Patents by Inventor Wei Mu

Wei Mu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11979875
    Abstract: A terminal is disclosed including a transmitting unit that transmits, to a base station, a schedule request (SR); and a receiving unit that receives, from the base station, an uplink grant indicating scheduling information for transmitting uplink data, wherein the transmitting unit transmits, to the base station, the uplink data by employing the scheduling information. In other aspects, a base station and a system are also disclosed.
    Type: Grant
    Filed: October 12, 2022
    Date of Patent: May 7, 2024
    Assignee: NTT DOCOMO, INC.
    Inventors: Qin Mu, Liu Liu, Naoto Okubo, Wei Xu, Yong Li, Wenbo Wang
  • Publication number: 20240142727
    Abstract: An optoelectronic device includes a photonic component. The photonic component includes an active side, a second side different from the active side, and an optical channel extending from the active side to the second side of the photonic component. The optical channel includes a non-gaseous material configured to transmit light.
    Type: Application
    Filed: January 9, 2024
    Publication date: May 2, 2024
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Jr-Wei LIN, Sin-Yuan MU, Chia-Sheng CHENG
  • Publication number: 20240131697
    Abstract: The present invention relates to a parallel robot system, including: a control apparatus; a parallel robot, including a mounting base, a moving platform, and a driving apparatus arranged between the mounting base and the moving platform, where the driving apparatus is configured to drive the moving platform to make multi-degree-of-freedom movement relative to the mounting base, and the driving apparatus receives a control signal from the control apparatus; a tracer, arranged on the moving platform; a passive arm, where the mounting base of the parallel robot is connected to one end of the passive arm; and an optical positioning and tracking apparatus, configured to track a spatial position of the tracer in real time and to send spatial position data of the tracer to the control apparatus.
    Type: Application
    Filed: May 4, 2022
    Publication date: April 25, 2024
    Inventors: Gang ZHU, Wei TIAN, Kewen MU, Chuan BAI, Ke XU, Xiangrui ZHAO
  • Patent number: 11966628
    Abstract: A memory device, includes a memory array for storing a plurality of vector data each of which has an MSB vector and a LSB vector. The memory array includes a plurality of memory units each of which has a first bit and a second bit. The first bit is used to store the MSB vector of each vector data, the second bit is used to store the LSB vector of each vector data. A bit line corresponding to each vector data executes one time of bit-line-setup, and reads the MSB vector and the LSB vector of each vector data according to the bit line. The threshold voltage distribution of each memory unit is divided into N states, where N is a positive integer and N is less than 2 to the power of 2, and the effective bit number stored by each memory unit is less than 2.
    Type: Grant
    Filed: June 2, 2022
    Date of Patent: April 23, 2024
    Assignee: MACRONIX INTERNATIONAL CO., LTD.
    Inventors: Wei-Chen Wang, Han-Wen Hu, Yung-Chun Li, Huai-Mu Wang, Chien-Chung Ho, Yuan-Hao Chang, Tei-Wei Kuo
  • Publication number: 20240116197
    Abstract: The present invention relates to a robotic arm, including: an upper arm and a front arm; a first joint structure, by which the upper arm and the front arm are articulated together; a second joint structure, arranged at an end of the upper arm and/or an end of the front arm; a first driving mechanism, arranged in the upper arm; and a second driving mechanism, arranged in the front arm, where the first joint structure includes a first force amplification apparatus and a first locking element, the second joint structure includes a second force amplification apparatus and a second locking element, and the first driving mechanism and the second driving mechanism apply an acting force to the first locking element and/or the second locking element by the first force amplification apparatus and/or the second force amplification apparatus.
    Type: Application
    Filed: May 5, 2022
    Publication date: April 11, 2024
    Inventors: Gang ZHU, Kewen MU, Ke XU, Wei TIAN, Xiangrui ZHAO
  • Patent number: 11929434
    Abstract: A switch device includes a P-type substrate, a first gate structure, a first N-well, a shallow trench isolation structure, a first P-well, a second gate structure, a first N-type doped region, a second P-well, and a second N-type doped region. The first N-well is formed in the P-type substrate and partly under the first gate structure. The shallow trench isolation structure is formed in the first N-well and under the first gate structure. The first P-well is formed in the P-type substrate and under the first gate structure. The first N-type doped region is formed in the P-type substrate and between the first gate structure and the second gate structure. The second P-well is formed in the P-type substrate and under the second gate structure. The second N-type doped region is formed in the second P-well and partly under the second gate structure.
    Type: Grant
    Filed: April 15, 2022
    Date of Patent: March 12, 2024
    Assignee: eMemory Technology Inc.
