Abstract: Systems and methods are provided to provide a steering indicator to a driver of a vehicle. It is determined whether a first obstacle is in a forward path of the vehicle and whether a second obstacle is present at a side of the vehicle. In response to (a) determining the first obstacle is in the forward path and (b) determining whether the second obstacle is present at the one or more sides of the vehicle, a suggested steering action indicator indicating one or more movements for the vehicle to avoid the first obstacle is provided to a user interface of the vehicle.

Abstract: Systems and methods are provided to provide a steering indicator to a driver of a vehicle. It is determined whether a first obstacle is in a forward path of the vehicle and whether a second obstacle is present at a side of the vehicle. In response to (a) determining the first obstacle is in the forward path and (b) determining whether the second obstacle is present at the one or more sides of the vehicle, a suggested steering action indicator indicating one or more movements for the vehicle to avoid the first obstacle is provided to a user interface of the vehicle.

Abstract: A multi-modal navigation system for a vehicle is disclosed. The navigation system is configured to determine a multi-modal route including a driving route to a driving destination and a pedestrian route to a pedestrian destination from the driving destination. Turn-by-turn driving navigation for the driving route is provided, and data for the pedestrian route is provided to a mobile device such that turn-by-turn pedestrian navigation for the pedestrian route is enabled via the mobile device.

Abstract: Systems and methods are provided to provide a steering indicator to a driver of a vehicle. It is determined whether a first obstacle is in a forward path of the vehicle and whether a second obstacle is present at a side of the vehicle. In response to (a) determining the first obstacle is in the forward path and (b) determining whether the second obstacle is present at the one or more sides of the vehicle, a suggested steering action indicator indicating one or more movements for the vehicle to avoid the first obstacle is provided to a user interface of the vehicle.

Abstract: Systems and methods are provided to provide a steering indicator to a driver of a vehicle. It is determined whether a first obstacle is in a forward path of the vehicle and whether a second obstacle is present at a side of the vehicle. In response to (a) determining the first obstacle is in the forward path and (b) determining whether the second obstacle is present at the one or more sides of the vehicle, a suggested steering action indicator indicating one or more movements for the vehicle to avoid the first obstacle is provided to a user interface of the vehicle.

Abstract: A device captures a digital image of a color of interest and a physical color calibration chart. A corrected color value of the color of interest is determined based on the physical color calibration chart and the color of interest as captured within the digital image. A selected color value for the corrected color value is determined, as a closest color value within a predetermined color space or as a spot color value within the predetermined color space.

Abstract: In the present disclosure techniques related to display of device independent color differences are described. In examples, a color comparison graphical user interface (GUI) is operated. The GUI displays a color of a sample object. Further, the GUI displays a color of a reference object. Further, the GUI displays a device independent color difference between the sample color and the reference color.

Abstract: A portable image capture and camera device is provided including a device body, and an upper panel displaceably engaged to the body, and having an image capture module disposed thereon. A lower panel is also displaceably engaged to the body, for receiving and supporting a subject when the lower panel is deployed to an open position. The upper panel is translatable to deploy from a stowed position to a first deployed position to image a subject disposed on the lower panel (card reader mode), and to a second deployed position to image objects remote from the device (camera mode).

Abstract: A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: A memory card assembly with a simplified structure. The memory card assembly has a memory card assembly a printed wiring board substrate and at least one integrated circuit unit mounted and electrically connected to the printed wiring board substrate. A rigid ring is fitted over a periphery of the printed wiring board substrate to encircle the integrated circuit die therein. Thereby, a dam with an open top is constructed over the printed wiring board substrate. A filler resin material is then filled within the open dam to cover the printed wiring board substrate and integrated circuit unit.

Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.

Abstract: A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Abstract: Provided is a memory device comprising a circuit assembly including a flexible substrate and at least one flash memory chip mounted thereupon. The flexible substrate has upper and lower surfaces and a flash memory chip is preferably mounted on at least one the upper and lower surfaces. The flash memory chip may be configured as one of a thin small outline package (TSOP) package device, a very very small outline package (WSOP) package device, and a chip on board (COB) device. The memory device may further comprise a hollow housing body having a hollow interior compartment sized and configured to receive the circuit assembly therewithin. A universal series bus (USB) connector may be mounted on a free end of the flexible substrate and is preferably configured to electrically connect the memory device to an electric device.

Abstract: A method of fabricating a chip may include the step of providing a first electrical part. The method may also include the step of forming a shell with the first electrical part embedded in a first side portion of the shell and a cavity in a second side portion of the shell. The method may include the step of testing the embedded first electrical part to determine whether the first electrical part is defective or functional. The method may also include the steps of providing a second electrical part, inserting the second electrical part within the cavity of the shell second side portion, establishing electrical communication between the first and second electrical parts if a test result of the first electrical part indicates that the first electrical part is functional, and finishing the chip. Also, the method may include the step of rejecting the first electrical part if the test result of the first electrical part indicates that the first electrical part is defective.

Abstract: A memory card comprising a substrate, a memory die on top of the memory die, a controller die on top of the memory die; and a interposer surrounding the controller die and on top of the memory die wherein the interposer allows for wire bonding to the substrate to be minimized. A system and method in accordance with the present invention achieves the following objectives: (1) increase the density of the Flash card by reducing the number of wire bond pads on the substrate and enabling insertion of the largest die possible that can fit inside a given card interior boundary; (2) more efficiently stacks Flash memory dies when stacking is necessary, to increase density of the Flash card; (3) has only a few necessary signal I/O bonding wires to the substrate to improve production yield.

Abstract: A portable image capture and camera device is provided including a device body, and an upper panel displaceably engaged to the body, and having an image capture module disposed thereon. A lower panel is also displaceably engaged to the body, for receiving and supporting a subject when the lower panel is deployed to an open position. The upper panel is translatable to deploy from a stowed position to a first deployed position to image a subject disposed on the lower panel (card reader mode), and to a second deployed position to image objects remote from the device (camera mode).

Abstract: A dual in-line memory module (DIMM) and a digital flash card are disclosed including an internal, built-in RFID tag in which identification and product information is contained. The RFID tag has an RF integrated circuit chip and antenna traces spreading outwardly therefrom to permit access to the information contained by the RF chip. In the case of a DIMM, the RF integrated circuit chip and its antenna traces are located on top of or between the layers of a multi-layer laminated printed wiring board substrate. In the case of a digital flash card, the RF integrated circuit chip and its antenna traces are preferably located on top of a multi-layer printed wiring board substrate and then encapsulated within a molded cover. In the alternative, the RF chip and its antenna traces are attached to the inside of a cover that extends over and is spaced above the printed wiring board substrate.

Abstract: A data storage device and methods of manufacture are provided which tend to protect the device against moisture and shock. The device includes a circuit board, a coating, a housing, and preferably a sealant. The circuit board is in electrical communication with an electrical interface. The coating is disposed at least on the circuit board to generally encapsulate the circuit board. The housing is sized and configured to generally encompass the circuit board and the coating. The housing includes a housing opening being sized and configured with the electrical interface being at least partially exposed therethrough. The sealant is preferably disposed within the housing substantially intermediate the interior surface of the housing and the coating on the circuit board. Further, at least one of the coating and the sealant may be disposed substantially intermediate the electrical interface and the housing opening.