Abstract: A radar signal processing system with a self-interference cancelling function includes an analog front end (AFE) processor, an analog to digital converter (ADC), an adaptive interference canceller (AIC), and a digital to analog converter (DAC). The AFE processor receives an original input signal and generates an analog input signal. The ADC converts the analog input signal to a digital input signal. The AIC generates a digital interference signal digital interference signal by performing an adaptive interference cancellation process according to the digital input signal. The DAC converts the digital interference signal to an analog interference signal. Finally, the analog interference signal is fed back to the AFE and cancelled from the original input signal in the AFE processor while performing the front end process, reducing the interference of the static interference from the leaking of a close-by transmitter during the front end process.

Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.

Abstract: A semiconductor device comprises a first semiconductor structure, a second semiconductor structure located on the first semiconductor structure, and an active layer located between the first semiconductor structure and the second semiconductor structure. The first semiconductor structure has a first conductivity type, and includes a plurality of first layers and a plurality of second layers alternately stacked. The second semiconductor structure has a second conductivity type opposite to the first conductivity type. The plurality of first layers and the plurality of second layers include indium and phosphorus, and the plurality of first layers and the plurality of second layers respectively have a first indium atomic percentage and a second indium atomic percentage. The second indium atomic percentage is different from the first indium atomic percentage.

Abstract: A switching LDMOS device is formed first well in a semiconductor substrate that includes an LDD region and a first body doped region; a first heavily doped region serving as a source region is provided in the LDD region, and a second heavily doped region serving as a drain region is provided in the first body doped region; a channel of the switching LDMOS device is formed at a surface layer of the semiconductor substrate between the LDD region and the body doped region and below the gate structure; and one side of the LDD region and one side of the body doped region which are away from the gate structure both are provided with a field oxide or STI, and one side of the field oxide or STI is in contact with the first heavily doped region or the second heavily doped region.

Abstract: A switching LDMOS device is formed first well in a semiconductor substrate that includes an LDD region and a first body doped region; a first heavily doped region serving as a source region is provided in the LDD region, and a second heavily doped region serving as a drain region is provided in the first body doped region; a channel of the switching LDMOS device is formed at a surface layer of the semiconductor substrate between the LDD region and the body doped region and below the gate structure; and one side of the LDD region and one side of the body doped region which are away from the gate structure both are provided with a field oxide or STI, and one side of the field oxide or STI is in contact with the first heavily doped region or the second heavily doped region.

Abstract: A rotary mechanism includes an upper seat pan, a lower seat pan and an arc slideway mechanism. The upper and lower seat pans are connected at their sides and can rotate relative to each other. A middle inner slide rail of the arc slideway mechanism, which has a long through-hole in its center and is fixed to the lower seat pan, is positioned between an upper supporting plate and a lower supporting plate, both of which have a long aperture in their respective centers. Fixed parts run through the long through-hole and the long apertures, and fix an upper outer slide rail and a lower outer slide rail. A locking mechanism having portions fixed to the upper seat pan and the lower seat pan, respectively, is arranged to cooperate with the arc slideway mechanism to limit relative rotation of the upper and lower seat pans.

Abstract: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

Abstract: A rotary mechanism includes an upper seat pan, a lower seat pan and an arc slideway mechanism. The upper and lower seat pans are connected at their sides and can rotate relative to each other. A middle inner slide rail of the arc slideway mechanism, which has a long through-hole in its center and is fixed to the lower seat pan, is positioned between an upper supporting plate and a lower supporting plate, both of which have a long aperture in their respective centers. Fixed parts run through the long through-hole and the long apertures, and fix an upper outer slide rail and a lower outer slide rail. A locking mechanism having portions fixed to the upper seat pan and the lower seat pan, respectively, is arranged to cooperate with the arc slideway mechanism to limit relative rotation of the upper and lower seat pans.

Abstract: A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.

Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.

Abstract: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

Abstract: A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.

Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

Abstract: A heat sink assembly for a heat-generating electronic component includes a base (12), a shell mounted on the base, and a plurality of heat exchangers (11, 13, 15) mounted on the base and surrounded by the shell. The heat exchangers comprise heat conducting plates (110,130, 150) extending from the base, cores (112, 132, 152) formed on tops of the heat conducting plates and a plurality of fins (114, 134, 154) arranged about the cores. A plurality of heat pipes (20) connects the base and the cores of the heat exchangers for transferring heat from the base to the fins for dissipation.

Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.

Abstract: A heat dissipation device includes a heat conducting core having a heat receiver and a column extending from the heat receiver. A first fin unit includes a plurality of first fins radially extending from the core. The first fins curve along an anticlockwise direction. A plurality of first passages is defined between the first fins. A second fin unit includes a plurality of second fins radially extending from the core. The second fins curve along a clockwise direction. A plurality of second passages is defined between the second fins and communicating with the first passages of the first fin unit. A fan is positioned on the second fin unit for providing forced airflow to the second passages of the second fin unit and then the first passages of the first fin unit. The fan rotates anticlockwise.

Abstract: A system and method for editing a bitstream is provided. A first segment is cut from a first bitstream and a second segment is cut from a second bitstream. In cutting the segments from the bitstreams, first and last GOPs in the segments can be cut between frames in the GOP. The number of frames of the broken GOP is then compared to a pre-determined threshold value. If the number of frames of the broken GOP is less than or equal to the threshold value, the broken GOP is combined with a neighboring GOP. Therefore, the newly created GOP is longer than the standard size regular GOP. However, if the number of frames in the broken GOP is greater than the threshold value, a new GOP is created with the frames of the broken GOP. Therefore, the newly created GOP is shorter than the standard size regular GOP.

Abstract: A system and method for editing a bitstream is provided. A first segment is cut from a first bitstream and a second segment is cut from a second bitstream. In cutting the segments from the bitstreams, first and last GOPs in the segments can be cut between frames in the GOP. The number of frames of the broken GOP is then compared to a pre-determined threshold value. If the number of frames of the broken GOP is less than or equal to the threshold value, the broken GOP is combined with a neighboring GOP. Therefore, the newly created GOP is longer than the standard size regular GOP. However, if the number of frames in the broken GOP is greater than the threshold value, a new GOP is created with the frames of the broken GOP. Therefore, the newly created GOP is shorter than the standard size regular GOP.