    Inventors: Chih-Hsin Chen, Shih-Chen Wang, Tsung-Mu Lai, Wen-Hao Ching, Chun-Yuan Lo, Wei-Chen Chang
  • Patent number: 11652052
    Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.
    Type: Grant
    Filed: March 29, 2021
    Date of Patent: May 16, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Xi-Zhao Wang, Yi-Min Jiang, Li-Wei Mu, Shan-Yu Wu, Chao-Hui Kuo, Can-Liang Zhao, Hong-Yan Lian, Chun-Wei Liu
  • Patent number: 11652051
    Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.
    Type: Grant
    Filed: January 22, 2021
    Date of Patent: May 16, 2023
    Assignee: TPK Advanced Solutions Inc.
    Inventors: Yi-Min Jiang, Xi-Zhao Wang, Li-Wei Mu, Shan-Yu Wu, Chih-Min Chen, Chao-Hui Kuo, Wei-Chuan Chao, Chia Jui Lin
  • Publication number: 20230051258
    Abstract: Filter media comprising non-woven fiber webs having one or more advantageous physical properties are generally described. In some embodiments, a filter media and/or non-woven fiber web described herein comprises a combination of fibers that results in enhanced physical properties. For example, the non-woven fiber web may comprise a combination of fiber types that is advantageous, such as a combination comprising fibrillated fibers, glass fibers, and/or binder fibers. In some cases, the filter media and/or non-woven fiber web comprising the combination of fibers may be formed into undulations (e.g., by a creping and/or microcreping process) to further enhance the physical properties of the filter media and/or non-woven fiber.
    Type: Application
    Filed: June 22, 2022
    Publication date: February 16, 2023
    Applicant: Hollingsworth & Vose Company
    Inventors: Sudhakar Jaganathan, Xinquan Cheng, Howard Yu, Leilei Luo, Zhiping Jiang, Yu Liu, Mark Rowlands, Wei Mu, James M. Witsch, Stephan Daus
  • Publication number: 20230038185
    Abstract: Two major treatment strategies employed in fighting non-small cell lung cancer (NSCLC) are tyrosine kinase inhibitors (TKIs) and immune checkpoint inhibitors (ICIs). The choice of strategy is based on heterogeneous biomarkers expressed by the lung tumor tissue. A major challenge for molecular testing of these biomarkers is the insufficiency of biopsy specimens from patients with advanced NSCLC. Disclosed herein is a method for predicting a response to immune-checkpoint blockade immunotherapy.
    Type: Application
    Filed: December 7, 2020
    Publication date: February 9, 2023
    Inventors: Robert J. Gillies, Matthew B. Schabath, Wei MU
  • Patent number: 11532557
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 20, 2022
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Laili Wang, Fengtao Yang, Wei Mu, Dingkun Ma, Cheng Zhao, Jianpeng Wang
  • Publication number: 20220308727
    Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes a substrate, a copper layer, an organic composite protective layer, and a silver nanowire layer. The copper layer is disposed on the substrate. The nanowire-distribution-promotion layer is disposed between the copper layer and the silver nanowire layer.
    Type: Application
    Filed: March 29, 2021
    Publication date: September 29, 2022
    Inventors: Xi-Zhao Wang, Yi-Min Jiang, Li-Wei Mu, Shan-Yu Wu, Chao-Hui Kuo, Can-Liang Zhao, Hong-Yan Lian, Chun-Wei Liu
  • Publication number: 20220238749
    Abstract: The present disclosure provides a contact structure and an electronic device having the same. The contact structure includes: a substrate; a copper layer disposed on the substrate; an adhesion promotion layer disposed on the copper layer, wherein the adhesion promotion layer forms a monomolecular adsorption layer on the surface of the copper layer; and a silver nanowire layer disposed on the adhesion promotion layer, and the adhesive force between the copper layer and the silver nanowire layer is 3B or more. In the present disclosure, by disposing the adhesion promotion layer on the copper layer, in the stacked structure of the copper layer and the silver nanowire layer, the adhesive force between the copper layer and the silver nanowire layer is increased, so as to prevent a peeling phenomenon of the copper layer occurring in the subsequent yellow-light process.
    Type: Application
    Filed: January 22, 2021
    Publication date: July 28, 2022
    Inventors: Yi-Min Jiang, Xi-Zhao Wang, Li-Wei Mu, Shan-Yu Wu, Chih-Min Chen, Chao-Hui Kuo, Wei-Chuan Chao, Chia Jui Lin
  • Publication number: 20220177717
    Abstract: A contact structure is provided, which includes a substrate, a copper layer, an organic composite protective layer, and a nanosilver layer. The copper layer is disposed over the substrate. The organic composite protective layer is disposed over the copper layer to avoid oxidation of the copper layer, in which the organic composite protective layer forms a monomolecular adsorption layer over a surface of the copper layer. The nanosilver layer is disposed over the organic composite protective layer. A method of manufacturing a contact structure is also provided.
