Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a semiconductor substrate, active devices and transparent conductive patterns. The active devices are formed on the semiconductor substrate. The transparent conductive patterns are formed over the active devices and electrically connected to the active devices. The transparent conductive patterns are made of a metal oxide material. The metal oxide material has a first crystalline phase with a prefer growth plane rich in oxygen vacancy, and has a second crystalline phase with a prefer growth plane poor in oxygen vacancy.

Abstract: A clip and base assembly includes at least one polymeric clip and a base. The clip includes first and second elastic arms, and a support arm. The clip forms an aperture therein. The first and second elastic arms move between first and second positions. The first and second elastic arms are located on opposing sides with the support arm in between. The base includes a first and second sets of notches, and an elongated slot. The first set of notches is sized and shaped to receive the first elastic arm. The second set of notches is sized and shaped to receive the second elastic arm. When the first and second elastic arms are in the second position, the clip is moveable in the elongated slot. When the first and second elastic arms are in the first position, the clip is fixed respect to the base.

Abstract: Disclosed is a lamp, including a lamp body in a trough shape, a light source assembly, and a heat dissipation assembly; where, the heat dissipation assembly includes an aluminum plate, a heat dissipation fin and a glass radiator; the aluminum plate is disposed on a trough wall of the lamp body; the heat dissipation fin is disposed on a side of the aluminum plate; the glass radiator is disposed on a side of the aluminum plate; the light source assembly includes a PCB board and a plurality of LED lamp beads; the PCB board is disposed on a side of the glass radiator; and the plurality of LED lamp beads are arranged on a side of the PCB board forming a light emitting surface.

Abstract: The embodiments of the present disclosure provide a liquid crystal display device. The liquid crystal display device includes: a display panel, including a display region and a non-display region surrounding the display region; a back plate, arranged opposite to the display panel, where the back plate comprises a bottom wall and a side wall extending from the bottom wall to one side of the display panel; a backlight source, arranged between the display panel and the back plate, where the backlight source comprises a light source arranged on the bottom wall of the back plate and a diffusion plate arranged on a light emitting side of the light source; and a middle frame, where the middle frame comprises a first support part, and a second support part connected with one side, deviating from the display panel, of the first support part.

Abstract: A system and method for chemical mechanical polishing (“CMP”) pad replacement on a CMP processing tool. A platen carrier having two or more platens is positioned within a platen cleaning process module. Each platen includes a CMP pad affixed thereto, and is capable of being independently rotated during operations. When a pad requires replacement, the platen carrier rotates towards a pad tearer tool, which extends and pivots to remove the used pad from the platen as the carrier rotates. A pad tape replacement module is positioned above the CMP tool with pad tape extending from a supply roll to a recycle roll. As the pad tape transits through the module, a backing of the tape is separated and recycled. A pad disposed in the pad tape is then applied to a platen via a pressure roller.

Abstract: An energy storage device and a method thereof for supplying power are provided. Control a power conversion circuit to lower an AC output voltage during a preset period to a preset voltage, control the power conversion circuit to change from outputting the preset voltage to outputting a surge voltage, so that the power conversion circuit enters a surge generation period, and determine whether to turn off the energy storage device according to whether an output terminal of the power conversion circuit generating a surge current during the surge generation period.

Abstract: An energy storage device and a method thereof are provided. The power transfer circuit transfers a DC voltage provided by a battery module into an AC output voltage to provide the AC output voltage to an output end of the power transfer circuit for providing power to a load. When the AC output voltage is at a default phase, the power transfer circuit is disabled in a default period, and whether the energy storage device may be shut down is determined according to a voltage difference of the AC output voltage sensed by a sensing circuit during the default period.

Abstract: A composition and method for durable odor control on a textile are provided. The composition contains benzoic acid; a salt of benzoic acid; non-benzoic acid, a salt of non-benzoic acid, or a combination thereof. The composition may further contain an optional binder. Methods of application of the composition include padding and exhaustion.

Abstract: A semiconductor device includes semiconductor dies and a redistribution structure. The semiconductor dies are encapsulated in an encapsulant. The redistribution structure extends on the encapsulant and electrically connects the semiconductor dies. The redistribution structure includes dielectric layers and redistribution conductive layers alternately stacked. An outermost dielectric layer of the dielectric layers further away from the semiconductor dies is made of a first material. A first dielectric layer of the dielectric layers on which the outermost dielectric layer extends is made of a second material different from the first material. The first material includes at least one material selected from the group consisting of an epoxy resin, a phenolic resin, a polybenzooxazole, and a polyimide having a curing temperature lower than 250° C.

