second combining portions are buckled to the first combining portions respectively. Each first combining portion has an extension section extending from the first cover. The extension section of the first combining portion extends to be buckled to the second combining portion. Thus, the first cover and the second cover cannot be detached easily. When the casing is detached, the extension section will get broken, thereby preventing undesired detachment.

Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

Abstract: A structure of an anti tamper case for the solid state disk includes an upper housing and a lower housing. The upper housing has an extending portion formed respectively on the two sides of the flange. The extending portion has at least one opening. The lower housing corresponds to the upper housing and a space is formed there-between for receiving the solid state disk. The lower housing has a hook formed at the flange corresponding to the opening. The hook and the opening are buckled to each other. The hook will be broken by the flange in the opening when the upper and lower housings are separated, thus prevent the user from forcefully opening the case for self maintenance or internal component replacement.

Abstract: A heat-dissipating assembly includes a first heat-dissipating body and a second heat-dissipating body adhered to two sides of the memory. The bottom edge of the first heat-dissipating body has a first supporting piece and first engaging pieces comprising a first stopping section and a first insertion section. The bottom edge of the second heat-dissipating body has a second supporting piece and second engaging pieces comprising a second stopping section and a second insertion section. The second insertion section extends toward the first insertion section. The first insertion section is slidingly disposed inside the second stopping section. The second insertion is slidingly disposed inside the first stopping section. The first stopping section abuts against the second stopping section, so that the first engaging piece and the second engaging piece are slidingly engaged with each other.

Abstract: A method for assembling memory module with heat dissipating sheet includes the flowing steps: providing a heat dissipating sheet; providing a memory module having a circuit board and at least one chip arranged on the circuit board; arranging the circuit board perpendicularly on the heat dissipating sheet; and folding at least a part of the heat dissipating sheet toward the chip and adhering the part of the heat dissipating sheet to the chip by the glue. Besides, an apparatus which the method of the present invention could perform on is also provided.

Abstract: A heat dispensing unit includes two heat dispensing plates between which the chip is clamped. Each heat dispensing plate includes two connection plates bending from two ends thereof and the two connection plates have a connection piece or a connection port so that when the two heat dispensing plates are connected to each other, the connection pieces are connected to the connection ports.