Patents by Inventor Wei Hu

Wei Hu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240168256
    Abstract: An optical element driving mechanism is provided, including a fixed portion and a movable portion. The movable portion moves relative to the fixed portion. The movable portion includes a first movable assembly and a second movable assembly. The first movable assembly is connected to a first optical element. The second movable assembly is connected to a second optical element. The first movable assembly and the second movable assembly are movable relative to each other. The fixed portion further includes a first guiding element and a second guiding element. The first guiding element guides the first movable assembly and the second movable assembly to move in a first dimension. The second guiding element guides the first movable assembly and the second movable assembly to move in the first dimension. The first guiding element and the second guiding element are located at opposite corners of the fixed portion.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Chao-Hsi WANG, Chao-Chang HU, Chih-Wei WENG
  • Publication number: 20240168985
    Abstract: One or more computing devices, systems, and/or methods are provided. In an example, a first performance metric score may be determined based upon first content item text. A plurality of similarity scores associated with a plurality of sets of content item text may be determined. One or more sets of content item text may be selected from among the plurality of sets of content item text based upon the plurality of similarity scores and a plurality of performance metric scores associated with the plurality of sets of content item text. The plurality of performance metric scores may comprise one or more performance metric scores associated with the one or more sets of content item text. The one or more performance metric scores may be higher than the first performance metric score. One or more representations of the one or more sets of content item text may be displayed.
    Type: Application
    Filed: January 30, 2024
    Publication date: May 23, 2024
    Inventors: Shaunak Mishra, Changwei Hu, Kevin Yen, Manisha Verma, Yifan Hu, Maxim Ivanovich Sviridenko, Avinash Chukka, Max Edward Beech, Chao-Hung Wang, Hua-Ying Tsai, Kamil Michal Zasadzinski, Wei Yu Lin, Yu Tian
  • Publication number: 20240171264
    Abstract: The present disclosure provides an interference processing method, an interference processing apparatus, a communication device and a storage medium. The method includes determining interference information between a non-geostationary orbit (NGSO) satellite communication system and a ground communication system in case of a presence of NGSO earth stations within a range of each of a plurality of sub-areas according to system parameters of the NGSO satellite communication system. The ground communication system includes a plurality of base stations, and an area covered by the plurality of base stations includes the plurality of sub-areas.
    Type: Application
    Filed: March 5, 2021
    Publication date: May 23, 2024
    Applicants: BEIJING XIAOMI MOBILE SOFTWARE CO., LTD., BEIJING UNIVERSITY OF POSTS AND TELECOMMUNICATIONS
    Inventors: Yajun ZHU, Wei HONG, Zeyu HU, Yong LI
  • Publication number: 20240172310
    Abstract: A user equipment (UE) is connected to a wireless network and operates in a carrier aggregation (CA) state that includes a first connection to a primary cell and a second connection to a secondary cell. The UE determines a beam failure has occurred for one of the first connection or the second connection and initiates a beam failure recovery (BFR) operation. The BFR operation includes transmitting, to the primary cell, a BFR Medium Access Control (MAC) Control Element (CE).
    Type: Application
    Filed: November 4, 2019
    Publication date: May 23, 2024
    Inventors: Fangli XU, Chunhai YAO, Clive E. RODGERS, Dawei ZHANG, Haijng HU, Haitong SUN, Wei ZENG, Yuqin CHEN, Yushu ZHANG, Zhibin WU
  • Patent number: 11991771
    Abstract: Inter-cell mobility may include decoding a first radio resource control (RRC) reconfiguration message received from a first cell. The first RRC reconfiguration message may comprise a first portion of configuration information for performing a cell change to a second cell. A cell change message received from the first cell may be decoded. The cell change message may indicate that a cell change to the second cell is to be performed. A cell change acknowledgment may be encoded for transmission to the second cell. A second RRC reconfiguration message received from the second cell may be decoded. The second RRC reconfiguration message may comprise a second portion of configuration information for performing the cell change to the second cell. The second portion of configuration information may comprise a remaining portion of configuration information to perform the cell change to the second cell.
    Type: Grant
    Filed: April 1, 2021
    Date of Patent: May 21, 2024
    Assignee: APPLE INC.
