Abstract: An integrated liquid-cooled temperature equalization module includes a top cover and a temperature equalization plate. The top cover includes a first flow channel, a second flow channel, a passage connecting the first and second flow channels, an inlet connecting the first flow channel for coolant flowing into the top cover, and an outlet connecting the second flow channel for coolant flowing out of the top cover. The temperature equalization plate includes a main body having a cooling zone, a tin soldering surface, and a protrusion; a first heat sink unit mounted on the cooling zone and accommodated in the first flow channel; a second heat sink unit mounted on the cooling zone and accommodated in the second flow channel; and an internal support structure accommodated in the protrusion. Accordingly, heat dissipation efficiency of the present disclosure is improved and made more uniform.

Abstract: A high-precision measurement system is disclosed. The high-precision measurement system includes a data collection circuit, a machine learning circuit, and an output circuit. The data collection circuit is configured to obtain several first output data corresponding to several first setting data. The machine learning circuit is configured to create a machine learning model according to the several first setting data, the several first output data, and several first correction parameters between the several first setting data and the several first output data, and the machine learning circuit is configured to generate a second correction parameter corresponding to a second setting data according to the machine learning model. The output circuit is configured to correct a second output data corresponding to the second setting data to generate a corrected output data according to the second correction parameter.

Abstract: Disclosed in the present invention are a crystal form of a class of 7-azaspiro [4,5] decane-6,10-dione compounds and a preparation method therefor. Specifically disclosed are a method for preparing a compound of formula (I) and a crystal form thereof and the use of the compound and the crystal form thereof.

Abstract: A power component submount includes a ceramic substrate, a sputtering layer formed on the ceramic substrate, a conductive block formed on the sputtering layer, and three electroless plating layers that are sequentially stacked on the conductive block. The sputtering layer includes an electroplating portion. The conductive block is formed on the electroplating portion, and bottoms of the three electroless plating layers are connected to the ceramic substrate. Materials of the three electroless plating layers are gold, palladium, and gold, respectively; or, materials of the three electroless plating layers are nickel, palladium, and gold, respectively. One of the three electroless plating layers arranged away from the conductive block is provided for allowing a power component to be mounted thereon.

Abstract: A moving device, applied in a nucleic acid extraction system and cooperated with a plurality of microtube components, the moving device includes: a workbench; a moving component, disposed on the workbench; a control element, disposed on the moving component and electrically connected to the moving component; a first motor, disposed on the moving component and electrically connected to the control element; a first rotating rod, connected to the first motor; a second motor, disposed on the moving component and electrically connected to the control element; a second rotating rod, connected to the second motor; and a telescopic component, disposed on the moving component corresponding to the first rotating rod and the second rotating rod, electrically connected to the control element, and movable between a first position and a second position.

Abstract: A transmission connecting structure for hand tools has a tool bit rod. The tool bit rod has a polygonal rod member comprising an operating end at a front end and an insertion end at a rear end, the rod member further comprising a fastening section adjacent to the insertion end and a covering member between the operating end and the fastening section; the covering member further comprising a polygonal main body with an engaging groove at a front section and an enlarged stopping portion at a front end.

Abstract: A light emitting diode package structure and a method for manufacturing the same are provided. The LED package structure includes a substrate having a first and a second surface opposite to each other, a conductive structure including a first and a second conductive structure electrically connected with each other, a first gold layer disposed on the first conductive structure, a second gold layer disposed on the second conductive structure, an LED chip disposed on the first gold layer, and a package layer disposed on the first surface and encapsulating the first conductive structure, the first gold layer, and the LED chip. The first conductive structure is disposed on the first surface. The second conductive structure is disposed on the second surface. A thickness of the first gold layer is greater than 1 ?m. The second conductive structure is completely covered by the second gold layer.

Abstract: A torque adjustment tool has an inner tube having a front tuning handle on the screw assembly, a spring, an upper toothed block, a lower toothed block, a plurality of balls, a central axis and an adjusting unit. The upper toothed block has a through hole at the center, and there are multiple ball slots arranged in a ring shape on one end surface. The lower toothed block has a polygonal through hole at the center.

Abstract: An image recognition system for a neural network and an image preprocessing method are provided. The image recognition system includes a memory, an image sensor, a preprocessing circuit, and a neural network processing member. The image sensor is configured to obtain an image that includes a plurality of pixels. The preprocessing is configured to classify each pixel based on the division criterion and the rotation angle as belonging to at least one of the target sub-images, and calculate a memory address corresponding to the pixel in the target sub-image to which the pixel belongs, so as to sequentially store the plurality of target sub-images in the memory. The neural network processing member is configured to retrieve one of the stored target sub-images from the memory for recognition.

Abstract: A circuit board structure is provided. The circuit board structure includes a substrate, a solder mask coupler, a supporter, and a chip. The substrate has a conductive structure. The solder mask coupler is disposed on the substrate. The supporter contacts the solder mask coupler, and the supporter is fixed on the substrate via the solder mask coupler. The chip is disposed on the substrate, and the chip is electrically connected with the conductive structure.

Abstract: A ceramic substrate and a method for manufacturing the same are provided. The ceramic substrate includes a spheroidal aluminum nitride powder, a plate-shaped aluminum nitride powder, a boron nitride powder, and an yttrium oxide powder. A percentage by weight of the spheroidal aluminum nitride powder ranges between 63% and 90%. A percentage by weight of the plate-shaped aluminum nitride powder ranges between 0.05% and 30%. A percentage by weight of the boron nitride powder ranges between 0.05% and 2%. A percentage by weight of the yttrium oxide powder ranges between 0.05% and 5%. The method includes a tape casting operation and a primary and pressureless sintering process.

