Patents by Inventor Wei Mu

Wei Mu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12453786
    Abstract: Two major treatment strategies employed in fighting non-small cell lung cancer (NSCLC) are tyrosine kinase inhibitors (TKIs) and immune checkpoint inhibitors (ICIs). The choice of strategy is based on heterogeneous biomarkers expressed by the lung tumor tissue. A major challenge for molecular testing of these biomarkers is the insufficiency of biopsy specimens from patients with advanced NSCLC. Disclosed herein is a method for predicting a response to immune-checkpoint blockade immunotherapy.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: October 28, 2025
    Assignee: H. Lee Moffitt Cancer Center and Research Institute Inc.
    Inventors: Robert J. Gillies, Matthew B. Schabath, Wei Mu
  • Publication number: 20250281860
    Abstract: Filter media including out-of-plane solid elements are generally described. Inventive methods of forming them and uses thereof are also described.
    Type: Application
    Filed: May 27, 2025
    Publication date: September 11, 2025
    Applicant: Hollingsworth & Vose Company
    Inventors: Mark Rowlands, James M. Witsch, Wei Mu, Stephan Daus
  • Publication number: 20250273617
    Abstract: A power module packaging structure based on liquid metal, including an upper printed circuit board or an upper cermet substrate, a power semiconductor chip and a lower cermet substrate, wherein a lower surface copper layer of the circuit board is connected with the chip through a soldering layer, a groove is formed in an upper copper layer of the lower cermet substrate through etching, the surface of the upper copper layer of the lower cermet substrate is subjected to silver plating, liquid metal is filled in the groove, and the chip is embedded into the liquid metal to realize electrical connection between the upper surface of the lower cermet substrate and the lower surface of the chip; an insulating sealing ring is arranged on the circuit board around the chip; and the liquid metal absorbs the lower cermet substrate and the upper printed circuit board together through surface tension.
    Type: Application
    Filed: February 24, 2025
    Publication date: August 28, 2025
    Applicant: CAMBRIDGE INTEGRATION LTD
    Inventors: Wei MU, Teng LONG, Ameer Hussein Abd JANABI
  • Patent number: 12343666
    Abstract: Filter media including out-of-plane solid elements are generally described. Inventive methods of forming them and uses thereof are also described.
    Type: Grant
    Filed: April 7, 2020
    Date of Patent: July 1, 2025
    Assignee: Hollingsworth & Vose Company
    Inventors: Mark Rowlands, James M. Witsch, Wei Mu, Stephan Daus
  • Publication number: 20230051258
    Abstract: Filter media comprising non-woven fiber webs having one or more advantageous physical properties are generally described. In some embodiments, a filter media and/or non-woven fiber web described herein comprises a combination of fibers that results in enhanced physical properties. For example, the non-woven fiber web may comprise a combination of fiber types that is advantageous, such as a combination comprising fibrillated fibers, glass fibers, and/or binder fibers. In some cases, the filter media and/or non-woven fiber web comprising the combination of fibers may be formed into undulations (e.g., by a creping and/or microcreping process) to further enhance the physical properties of the filter media and/or non-woven fiber.
    Type: Application
    Filed: June 22, 2022
    Publication date: February 16, 2023
    Applicant: Hollingsworth & Vose Company
    Inventors: Sudhakar Jaganathan, Xinquan Cheng, Howard Yu, Leilei Luo, Zhiping Jiang, Yu Liu, Mark Rowlands, Wei Mu, James M. Witsch, Stephan Daus
  • Publication number: 20230038185
    Abstract: Two major treatment strategies employed in fighting non-small cell lung cancer (NSCLC) are tyrosine kinase inhibitors (TKIs) and immune checkpoint inhibitors (ICIs). The choice of strategy is based on heterogeneous biomarkers expressed by the lung tumor tissue. A major challenge for molecular testing of these biomarkers is the insufficiency of biopsy specimens from patients with advanced NSCLC. Disclosed herein is a method for predicting a response to immune-checkpoint blockade immunotherapy.