    Inventors: Fangli Xu, Chunhai Yao, Dawei Zhang, Haijing Hu, Qiming Li, Wei Zeng, Yang Tang, Yuqin Chen, Yushu Zhang
  • Publication number: 20240160894
    Abstract: A computing system is provided, including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The MoE layer includes a plurality of expert sub-models that each have a respective plurality of parameter values. The MoE layer is configured to be switchable between a data parallel mode and an expert-data-model parallel mode without conveying the respective parameter values of the expert sub-models among the plurality of processing devices.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yifan XIONG, Changho HWANG, Wei CUI, Ziyue YANG, Ze LIU, Han HU, Zilong WANG, Rafael Omar SALAS, Jithin JOSE, Prabhat RAM, Ho-Yuen CHAU, Peng CHENG, Fan YANG, Mao YANG, Yongqiang XIONG
  • Publication number: 20240158279
    Abstract: A method for manufacturing a microcrystalline glass, the microcrystalline glass manufactured according to the method, and a use thereof are provided. The method includes: (1) nucleation of a raw glass sheet, followed by primary crystallization, where: the primary crystallization temperature is x1, the primary crystallization time is t, and the primary crystallization temperature x1 and the primary crystallization time t satisfy the following conditions: first, ?a×t+652?x1??a×t+667, where a is a constant, 0.1?a?0.25, and tis 10 to 300 min; and second, y1=0.0029x1+b, where y1 is the glass density after primary crystallization, and 2.440 g/cm3?y1?2.490 g/cm3, b is a constant, and 0.55?b?0.60; and (2) secondary crystallization of the glass sheet which has been subject to primary crystallization.
    Type: Application
    Filed: January 26, 2024
    Publication date: May 16, 2024
    Applicant: CHONGQING AUREAVIA HI-TECH GLASS CO., LTD
    Inventors: Hao HUANG, Yubo WANG, Shuang DENG, Baoquan TAN, Wei HU
  • Publication number: 20240160906
    Abstract: A computing system including a plurality of processing devices configured to execute a Mixture-of-Experts (MoE) layer included in an MoE model. The processing devices are configured to execute the MoE layer at least in part by, during a first collective communication phase between the processing devices, splitting each of a plurality of first input tensors along a first dimension to obtain first output tensors. Executing the MoE layer further includes processing the first output tensors at a respective a plurality of expert sub-models to obtain a plurality of second input tensors. Executing the MoE layer further includes, during a second collective communication phase between the processing devices, receiving the second input tensors from the expert sub-models and concatenating the second input tensors along the first dimension to obtain second output tensors. Executing the MoE layer further includes outputting the second output tensors as output of the MoE layer.
    Type: Application
    Filed: November 10, 2022
    Publication date: May 16, 2024
    Applicant: Microsoft Technology Licensing, LLC
    Inventors: Yifan XIONG, Changho HWANG, Wei CUI, Ziyue YANG, Ze LIU, Han HU, Zilong WANG, Rafael Omar SALAS, Jithin JOSE, Prabhat RAM, Ho-Yuen CHAU, Peng CHENG, Fan YANG, Mao YANG, Yongqiang XIONG
  • Publication number: 20240160306
    Abstract: A display panel, including an active area and a peripheral area, which is located outside of the active area, wherein the active area comprises a base substrate, and a display structure layer and a touch structure layer sequentially arranged on the base substrate; the peripheral area includes an isolation dam, a first ground trace and a second ground trace arranged on the base substrate; and the first ground trace is located at a side of the isolation dam close to the active area, and the second ground trace is located at a side of the isolation dam away from the active area.
    Type: Application
    Filed: January 9, 2023
    Publication date: May 16, 2024
    Inventors: Chang LUO, Xiping LI, Hongwei MA, Ming HU, Wei HE, Youngyik KO, Haijun QIU, Yi ZHANG, Taofeng XIE, Tianci CHEN, Qun MA, Xinghua LI, Ping WEN, Yang ZHOU, Yuanqi ZHANG, Xiaoyan YANG, Shun ZHANG, Pandeng TANG, Yang ZENG, Tong ZHANG, Xiaofei HOU, Zhidong WANG, Haoyuan FAN, Jinhwan HWANG
  • Publication number: 20240160469
    Abstract: Embodiments of this specification provide batch scheduling-based application scheduling methods, apparatuses, and systems. In the batch scheduling-based application scheduling method, an application scheduling request is received from a client, where the application scheduling request includes description information used to indicate a chain invoking relationship between applications to be scheduled; the applications to be scheduled are grouped into at least one scheduling object group based on the chain invoking relationship, where applications to be scheduled that are located in the same scheduling object group have the same chain invoking relationship; and the applications to be scheduled are scheduled to a target node by using the scheduling object group as a unit.
