Abstract: Embodiments of present disclosure relates to an electronic device and a method for current recycling. The electronic device comprises a transmission line, a bias resistor and a DC bias electrical connection. The transmission line is configured to transmit data. The bias resistor is coupled to the transmission line. The DC bias electrical connection is coupled between the bias resistor and a load at a terminal bias voltage. The DC bias electrical connection is configured to provide the bias resistor with the terminal bias voltage in case that DC bias current flows through the transmission line. By utilizing embodiments herein, the electronic device recycles current during data transmission to save power.

Abstract: An audio acquisition device positioning method is provided. In the method, a first image that includes an audio acquisition device is obtained. The audio acquisition device in the first image is identified. First coordinate data of the identified audio acquisition device in the first image is obtained. First displacement data is determined according to the first coordinate data and historical coordinate data of the audio acquisition device. First coordinates of the audio acquisition device are determined according to the first displacement data.

Abstract: A semiconductor device structure and method that utilizes anti-reflection components. The structure includes at least one ramp VIA formed in a VIA isolator layer, at least one anti-reflection component formed on the at least one ramp VIA. A trench isolator layer is formed on the at least one anti-reflection component, and a photoresist is selectively patterned on the trench isolator layer. The trench isolator layer and a portion of the at least one anti-reflection component is etched based upon the selectively patterned photoresist to form a trench metal component hole above the at least one ramp VIA. Thereafter, a trench metal component is formed in the trench metal component hole.

Abstract: An integrated circuit device and a method of manufacturing the same are provided. The method includes steps of: forming a semiconductor device on a substrate; forming a first interconnect structure and a dielectric layer over the semiconductor device; and forming a second interconnect structure over the first interconnect structure, wherein the formation of the second interconnect structure includes: forming an insulating film over the first interconnect structure; depositing an etch stop layer over the insulating film, wherein the etch stop layer and the insulating film include different materials; depositing an isolation layer over the etch stop layer; performing a first etching operation to form a via penetrating the isolation layer and exposing the etch stop layer; and performing a second etching operation to extend the via downward to penetrate the etch stop layer and the insulating film and expose a portion of the first interconnect structure.

Abstract: A phosphorus-containing compound is represented by the formula (I): The phosphorus-containing compound has excellent biodegradability and oxidation resistance, and is suitable for promoting biodegradation of lubricating oil product.

Abstract: A server comprising a circuitry, wherein the circuitry is configured to perform: generating an emulator in response to a request from a first user terminal of a first user; launching an application via the emulator; receiving streaming data and interaction data via the application; rendering the streaming data with the interaction data; recording the rendered streaming data and interaction data as a clip; and storing the clip for access from the first user terminal of the first user. According to the present disclosure, the clips may be generated in a more efficient and accurate manner, and a more immersive experience on watching the clips may be provided. Moreover, the review and share of clips may be more flexible. Therefore, the user experience may be improved.

Abstract: The present disclosure provides a method for PCIE data transmission. The method includes: determining whether the length of a PCIE data packet to be transmitted is less than a preset length; when it is determined that the length of the PCIE data packet is less than the preset length, performing data transmission on the PCIE data packet by means of a space of a base address register and a protocol converter; and when it is determined that the length of the PCIE data packet is greater than or equal to the preset length, performing data reading/writing on the PCIE data packet in a DMA manner. Therefore, the utilization rate of a PCIE bandwidth is improved, and the running reliability of a host is improved.

Abstract: Display devices are provided. The display device includes a display panel including subpixels and a drive assembly configured to transmit data signals to the display panel. The drive assembly includes a first storage module, a second storage module, and a fusion module. A first compensation table including first grayscale data corresponding to the subpixels is stored in the first storage module. A second compensation table including second grayscale data corresponding to the first grayscale data is stored in the second storage module. The fusion module is configured to call the first compensation table and the second compensation table, calculate target grayscale data corresponding to the first grayscale data according to the second grayscale data, and compensate the display panel according to a third compensation table merged by the target grayscale data and the first grayscale data.

Abstract: A polymerase chain reaction heating device and a related system can include a circuit board, a heater, a first thermal conductive component and a second thermal conductive component. The circuit board has an opening structure. The heater is disposed inside and partly exposed via the opening structure. The first thermal conductive component is disposed on the circuit board and includes a first reagent storage portion and a first heat conduction portion. The second thermal conductive component is disposed on the circuit board and includes a second reagent storage portion and a second heat conduction portion. The first reagent storage portion and the second reagent storage portion can be used to form a reagent holder. The first heat conduction portion and the second heat conduction portion respectively abut against two opposite surfaces of the heater for transmitting the heat generated by the heater towards the reagent holder.

Abstract: Disclosed is a test apparatus for denture processing, including a carrying mechanism provided on a placement surface, a hardness test mechanism, an internal support mechanism, a stop mechanism, a drive mechanism and a transmit mechanism. The internal support mechanism is configured to clamp a to-be-test denture and includes a threaded shaft (2), an internal support member and a main shaft (1). The internal support member is slidably connected to the carrying mechanism along a first direction and is at least partially provided in the carrying mechanism. The threaded shaft (2) is provided with two thread portions with opposite rotation directions, the thread portions and the internal support members are in a one-to-one correspondence, part of the internal support member provided in the carrying mechanism is threaded with the thread portion, and the threaded shaft (2) is connected to the main shaft (1) through a damping bearing (3).