Abstract: A junction field effect transistor device includes a substrate, a well region, a first top layer, a plurality of source/drain regions, a first isolation structure, a gate, and a plurality of first well slots. The substrate has a first conductivity type. The well region is embedded in the substrate. The well region has a second conductivity type. The first top layer is embedded in the well region. The first top layer has the first conductivity type. The source/drain regions are disposed on a top surface of the well region. The first isolation structure is adjacent to one of the source/drain regions. The gate is disposed on a top surface of the first top layer. The first well slots are disposed below the gate. A second-conductivity-type dopant concentration of the first well slots is lower than a second-conductivity-type dopant concentration of the well region.

Abstract: The present disclosure provides a micro light emitting diode display including a metal substrate, a plurality of micro light emitting diode chips on the metal substrate, a plurality of light absorbing layers on the metal substrate between the micro light emitting diode chips, a light conversion layer above the micro light emitting diode chips, and a cover plate above the light conversion layer, where sidewalls of the micro light emitting diode chips are separated by a gap, and where a contact angle of the light absorbing layers is between 0 degree and 30 degrees.

Abstract: A clamping device is applied to a cover of a container and comprises a first gear plate having a first rail hole, a second gear plate having a second rail hole, a guiding plate configured between the first gear plate and the second gear plate and having a guiding slot, a first motor, a second motor and a clamp assembly. The first motor is configured to drive the first gear plate to rotate. The second motor is configured to drive the second gear plate to rotate. The clamp component of the clamp assembly is disposed in the first rail hole, the second rail hole and the guiding slot and configured to contact the cover. The first motor and the second motor drive the first gear plate and the second gear plate to rotate in opposite directions and drive the clamp component to move inwardly for clamping the cover.

Abstract: The present disclosure discloses a differential inductor circuit is provided that includes a first coil inductor and a second coil inductor. The first coil inductor is coupled to a first terminal and starts to extend for a first half circle and further extend to surround an central area for N first full circles to be coupled to a second terminal, wherein N is an integer larger than or equal to 0. The second coil inductor is coupled to a third terminal to and starts to extend for a second half circle and further extend to surround the central area for N second full circles to be coupled to a fourth terminal, in which the second half circle and the first half circuit together enclose the central area.

Abstract: An electronic device and a method for determining medical images are provided. The method includes: obtaining an input image; inputting the input image into a first machine learning model to generate a labeled image, wherein the labeled image includes a plurality of area images; inputting the labeled image into a second machine learning model to generate a plurality of area determination data corresponding to the plurality of area images; and displaying a determination result including the plurality of area determination data.

Abstract: A method for manufacturing a conductive circuit board includes the steps of: preparing a substrate having opposite upper and lower surfaces, and at least one via hole extending through the upper and lower surfaces and defined by an inner surface; forming a compound metal layer on at least one of the upper surface and the lower surface of the substrate and on the inner surface; etching the compound metal layer by a laser beam, so that a patterned metal circuit layer having a predetermined pattern formed on the substrate; and forming a surface finish layer on a top surface of the patterned metal circuit layer, so as to form a conductive circuit layer. A conductive circuit board manufactured therefrom is also enclosed.

Abstract: A ceramic metal composite substrate (CMCS) includes a metal core layer, two soldering layers, and two ceramic covering layers. The metal core layer includes copper, and the metal core layer has two metallic surfaces spaced apart from each other along a thickness direction by a predetermined thickness. The two soldering layers are respectively formed on the two metallic surfaces. The two ceramic covering layers are respectively fixed to the two metallic surfaces through the two soldering layers. Each of the two ceramic covering layers has a heat-transfer coefficient greater than or equal to 20 W/m·k, and a sum of thicknesses of the two ceramic covering layers and thicknesses of the two soldering layers is less than or equal to the predetermined thickness. Each of the two ceramic covering layers overlaps at least 80% of an area of the corresponding metallic surface along the thickness direction.

Abstract: A composite ceramic substrate having multi-layer configuration includes a nitride ceramic core layer, two composite layers respectively formed on two opposite sides of the nitride ceramic core layer, and two ceramic covering layers that are respectively formed on the two composite layers. Each of the two ceramic covering layers is coated on the corresponding composite layer so as to be jointly sintered to the nitride ceramic core layer. Each of the two ceramic covering layers and the nitride ceramic core layer are of different materials, and a composite material of each of the two composite layers includes the material of the ceramic covering layer connected thereto and the material of the nitride ceramic core layer. A sum of the thicknesses of the two ceramic covering layers and the thicknesses of the two composite layers is less than or equal to a thickness of the nitride ceramic core layer.

Abstract: A ceramic metal composite substrate includes a metal core layer, two soldering layers, and two ceramic covering layers. The metal core layer is a metal-diamond composite layer, and the metal core layer has two metallic surfaces spaced apart from each other along a thickness direction by a predetermined thickness. The two soldering layers are respectively formed on the two metallic surfaces. The two ceramic covering layers are respectively fixed to the two metallic surfaces through the two soldering layers. Each of the two ceramic covering layers has a heat-transfer coefficient greater than or equal to 20 W/m·k, and a sum of thicknesses of the two ceramic covering layers and thicknesses of the two soldering layers is less than or equal to the predetermined thickness. Each of the two ceramic covering layers overlaps at least 80% of an area of the corresponding metallic surface along the thickness direction.