    Type: Application
    Filed: December 9, 2020
    Publication date: June 9, 2022
    Inventors: Zhi-Qiang Lin, Yi-Min Jiang, Shen-Jie Chen, Ting-Ting Li, Xi-Zhao Wang, Li-Wei Mu, Shan-Yu Wu, Chih-Min Chen, Chao-Hui Kuo
  • Patent number: 11146056
    Abstract: An interface control circuit complying with an interface specification includes: an interface signal transceiver circuit and a protection circuit. The interface signal transceiver circuit is coupled to a first interface connection pin and a second interface connection pin of a first interface connector circuit. The interface signal transceiver circuit is for transmitting and/or receiving an interface signal according to the interface specification. When the interface signal transceiver circuit operates under a first state, the protection circuit determines whether a foreign object exists between the first interface connection pin and the second interface connection pin according to a voltage change or a current change at the second interface connection pin. Under the first state, the interface signal transceiver circuit generates a pull-up signal and a pull-down signal which are toggled with each other at the first interface connection pin.
    Type: Grant
    Filed: May 13, 2020
    Date of Patent: October 12, 2021
    Assignee: RICHTEK TECHNOLOGY CORPORATION
    Inventors: Yu-Jen Cheng, Chih-Wei Mu, Sheng-Tsung Chen, Chieh-Min Lo, Wei-Chung Chang
  • Publication number: 20210308609
    Abstract: Filter media including out-of-plane solid elements are generally described. Inventive methods of forming them and uses thereof are also described.
    Type: Application
    Filed: April 7, 2020
    Publication date: October 7, 2021
    Applicant: Hollingsworth & Vose Company
    Inventors: Mark Rowlands, James M. Witsch, Wei Mu, Stephan Daus
  • Publication number: 20210202386
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Inventors: Laili WANG, Fengtao YANG, Wei MU, Dingkun MA, Cheng ZHAO, Jianpeng WANG
  • Publication number: 20210119438
    Abstract: An interface control circuit complying with an interface specification includes: an interface signal transceiver circuit and a protection circuit. The interface signal transceiver circuit is coupled to a first interface connection pin and a second interface connection pin of a first interface connector circuit. The interface signal transceiver circuit is for transmitting and/or receiving an interface signal according to the interface specification. When the interface signal transceiver circuit operates under a first state, the protection circuit determines whether a foreign object exists between the first interface connection pin and the second interface connection pin according to a voltage change or a current change at the second interface connection pin. Under the first state, the interface signal transceiver circuit generates a pull-up signal and a pull-down signal which are toggled with each other at the first interface connection pin.
    Type: Application
    Filed: May 13, 2020
    Publication date: April 22, 2021
    Inventors: Yu-Jen Cheng, Chih-Wei Mu, Sheng-Tsung Chen, Chieh-Min Lo, Wei-Chung Chang
  • Patent number: 10870380
    Abstract: Provided is an integral single-frame two-way headrest with a U-shaped single rod, comprising a U-shaped rod, an integral frame and a cover, the integral frame being externally covered with the cove, and the integral frame is hollow inside. An opening is arranged at a lower end of the integral frame, and an upper portion of the U-shaped rod is inserted into the inner frame from the opening, a plurality of positioning grooves is arranged on the right side of two downwardly extending ends of the U-shaped rod. A rod guide sleeve sleeved on both ends of the U-shaped rod is mounted at both ends of the opening, and the outer side of the integral frame is mounted with an unlocking steel wire corresponding to the positioning groove at both ends of the U-shaped rod, an unlocking lever connected with the unlocking steel wire and laterally movable is mounted in a hollow portion of the integral frame.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: December 22, 2020
    Assignee: Ningbo Jifeng Auto Parts Co., Ltd.
    Inventors: Pu Wei Mu, Li Ying Cheng
  • Publication number: 20200154927
    Abstract: A catering and cooking device includes a machine body, a heating unit and/or a flow control unit, a control unit electrically connected to the heating unit and/or the flow control unit to control the heating unit and/or the flow control unit, and a network communication unit electrically connected to the control unit to receive processing process information to control water outlet time of a water reservoir. The catering and cooking device of the present invention receives processing process information corresponding to food via the network communication unit, controls the flow control unit to add liquid such as water or oil according to the received processing process information, and then controls the heating unit to heat according to a preset power map and heating time, the present invention can process different foods in a targeted manner.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 21, 2020
    Applicant: Qing Dao YuanJian Holding Group limited
    Inventor: Wei MU