Abstract: A method for fabricating a metal-insulator-metal (MIM) capacitor is provided. The MIM capacitor includes a substrate, a first metal layer, a deposition structure, a dielectric layer and a second metal layer. The first metal layer is disposed on the substate and has a planarized surface. The deposition structure is disposed on the first metal layer, and at least a portion of the deposition structure extends into the planarized surface, wherein the first metal layer and the deposition structure have the same material. The dielectric layer is disposed on the deposition structure. The second metal layer is disposed on the dielectric layer.

Abstract: A spinning reel includes a reel body, a handle shaft rotatably supported with respect to the reel body, a spool shaft movably supported in a front-rear direction with respect to the reel body, a reciprocator including a first gear configured to rotate in a first direction of rotation in conjunction with rotation of the handle shaft, a second gear including a gear body configured to mesh with the first gear and a first boss portion protruding from the gear body and configured to rotate in a second direction of rotation opposite to the first direction of rotation, and a slider mounted on the spool shaft and including an engagement groove with which the first boss portion is configured to engage, and a limiter disposed between the reel body and the second gear and being configured to limit rotation of the second gear in the first direction of rotation.

Abstract: Methods, systems, and apparatus are described for transferring application data. In one aspect, a method includes causing, by a first component on a first device to establish a wireless connection with a second device; receiving, from a second component on the second device, data specifying one or more applications that are installed on the second device and supported by the second component, each of the applications being separate from the second component; determining, by the first component, that a first application installed on the first device matches one of the applications installed on the second device, the first application being separate from the first component; receiving, by the first component, first application data from the first application; and causing, by the first component, the first device to send the first application data to the second component running on the second device using the wireless connection.

Abstract: A testing method for determining radiation performance of a device under test (DUT) is disclosed. The testing method comprises the following steps. The DUT is arranged at a first orientation. A first effective isotropic radiated power (EIRP) and a first effective isotropic sensitivity (EIS) of the DUT are measured at the first orientation. The DUT is arranged at a second orientation different from the first orientation, and a second EIRP of the DUT is measured at the second orientation. A second EIS of the DUT is measured at the second orientation according to a correlation between the first EIRP, the first EIS and the second EIRP.

Abstract: A semiconductor package has central region and peripheral region surrounding central region. The semiconductor package includes dies, encapsulant, and redistribution structure. The dies include functional die and first dummy dies. Functional die is disposed in central region. First dummy dies are disposed in peripheral region. Redistribution structure is disposed on encapsulant over the dies, and is electrically connected to functional die. Vacancy ratio of central region is in the range from 1.01 to 3.00. Vacancy ratio of the peripheral region is in the range from 1.01 to 3.00. Vacancy ratio of central region is a ratio of total area of central region to total area occupied by dies disposed in central region. Vacancy ratio of peripheral region is a ratio of total area of peripheral region to total area occupied by first dummy dies disposed in peripheral region.

Abstract: The present application discloses a light-emitting device comprising a light-emitting unit and a flexible carrier supporting the light-emitting unit. The light-emitting unit comprises a LED chip, a first reflective layer on the LED chip and an optical diffusion layer formed between the first reflective layer and the LED chip.

Abstract: During operation, the system obtains a first embedding produced by an embedding model from an input string representing an entity and a hierarchy of clusters of embeddings generated by the embedding model from a set of standardized entities. Next, the system searches the hierarchy of clusters for a subset of the embeddings that are within a threshold proximity to the first embedding in a vector space. The system then calculates embedding match scores between the input string and a first subset of the standardized entities represented by the subset of the embeddings based on distances between the subset of the embeddings and the first embedding in the vector space. Finally, the system modifies, based on the embedding match scores, content outputted in response to the input string within a user interface of an online system.

Abstract: A semiconductor device includes a die, an encapsulant over a front-side surface of the die, a redistribution structure on the encapsulant, a thermal module coupled to the back-side surface of the die, and a bolt extending through the redistribution structure and the thermal module. The die includes a chamfered corner. The bolt is adjacent to the chamfered corner.

Abstract: A method includes forming a metal seed layer over a first conductive feature of a wafer, forming a patterned photo resist on the metal seed layer, forming a second conductive feature in an opening in the patterned photo resist, and heating the wafer to generate a gap between the second conductive feature and the patterned photo resist. A protection layer is plated on the second conductive feature. The method further includes removing the patterned photo resist, and etching the metal seed layer.