Patents by Inventor Wei-Le Wu
Wei-Le Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7997758Abstract: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.Type: GrantFiled: December 19, 2008Date of Patent: August 16, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Yi Zhang, Cheng-Tien Lai, Jin-Song Feng, Wei-Le Wu
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Patent number: 7885072Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.Type: GrantFiled: April 2, 2009Date of Patent: February 8, 2011Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Wei-Le Wu, Jin-Song Feng, Cheng-Tien Lai
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Patent number: 7806167Abstract: A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.Type: GrantFiled: June 22, 2007Date of Patent: October 5, 2010Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Wei-Le Wu, Chun-Chi Chen
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Publication number: 20100097766Abstract: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.Type: ApplicationFiled: April 2, 2009Publication date: April 22, 2010Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: WEI-LE WU, JIN-SONG FENG, CHENG-TIEN LAI
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Publication number: 20090290342Abstract: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.Type: ApplicationFiled: December 19, 2008Publication date: November 26, 2009Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.Inventors: YI ZHANG, CHENG-TIEN LAI, JIN-SONG FENG, WEI-LE WU
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Publication number: 20080314555Abstract: A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.Type: ApplicationFiled: June 22, 2007Publication date: December 25, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: WEI-LE WU, CHUN-CHI CHEN
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Patent number: 7433194Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.Type: GrantFiled: March 7, 2007Date of Patent: October 7, 2008Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.Inventors: Wei-Le Wu, Cheng-Tien Lai
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Publication number: 20080169089Abstract: A heat sink assembly for a heat-generating electronic component includes a base (12), a shell mounted on the base, and a plurality of heat exchangers (11, 13, 15) mounted on the base and surrounded by the shell. The heat exchangers comprise heat conducting plates (110,130, 150) extending from the base, cores (112, 132, 152) formed on tops of the heat conducting plates and a plurality of fins (114, 134, 154) arranged about the cores. A plurality of heat pipes (20) connects the base and the cores of the heat exchangers for transferring heat from the base to the fins for dissipation.Type: ApplicationFiled: January 15, 2007Publication date: July 17, 2008Applicant: FOXCONN TECHNOLOGY CO., LTD.Inventors: WEI-LE WU, CHUN-CHI CHEN
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Publication number: 20080151507Abstract: A heat sink fastening assembly includes a fastener comprising a latching member and an operating member. The latching member includes a pressing part, a first latching leg and a second latching leg bent downwards respectively from two opposite ends of the pressing part. The operating member has a coping and a sidewall extending downwards from an edge of the coping. The sidewall defines two locking slots engaging with the first latching leg and an elastic rib extending downwards from the coping and engaged with the first latching leg of the latching member for inhibiting any movement of the operating member in a direction along the locking slot of the sidewall.Type: ApplicationFiled: March 7, 2007Publication date: June 26, 2008Applicant: Foxconn Technology Co., Ltd.Inventors: Wei-Le Wu, Cheng-Tien Lai
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Publication number: 20080066898Abstract: A heat dissipation device includes a heat conducting core having a heat receiver and a column extending from the heat receiver. A first fin unit includes a plurality of first fins radially extending from the core. The first fins curve along an anticlockwise direction. A plurality of first passages is defined between the first fins. A second fin unit includes a plurality of second fins radially extending from the core. The second fins curve along a clockwise direction. A plurality of second passages is defined between the second fins and communicating with the first passages of the first fin unit. A fan is positioned on the second fin unit for providing forced airflow to the second passages of the second fin unit and then the first passages of the first fin unit. The fan rotates anticlockwise.Type: ApplicationFiled: September 15, 2006Publication date: March 20, 2008Applicant: Foxconn Technology Co., Ltd.Inventors: Cheng-Tien Lai, Wei-Le Wu, Cui-Jun Lu
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Patent number: D567771Type: GrantFiled: December 23, 2006Date of Patent: April 29, 2008Assignee: Foxconn Technology Co., Ltd.Inventors: Wei-Le Wu, Chun-Chi Chen