Heat dissipation device

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Description

FIG. 1 is a perspective view of a heat dissipation device of our new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a rear elevational view thereof;

FIG. 4 is a left side elevational view thereof;

FIG. 5 is a right side elevational view thereof;

FIG. 6 is a top plan view thereof;

FIG. 7 is a bottom plan view thereof; and,

FIG. 8 shows the heat dissipation device of FIG. 1 having fans mounted thereon, wherein the fans are shown for illustrative purpose only and form no part of the claimed design.

Claims

The ornamental design for a heat dissipation device, as shown and described.

Referenced Cited
U.S. Patent Documents
D453744 February 19, 2002 Lee et al.
D496338 September 21, 2004 Chen et al.
6967845 November 22, 2005 Chiang et al.
7019979 March 28, 2006 Wang et al.
D541758 May 1, 2007 Lee et al.
20050073811 April 7, 2005 Wang et al.
20050094375 May 5, 2005 Chiang et al.
20050139347 June 30, 2005 Chen et al.
20060067050 March 30, 2006 Li et al.
Patent History
Patent number: D567771
Type: Grant
Filed: Dec 23, 2006
Date of Patent: Apr 29, 2008
Assignee: Foxconn Technology Co., Ltd. (Tu-Cheng, Taipei Hsien)
Inventors: Wei-Le Wu (Shenzhen), Chun-Chi Chen (Taipei Hsien)
Primary Examiner: Selina Sikder
Attorney: Wei Te Chung
Application Number: 29/275,421
Classifications
Current U.S. Class: Heat Sink (D13/179)