Abstract: A recliner mechanism includes a base. Returning spring units are disposed on two sides of the base and rockers are disposed on outer sides of the returning spring units. An extending assembly is disposed at the top of each rocker. A drive unit is arranged between the extending assemblies on the two sides and includes a front driving rod. A reciprocating device is disposed at the middle of the front driving rod and a rear driving rod is disposed at an output end of the reciprocating device. Bent members are fixedly connected to two ends of the rear driving rod. Each bent member is pivotally coupled with a driving member I and the middle of the driving member I is pivotally coupled with a driving member II, with the other ends of the driving member I and the driving member II being pivotally coupled with the extending assemblies.

Abstract: A semiconductor package includes semiconductor bridge, first and second multilayered structures, first encapsulant, and a pair of semiconductor dies. Semiconductor dies of the pair include semiconductor substrate and conductive pads disposed at front surface of semiconductor substrate. Semiconductor bridge electrically interconnects the pair of semiconductor dies. First multilayered structure is disposed on rear surface of one semiconductor die. Second multilayered structure is disposed on rear surface of the other semiconductor die. First encapsulant laterally wraps first multilayered structure, second multilayered structure and the pair of semiconductor dies. Each one of first multilayered structure and second multilayered structure includes a top metal layer, a bottom metal layer, and an intermetallic layer. Each one of first multilayered structure and second multilayered structure has surface coplanar with surface of first encapsulant.

Abstract: An impact drill includes an output shaft capable of rotating around a first axis and moving along the first axis, a housing, a first impact block fixedly connected to the output shaft, a second impact block, a stopping element for stopping the output shaft from moving backward, and a movable element mounted on the housing. The housing is formed with a through hole for accommodating the movable element. The through hole passes through the housing in a first line and the movable element is capable of moving to a first position and a second position along the first line. When the movable element moves to the first position, the movable element prevents the output shaft from moving backward. When the movable element moves to the second position, the movable element allows the output shaft to move backward.

Abstract: Disclosed are an infrared touch screen bezel for installing a functional assembly and a display terminal including the same. The infrared touch screen bezel (10) includes a frame body (11), a first infrared base panel (12), and a second infrared base panel (13); the first infrared base panel (12) and the second infrared base panel (13) are both arranged in a cavity (101) of the frame body (11), and a functional assembly (30) is arranged in a gap between the first infrared base panel (12) and the second infrared base panel (13); the first infrared base panel (12) and the second infrared base panel (13) are electrically connected through a first flexible circuit board (14). The above-mentioned infrared touch screen bezel (10) may greatly reduce the width of the frame required to install a functional assembly without affecting the infrared touch function.

Abstract: An semiconductor device includes a first dielectric layer, an etch stop layer, an interconnect structure, and a second dielectric layer. The etch stop layer is over the first dielectric layer. The interconnect structure includes a conductive via in the first dielectric layer and the etch stop layer, a conductive line over the conductive via, an intermediate conductive layer over the conductive line, and a conductive pillar over the intermediate conductive layer. The interconnect structure is electrically conductive at least from a top of the conductive pillar to a bottom of the conductive via. The second dielectric layer surrounds the conductive line, the intermediate conductive layer, and the conductive pillar, wherein a bottom of the second dielectric layer is lower than a top of the conductive line, and a top of the second dielectric layer is higher than the top of the conductive line.

Abstract: A method for forming a package structure is provided. The method includes forming a first molding compound layer surrounding a first interposer. The method also includes forming a first redistribution structure over a first side of the first interposer and the first molding compound layer. The method also includes bonding a first semiconductor die and a second semiconductor die to the first redistribution structure through a plurality of first connectors. The method also includes bonding a surface-mount device (SMD) to the first redistribution structure through a second connector. The method also includes forming a second redistribution structure over a second side of the first interposer opposite the first side of the first interposer. A top surface of the surface-mount device (SMD) is lower than top surfaces of the first semiconductor die and the second semiconductor die.