    Type: Application
    Filed: December 7, 2020
    Publication date: February 9, 2023
    Inventors: Robert J. Gillies, Matthew B. Schabath, Wei MU
  • Patent number: 11532557
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Grant
    Filed: December 28, 2020
    Date of Patent: December 20, 2022
    Assignee: XI'AN JIAOTONG UNIVERSITY
    Inventors: Laili Wang, Fengtao Yang, Wei Mu, Dingkun Ma, Cheng Zhao, Jianpeng Wang
  • Publication number: 20210308609
    Abstract: Filter media including out-of-plane solid elements are generally described. Inventive methods of forming them and uses thereof are also described.
    Type: Application
    Filed: April 7, 2020
    Publication date: October 7, 2021
    Applicant: Hollingsworth & Vose Company
    Inventors: Mark Rowlands, James M. Witsch, Wei Mu, Stephan Daus
  • Publication number: 20210202386
    Abstract: Provided is a planar power module with a spatially interleaved structure, including a top power substrate, a bottom power substrate arranged opposite to the top power substrate, and a plurality of interleaved switch units configured between the top power substrate and the bottom power substrate; wherein adjacent interleaved switch units are electrically connected through a current commutator so that the interleaved switch units form spatial position interleaving. Problems of uneven parallel currents and uneven heat dissipation in the power module are solved.
    Type: Application
    Filed: December 28, 2020
    Publication date: July 1, 2021
    Inventors: Laili WANG, Fengtao YANG, Wei MU, Dingkun MA, Cheng ZHAO, Jianpeng WANG
  • Publication number: 20200154927
    Abstract: A catering and cooking device includes a machine body, a heating unit and/or a flow control unit, a control unit electrically connected to the heating unit and/or the flow control unit to control the heating unit and/or the flow control unit, and a network communication unit electrically connected to the control unit to receive processing process information to control water outlet time of a water reservoir. The catering and cooking device of the present invention receives processing process information corresponding to food via the network communication unit, controls the flow control unit to add liquid such as water or oil according to the received processing process information, and then controls the heating unit to heat according to a preset power map and heating time, the present invention can process different foods in a targeted manner.
    Type: Application
    Filed: January 22, 2020
    Publication date: May 21, 2020
    Applicant: Qing Dao YuanJian Holding Group limited
    Inventor: Wei MU
  • Patent number: 10141645
    Abstract: An antenna comprising first and second radiating elements disposed in a collinear configuration on a dielectric substrate, wherein the first radiating element comprises a feed point. A first inter-element phasing section is conductively coupled to the first and second radiating elements, and has a meander line configuration adapted such that the first and second radiating elements radiate electro-magnetic radiation in-phase over a first range of frequencies. Third and fourth radiating elements are disposed in a collinear configuration on the substrate, and the third radiating element is electromagnetically coupled in parasitic relation to the first radiating element. A second inter-element phasing section is conductively coupled to the third and fourth radiating elements, and has a meander line configuration adapted such that the third and fourth radiating elements radiate electromagnetic radiation in-phase over a second range of frequencies which is different from the first range of frequencies.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: November 27, 2018
    Assignee: RF INDUSTRIES PTY LTD
    Inventor: Wei Mu
  • Patent number: 9773045
    Abstract: Search results may include both objective results and person results. In one example, a search query is evaluated to determine whether it is the type of query that a user might want to ask to a friend. If the query is of such a type, then the search engine may examine a social graph to determine which friends of the user who entered the query may have information that is relevant to answering the query. If such friends exist, then the friends may be displayed along with objective search results, along with an explanation of each friend's relevance to the query. Clicking on a person in the results may cause a conversation to be initiated with that person, thereby allowing the user who entered the query to ask his or her friend about the subject of the query.