    Type: Application
    Filed: November 9, 2023
    Publication date: May 16, 2024
    Inventors: Zaibin HU, Tongkai YANG, Wei WU, Hao DAI, Denghui LI, Jun DU, Zhigang WANG, Weiyu TAN
  • Publication number: 20240162966
    Abstract: A beam scanning system is provided, including an antenna module and a signal processing circuit. The antenna module includes N transmitting antennas arranged along a first direction on the first plane. Each transmitting antenna extends in a second direction on the first plane and is configured to convert electrical signals into millimeter wave electromagnetic signals. N millimeter wave electromagnetic signals sent by the N transmitting antennas form a target beam. The signal processing circuit is connected with the antenna module to control the target beam to perform two-dimensional scanning by outputting a frequency and phase controllable electrical signal to each of the N transmitting antennas. The frequency and phase of the electrical signals output to the N transmitting antennas may be adjusted by the signal processing circuit when the multiple transmitting antennas in the antenna module are only arranged in one direction.
    Type: Application
    Filed: May 30, 2023
    Publication date: May 16, 2024
    Applicant: SHENZHEN HUAYI MEDICAL TECHNOLOGIES CO., LTD
    Inventors: Yi HUANG, Yan GONG, Chaijie DUAN, Wei HU, Huajie LIN
  • Patent number: 11984410
    Abstract: A method includes forming a reconstructed wafer including encapsulating a device die in an encapsulant, forming a dielectric layer over the device die and the encapsulant, forming a plurality of redistribution lines extending into the dielectric layer to electrically couple to the device die, and forming a metal ring in a common process for forming the plurality of redistribution lines. The metal ring encircles the plurality of redistribution lines, and the metal ring extends into scribe lines of the reconstructed wafer. A die-saw process is performed along scribe lines of the reconstructed wafer to separate a package from the reconstructed wafer. The package includes the device die and at least a portion of the metal ring.
    Type: Grant
    Filed: May 5, 2023
    Date of Patent: May 14, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wan-Yu Lee, Chiang Lin, Yueh-Ting Lin, Hua-Wei Tseng, Li-Hsien Huang, Yu-Hsiang Hu
  • Patent number: 11982860
    Abstract: An optical member driving mechanism is provided. The optical member driving mechanism includes a fixed portion, a movable portion, an electromagnetic driving assembly and an elastic member. The fixed portion has a base and a frame that is disposed on the base. The movable portion is movable relative to the fixed portion, and includes a carrier for carrying an optical member with an incident optical axis. The carrier includes a body and a sidewall that extends along the edge of the body, wherein the carrier further includes a first stopping portion and a second stopping portion protruding towards the fixed portion. The electromagnetic driving assembly drives the movable portion to move relative to the fixed portion. The movable portion is movably connected to the fixed portion via the elastic member.
    Type: Grant
    Filed: April 8, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chia-Che Wu, Sung-Mao Tsai, Chao-Chang Hu, Che-Wei Chang, Chen-Hsien Fan, Chih-Wei Weng
  • Patent number: 11985822
    Abstract: A memory device is provided. The memory device includes a stacked structure, a tubular element, a conductive pillar and memory cells. The tubular element includes a dummy channel layer and penetrates the stacked structure. The conductive pillar is enclosed by the tubular element and extending beyond a bottom surface of the dummy channel layer. The memory cells are in the stacked structure and electrically connected to the conductive pillar.
    Type: Grant
    Filed: September 2, 2020
    Date of Patent: May 14, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Teng-Hao Yeh, Chih-Wei Hu, Hang-Ting Lue, Guan-Ru Lee
  • Patent number: 11985077
    Abstract: Systems and methods for routing communication among a plurality of devices are described. In an example, a controller can detect a communication initiated from a first device to a target device among a second device and a third device. The controller can identify the second device as the target device. The controller can, in response to identifying the second device as the target device, activate a direct communication path between the first device and the second device to allow the first device to communicate with the second device using direct communication mode. The controller can, in response to identifying the second device as the target device, activate redriver path between the first device and the third device to allow the first device to communicate with the third device using redriver mode.
    Type: Grant
    Filed: May 11, 2021
    Date of Patent: May 14, 2024
    Assignee: Renesas Electronics America Inc.