Abstract: An electronic device and a manufacturing method thereof are provided. The method includes at least the following steps. An insulating encapsulant is formed to encapsulate a multi-layered structure and a semiconductor die, where the multi-layered structure includes a first conductor, a diffusion barrier layer on the first conductor, and a metallic layer on the diffusion barrier layer, and the insulating encapsulant at least exposes a portion of the semiconductor die and a portion of the first conductor. A redistribution structure is formed over the insulating encapsulant, the semiconductor die, and the first conductor. The metallic layer is removed to form a recess in the insulating encapsulant. A second conductor is formed in the recess over the diffusion barrier layer, where the first conductor, the diffusion barrier layer, and the second conductor form a conductive structure that is electrically coupled to the semiconductor die through the redistribution structure.

Abstract: In one embodiment, a method of forming metal interconnects uses a direct metal etch approach to form and fill the metal gap. The method may include directly etching a metal layer to form metal patterns. The metal patterns may be spaced apart from one another by recesses. A dielectric spacer may be formed extending along the sidewalls of each of the recesses. The recesses may be filled with a conductive material to form a second set of metal patterns. By directly etching the metal film, the technique allows for reduced line width roughness. The disclosed structure may have the advantages of increased reliability, better RC performance and reduced parasitic capacitance.

Abstract: A method for data transmission between a sensor device and an electronic device includes: broadcasting, by the sensor device, a beacon dataset and a sensor dataset associated with the beacon dataset; in receipt of the beacon dataset, determining, by the electronic device, whether to receive the sensor dataset associated with the beacon dataset; and when it is determined to receive the sensor dataset associated with the beacon dataset, operating, by the electronic device, in a scan mode so as to receive the sensor dataset associated with the beacon dataset.

Abstract: A method for forming a package structure is provided. The method for forming a package structure includes bonding a package component to a first surface of a substrate through a plurality of first connectors. The package component includes a first semiconductor die and a second semiconductor die. The method also includes forming a dam structure over the first surface of the substrate. The dam structure is around and separated from the package component, and a top surface of the dam structure is higher than a top surface of the package component. The method further includes forming an underfill layer between the dam structure and the package component. In addition, the method includes removing the dam structure after the underfill layer is formed.

Abstract: The invention discloses a stent delivery system capable of accurately positioning. The system comprises a movable sheathing canal, a fixed sheathing canal and a stent, the fixed sheathing canal is used for fixing stent, the movable sheathing canal comprises a handle, a stent length buckle, an inner sheathing canal, a sheathing canal inclined part, an outer sheathing canal and an outer sheathing positioning marking part, and the sheathing canal inclined part and the outer sheathing canal are integrally formed, and are arranged at front end of inner sheathing canal. The invention provides an accurate-positioning proximal end pre-release stent delivery system and method, which is simple in structure and convenient to use. The invention can realize accurate positioning of the proximal-end of the stent, that is, the invention can prevent stent from being too long or too short due to proximal-end inaccurate release of the stent through proximal-end accurate positioning.

Abstract: A method for setting calibrated outflow water of a quantitative outflow water faucet, a method for processing outflow water, and a faucet. The method for setting the calibrated outflow water comprises receiving a touch/press signal, and entering a calibration setting mode; receiving a signal for setting one or more quantitative outflow water gear positions, and obtaining a calibrated outflow water gear position; receiving a touch/press signal of an outflow water control switch, and controlling an outflow water valve to be opened; when a number of rotations of a flow meter reaches an initial set value of the one or more quantitative outflow water gear positions, controlling the outflow water valve to be closed to obtain an actual outflow water quantity; receiving a difference value; setting a calibrated set value of the calibrated outflow water gear position; and exiting the calibration setting mode.

Abstract: A terminal assembly is disclosed. The terminal assembly comprises a main body having a welding platform and a first electrical conductive member having a connection terminal. According to the present invention, a welded structure is formed between the main body and the first electrical conductive member by making the connection terminal be welded on the welding platform. Briefly speaking, when utilizing this terminal assembly to make two electrical nodes be electrically connected to each other, one electrical conductive end of the main body and the first electrical conductive member are firstly connected to the two electrical nodes, respectively. Next, a welding process is applied to the welding platform and the connection terminal, such that an electrical connection is therefore established between the two electrical nodes.