Abstract: An anti-peep module including an anti-peep element, a driving circuit, a voltage adjustment circuit and a temperature sensor is provided. The anti-peep element includes a liquid crystal layer, a first anti-peep electrode layer and a second anti-peep electrode layer. The liquid crystal layer is located between the first and second anti-peep electrode layers. The temperature sensor is adapted to sense an ambient temperature. The voltage adjustment circuit is coupled to the temperature sensor. The driving circuit is coupled to the voltage adjustment circuit and the anti-peep element. When the ambient temperature is a first ambient temperature and the anti-peep element operates in an anti-peep mode, the driving circuit outputs a first driving voltage to the anti-peep element; when the ambient temperature is a second ambient temperature and the anti-peep element operates in the anti-peep mode, the driving circuit outputs a second driving voltage to the anti-peep element.

Abstract: A method of foreign object detecting during wireless power transfer and a power transmitter are provided. The power transmitter includes: a control circuit, configured to temporarily interrupt transmission of an electricity signal; a signal sampling circuit, configured to sample, during the transmission of the electricity signal is temporarily interrupted, a signal generated by an oscillation circuit of the power transmitter; the control circuit is further configured to: obtain an oscillation waveform based on sampled values; perform an integral operation on the oscillation waveform and average the result of the integral operation to obtain an integrated average value; obtain an oscillation frequency of the oscillation waveform; and determine whether there is a foreign object based on the integrated average value and the oscillation frequency.

Abstract: The invention introduces an apparatus for detecting errors during data encryption. The apparatus includes an encoding circuitry and an error detection circuitry. The encoding circuitry is arranged operably to realize an encryption algorithm including multiple rounds, in which of each round encodes plaintext or an intermediate encryption result with a round key. The error detection circuitry is arranged operably to: calculate redundant data corresponding to the intermediate encryption result; and output an error signal to a processing unit when finding that the intermediate encryption result does not match the redundant data at a check point during an encryption process.

Abstract: A peripheral wind outlets device and a matrix wind generation system is disclosed, which is disposed on a protected space, and comprises an air supply matrix and an air exhaust matrix. The air supply matrix is composed by a plurality of peripheral wind outlets devices, disposed on a top surface of the protected space. The air exhaust matrix is composed by a plurality of peripheral air exhaust devices, disposed on a bottom surface of the protected space.

Abstract: A single-fiber bidirectional optical transmission apparatus, a wavelength division multiplexing device, and an optical transmission system, is disclosed. The single-fiber bidirectional optical transmission apparatus includes: a first single-light-source coherent optical transceiver, configured to: receive a first optical signal from a first multiplexer/demultiplexer, convert the first optical signal into a first electrical signal, and send the first electrical signal to a first client signal processing apparatus; and a second single-light-source coherent optical transceiver, configured to: receive a second electrical signal from the first client signal processing apparatus, convert the second electrical signal into a second optical signal, and send the second optical signal to the first multiplexer/demultiplexer. A wavelength of the second optical signal is different from a wavelength of the first optical signal.

Abstract: Apparatuses, methods, and systems for sensor detection may incorporate (i) concealed light sensors including a housing shell and an ambient light sensor positioned to detect light, (ii) a plurality of microvalves with each microvalve including a substrate, a fluid channel through the substrate, a valve element configured to open and close a fluid pathway through the fluid channel, and a piezoresistive material, (iii) a microprocessor that is configured to adjust a charging voltage for a battery, calculated from an output signal, and (iv) a radio frequency transceiver configured to control an antenna tuner to change one or more specified operational parameters of at least one antenna based on an input detected from a set of sensors in a watch body and a set of sensors in a watch band.

Abstract: A semiconductor device includes a substrate. Semiconductor layers are stacked one above another over the substrate. A gate structure wraps around each of the semiconductor layers. Epitaxial layers are over the substrate and in contact with opposite ends of a bottommost one of the semiconductor layers. Source/drain epitaxial structures are over and in contact with the epitaxial layers, respectively. Dielectric structures vertically between the epitaxial layers and the respective source/drain epitaxial structures, respectively.

Abstract: A system-on-chip structure includes a substrate, first and second die disposed over a surface of the substrate and separated by an inter-die gap, a protection layer disposed over a sidewall of each of the first and second die, and a gap fill layer disposed over the protection layers and substantially filling the inter-die gap.

Abstract: A computer-implemented method can include obtaining a field image of a railcar collected from a field camera system and applying a machine-learning algorithm to the field image to generate a machine-learning algorithm output. The method can include performing a post-processing operation on the machine-learning algorithm output to generate a post-processed machine-learning algorithm output. Further, the method can include detecting a defect of the railcar using the post-processed machine-learning algorithm output.