    Inventors: Shubing Zhai, James Wang, Jankin Hu, Wei Wang
  • Publication number: 20240153913
    Abstract: A 3D stacked packaging structure and a manufacturing method thereof are provided. The 3D stacked packaging structure includes a bottom-layer structure and a top-layer structure stacked thereon. The bottom-layer structure and the top-layer structure each include: a substrate layer; a diamond layer grown on the substrate layer; an ion-implanted silicon wafer layer attached to the diamond layer; and a component layer provided on the silicon wafer layer, with the four layers stacked together in sequence, wherein the substrate layer of the top-layer structure is in contact with the component layer of the bottom-layer structure, and at least one through hole provided between the bottom-layer structure and the top-layer structure, extends through the component layer, the ion-implanted silicon wafer layer, the diamond layer, and the substrate layer of the top-layer structure, and extends through the component layer of the bottom-layer structure, and is filled with a conductive material.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 9, 2024
    Applicant: INSTITUTE OF SEMICONDUCTORS, GUANGDONG ACADEMY OF SCIENCES
    Inventors: Yinhua CUI, Wei ZHENG, Yao WANG, Zhikuan CHEN, Chuan HU, Zhitao CHEN, Chang'an WANG
  • Publication number: 20240155501
    Abstract: Embodiments are presented herein of apparatuses, systems, and methods for a user equipment device (UE) to perform power control for uplink (UL) reference signals (RS). A UE may determine spatial configuration for UL RS based on another communication. A UE may determine an updated pathloss within a reduced implementation following an update of downlink (DL) RS. A UE may reset a power control factor in response to receiving an update.
    Type: Application
    Filed: November 15, 2023
    Publication date: May 9, 2024
    Inventors: Yushu Zhang, Chunhai Yao, Dawei Zhang, Fangli Xu, Haijing Hu, Haitong Sun, Hong He, Wei Zeng, Yakun Sun, Yuchul Kim, Yuqin Chen
  • Publication number: 20240153899
    Abstract: A method includes polishing a semiconductor substrate of a first die to reveal first through-vias that extend into the semiconductor substrate, forming a dielectric layer on the semiconductor substrate, and forming a plurality of bond pads in the dielectric layer. The plurality of bond pads include active bond pads and dummy bond pads. The active bond pads are electrically coupled to the first through-vias. The first die is bonded to a second die, and both of the active bond pads and the dummy bond pads are bonded to corresponding bond pads in the second die.
    Type: Application
    Filed: January 12, 2024
    Publication date: May 9, 2024
    Inventors: Hsien-Wei Chen, Ming-Fa Chen, Chih-Chia Hu
  • Publication number: 20240152006
    Abstract: A pixel electrode (30), a pixel structure (001) comprising the pixel electrode (30), a display panel (00) and a display device, relating to the field of display technology. The pixel electrode (30) comprises a strip-shaped first electrode (301) and a plurality of strip-shaped second electrodes (302), each of the second electrodes (302) being connected to the first electrode (301), and the plurality of second electrodes (302) being arranged along an extending direction of the first electrode (301). Compared with the second electrodes (302), the first electrode (301) has a longer length and a wider width. As the width of the first electrode (301) is relatively wide, even if the length thereof is relatively long, the first electrode (301) is not prone to fracture.
    Type: Application
    Filed: April 8, 2021
    Publication date: May 9, 2024
    Inventors: Yuanhui GUO, Wei ZHANG, Xia SHI, Yujie GAO, Yang HU
  • Publication number: 20240150857
    Abstract: Disclosed are a method and a device for power allocation in a carbon dioxide incubator, and a carbon dioxide incubator. The method for power allocation in a carbon dioxide incubator provided with heating wires on multiple inner surfaces of the carbon dioxide incubator includes: according to a current temperature and a target temperature of a box body of the carbon dioxide incubator, determining a power index; in case where the current temperature is less than or equal to the target temperature, according to the power index, determining a heating strategy for each inner surface of the carbon dioxide incubator by looking up a table; and according to the heating strategy for each inner surface, adjusting at least one or more of the power and/or the start-stop time of the heating wires on each inner surface.
    Type: Application
    Filed: June 21, 2022
    Publication date: May 9, 2024
    Applicants: QINGDAO HAIER BIOMEDICAL TECHNOLOGY CO., LTD., QINGDAO HAIER BIOMEDICAL CO., LTD.
    Inventors: Huan CHEN, Zhanjie LIU, Haitao CHEN, Xianshuang TANG, Wei HU, Yuantong XIA, Zepeng DUAN, Huanwen JU