Patents by Inventor Wei Ji

Wei Ji has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7586746
    Abstract: A heat dissipating device used for dissipating heat from a heat generating device (100) in a computer. The heat dissipating device includes a fan bracket (20), a fan (27) received in the fan bracket, and an air duct (50). The fan bracket defines a fan opening (25), and has a supporting member (233). The supporting member has a flat board (2333). A pair of retaining portions (2335) is formed on opposite edges of the flat board respectively. The flat board defines a retaining hole (2337) therein. The air duct defines an airflow passageway and has a top wall (51) and two opposite sidewalls extending from the top wall. A securing member (553) extends from one of the sidewalls is retained between the two retaining portions. A post (5535) protruding from the securing member is engaged in the retaining hole for cooperatively retaining the air duct to the fan bracket.
    Type: Grant
    Filed: September 12, 2007
    Date of Patent: September 8, 2009
    Assignees: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd., Hon Hai Precision Industry Co., Ltd.
    Inventor: Wei-Ji Liu
  • Publication number: 20090040713
    Abstract: A server enclosure includes a chassis having a sidewall, a securing bracket secured to the chassis, a receiving member attached to the securing bracket, and a switch module for powering the server on/off. The securing bracket includes a first sidewall and a second sidewall perpendicularly extending therefrom. The receiving member is secured to the second sidewall of the securing bracket and includes a first sidewall abutting the first sidewall of the securing bracket. The switch module includes a printed circuit board. The switch module is received in the receiving member with the printed circuit board parallel to the first sidewall thereof. The second sidewall of the securing bracket abuts on the receiving member to enclose the switch module therein.
    Type: Application
    Filed: September 12, 2007
    Publication date: February 12, 2009
    Applicants: HONG FU JIN PRECISION INDUSTRY (SHENZHEN) CO., LTD, HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-JI LIU
  • Publication number: 20090040717
    Abstract: A heat dissipating device used for dissipating heat from a heat generating device (100) in a computer. The heat dissipating device includes a fan bracket (20), a fan (27) received in the fan bracket, and an air duct (50). The fan bracket defines a fan opening (25), and has a supporting member (233). The supporting member has a flat board (2333). A pair of retaining portions (2335) is formed on opposite edges of the flat board respectively. The flat board defines a retaining hole (2337) therein. The air duct defines an airflow passageway and has a top wall (51) and two opposite sidewalls extending from the top wall. A securing member (553) extends from one of the sidewalls is retained between the two retaining portions. A post (5535) protruding from the securing member is engaged in the retaining hole for cooperatively retaining the air duct to the fan bracket.
    Type: Application
    Filed: September 12, 2007
    Publication date: February 12, 2009
    Applicants: HON FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: WEI-JI LIU
  • Publication number: 20080295009
    Abstract: The present invention provides a method and apparatus for capturing graphic user interface resource of an application, which method comprises: loading resource files in which visible text data in graphic user interfaces of the application are stored; duplicating the resource files; adding identification information to each visible text data unit in the resource files, the identification information being used to uniquely identify each visible text data unit in each of the resource files; capturing at least one panel of graphic user interface according to the graphic user interfaces of the application; and saving the duplicated resource files and the at least one captured panel as the graphic user interface resource of the application into an intermediate file.
    Type: Application
    Filed: January 14, 2008
    Publication date: November 27, 2008
    Inventors: Xing Jiang Huang, Wei Ji Shi, Jun Yin
  • Patent number: 7404310
    Abstract: A mandrel assembly is provided for insertion into a hollow tube to support the interior walls of the tube during bending of the tube in a tube bending apparatus. The mandrel assembly includes at least one mandrel segment that is adapted for positioning within the tube and has an exterior support surface for supporting the interior walls of the tube during bending. The mandrel segment is anchored at a fixed axial location within the tube by an anchoring device that is radially expandable and retractable between an expanded condition in which an anchor shoe is engaged with the interior wall of the tube and a retracted condition in which the anchor shoe is loose within the tube. A mandrel support rod is attached to the anchoring device for inserting and withdrawing the anchoring device into the tube when the anchor shoe is retracted.
    Type: Grant
    Filed: January 10, 2007
    Date of Patent: July 29, 2008
    Assignee: GM Global Technology Operations, Inc.
    Inventors: Mike M. Ghiran, Wei Ji, Paul D. Larsen, David R. Jensen
  • Publication number: 20080163666
    Abstract: A mandrel assembly is provided for insertion into a hollow tube to support the interior walls of the tube during bending of the tube in a tube bending apparatus. The mandrel assembly includes at least one mandrel segment that is adapted for positioning within the tube and has an exterior support surface for supporting the interior walls of the tube during bending. The mandrel segment is anchored at a fixed axial location within the tube by an anchoring device that is radially expandable and retractable between an expanded condition in which an anchor shoe is engaged with the interior wall of the tube and a retracted condition in which the anchor shoe is loose within the tube. A mandrel support rod is attached to the anchoring device for inserting and withdrawing the anchoring device into the tube when the anchor shoe is retracted.
    Type: Application
    Filed: January 10, 2007
    Publication date: July 10, 2008
    Applicant: GM Global Technology Operations, Inc.
    Inventors: Mike M. Ghiran, Wei Ji, Paul D. Larsen, David R. Jensen
  • Publication number: 20070093631
    Abstract: The thermoplastic polyurethane molding of the present invention is obtained by melting, molding, cooling and solidifying, subsequently heating to a temperature T1 (specifically, 180 to 190° C) that is not more than flow starting temperature Tm and not less than glass transition point Tg and cooling down quickly to a temperature T2 (Tm>T1>T2>Tg, specifically, 160 to 165° C.). In dynamic viscoelasticity measurement, the difference between the temperature at which LogE? turns 4.5 MPa and the peak temperature of tan ? is 190 to 225° C.
    Type: Application
    Filed: April 19, 2004
    Publication date: April 26, 2007
    Inventors: Koji Nishida, Toshiji Kanaya, Takehiko Sugimoto, Wei Ji, Toshiaki Kasazaki
  • Patent number: 7084054
    Abstract: A method and apparatus for etchback profile control. The method includes performing a first etch through a first dielectric layer to form a first via and a second dielectric layer, filling the first via with a BARC material to form a first BARC layer, and performing a second etch on the first BARC layer to form a second BARC layer. The second etch has a first etch rate in a first peripheral region of the second BARC layer and a second etch rate in a first central region of the second BARC layer. The first peripheral region is located around a sidewall of the first via, and the first central region is located around a center of the first via. The first etch rate is larger than the second etch rate, and the first peripheral region is located higher than the first central region. A first top surface of the second BARC layer has substantially a first convex shape. Additionally, the method includes performing a third etch through a second dielectric layer to form a trench and a third BARC layer.
    Type: Grant
    Filed: February 6, 2004
    Date of Patent: August 1, 2006
    Assignee: Semiconductor Manufacturing International (Shanghai) Corporation
    Inventors: Han Ming Wu, Eric Kuang, Wei Ji Song