Abstract: In some embodiments, the present disclosure relates to an integrated chip that includes a first interconnect dielectric layer over a substrate. An interconnect wire extends through the first interconnect dielectric layer, and a dielectric on wire structure is arranged directly over the interconnect wire. Outer sidewalls of the dielectric on wire structure are surrounded by the first interconnect dielectric layer. The integrated chip further includes a second interconnect dielectric layer arranged over the first interconnect dielectric layer, and an interconnect via that extends through the second interconnect dielectric layer and the dielectric on wire structure to contact the interconnect wire.

Abstract: The invention discloses a method of rapid generation-adding breeding of rice in the technical field of rice breeding, including soaking seeds of the rice, germination, seedlings cultivation, managing and regulating of the rice at the growth stage, and harvesting the rice. The managing and regulating the rice at the growth stage includes dynamic light quality and photoperiod control in vegetative growth period, heading period and pustulation period; growth period involves light environment regulation with the ratio of red light: blue light: white light of 0.8-1: 0.8-1: 1.0, photoperiod of 16-18 h; heading period involves light environment regulation with the ratio of red light: blue light: white light of 1-2: 0.5-1: 1, photoperiod of 12-13.5 h; and pustulation period includes light environment regulation with the ratio of red light: blue light: white light of 1-2: 1: 1, photoperiod of 16-18 h.

Abstract: The invention discloses a method of rapid generation-adding breeding of rice in the technical field of rice breeding, including soaking seeds of the rice, germination, seedlings cultivation, managing and regulating of the rice at the growth stage, and harvesting the rice. The managing and regulating the rice at the growth stage includes dynamic light quality and photoperiod control in vegetative growth period, heading period and pustulation period; growth period involves light environment regulation with the ratio of red light:blue light:white light of 0.8-1:0.8-1:1.0, photoperiod of 16-18 h; heading period involves light environment regulation with the ratio of red light:blue light:white light of 1-2:0.5-1:1, photoperiod of 12-13.5 h; and pustulation period includes light environment regulation with the ratio of red light:blue light:white light of 1-2:1:1, photoperiod of 16-18 h.

Abstract: A method, apparatus and device used to search for content, and a computer-readable storage medium, which relate to the field of data processing. In the method, in response to receiving a search request for a target search term, obtain multiple historical search records related to multiple historical search requests, each historical search record comprising the historical search term targeted by the corresponding historical search request. Then, determine a first historical search record matching the target search term from the multiple historical search records. Furthermore, based on the relationship between multiple historical search records, determine from the multiple historical search records a second historical search record associated with the first historical search record. The method further comprises determining an extended result for the target search term on the basis of the search result corresponding to the second historical search record.

Abstract: An autonomous vehicle (AV) described herein is configured to receive a pull over location specified by a passenger, and is further configured to refine the pull over location based upon one or more factors, where the factors include computer-readable content from a profile of the passenger, sensor data output by sensor systems of the AV, observed or predicted weather conditions, observed or predicted traffic, and/or observations recently generated by other AVs that belong to the same fleet as the AV.

Abstract: Embodiments of this application provide a gateway handover method, a gateway reselection method, and a communications apparatus. The method includes: A source gateway determines to perform gateway handover on a terminal device; determines a target gateway that is to be used to serve the terminal device; and hands over the terminal device from the source gateway to the target gateway. According to the gateway handover method, the gateway reselection method, and the communications apparatus provided in the embodiments of this application, in a non-3GPP network architecture, when gateway handover needs to be performed on the terminal device, the source gateway of the terminal device or the terminal device may hand over the terminal device from the source gateway of the terminal device to the target gateway, to implement gateway handover in the non-3GPP network architecture.

Abstract: Embodiments herein relate to protection of a standby amplifier of a memory device. Specifically, an input voltage of the standby amplifier may be reduced to decrease an occurrence of damage to the standby amplifier or components thereof. In some embodiments, the input voltage may be reduced using a voltage divider that provides the reduced input voltage to the standby amplifier during a power up operation. Upon completion of the power up operation, the input voltage of the standby amplifier may return to an operating voltage. The reduced input voltage may reduce the occurrence of damage to the standby amplifier by maintaining a gate to drain voltage of one or more transistors of the standby amplifier below a maximum.