    Type: Grant
    Filed: September 17, 2013
    Date of Patent: September 26, 2017
    Assignee: Microsoft Technology Licensing, LLC
    Inventors: Sandy Wong, Wei Mu, Jun Yin, Rahul Nair, Simon King, Srinivasan Badrinarayanan, Xavier Legros, Michael Ching, Kevin Haas, Shubha Nabar
  • Publication number: 20170264019
    Abstract: An antenna comprising first and second radiating elements disposed in a collinear configuration on a dielectric substrate, wherein the first radiating element comprises a feed point. A first inter-element phasing section is conductively coupled to the first and second radiating elements, and has a meander line configuration adapted such that the first and second radiating elements radiate electro-magnetic radiation in-phase over a first range of frequencies. Third and fourth radiating elements are disposed in a collinear configuration on the substrate, and the third radiating element is electromagnetically coupled in parasitic relation to the first radiating element. A second inter-element phasing section is conductively coupled to the third and fourth radiating elements, and has a meander line configuration adapted such that the third and fourth radiating elements radiate electromagnetic radiation in-phase over a second range of frequencies which is different from the first range of frequencies.
    Type: Application
    Filed: October 24, 2016
    Publication date: September 14, 2017
    Inventor: Wei Mu
  • Patent number: 9643172
    Abstract: A metal loaded catalyst comprises a support and main active metal components and optional auxiliary active metal components, wherein the main active metal components are elementary substances and obtained by ionizing radiation reducing precursors of main active metal components. The catalyst can be widely used in the catalytic reactions of petrochemistry industry with high activity and selectivity. The catalyst can be used directly without being reduced preliminarily by hydrogen.
    Type: Grant
    Filed: October 16, 2015
    Date of Patent: May 9, 2017
    Assignees: China Petroleum & Chemical Corporation, Beijing Research Institute of Chemical Industry
    Inventors: Wei Dai, Jing Peng, Haibo Yu, Hui Peng, Genshuan Wei, Maolin Zhai, Zuwang Mao, Yi Le, Wei Mu, Haijiang Liu, Yunxian Zhu
  • Publication number: 20160344055
    Abstract: Disclosed herein are compositions comprising an oxidizer, water, and optionally a neutralizer, and methods of making and using the same. Also disclosed herein are compositions comprising biomass, a biomass-oxidizer, water, and optionally an accelerant, and methods of making and using the same.
    Type: Application
    Filed: January 17, 2015
    Publication date: November 24, 2016
    Inventors: Yulin DENG, Wei LIU, Wei MU
  • Patent number: 9349615
    Abstract: A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC chips are provided on the substrate, an adhesive film is disposed between each of the two IC chips and the substrate, the IC chips are connected to first pads on the substrate through bonding wires, and the substrate is covered by a mold cap. A third IC chip may be further disposed on one of the IC chips, and the third IC chip is connected to the first pad and the IC chip under the third IC chip respectively through a bonding wire. A substrate adopting a surface mount technology (SMT) PAD window-opening manner is used, chip mounting is performed on the substrate, and the substrate undergoes reflow soldering, cleaning, die bonding, plasma cleaning, bonding, marking, cutting, and packing, so that the SiP system-integration IC chip package is manufactured.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: May 24, 2016
    Assignee: TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
    Inventors: Jianyou Xie, Xizhou Li, Wei Mu, Yongzhong Wang, Haidong Wei
  • Publication number: 20160136635
    Abstract: A metal loaded catalyst comprises a support and main active metal components and optional auxiliary active metal components, wherein the main active metal components are elementary substances and obtained by ionizing radiation reducing precursors of main active metal components. The catalyst can be widely used in the catalytic reactions of petrochemistry industry with high activity and selectivity. The catalyst can be used directly without being reduced preliminarily by hydrogen.
    Type: Application
    Filed: October 16, 2015
    Publication date: May 19, 2016
    Applicants: CHINA PETROLEUM & CHEMICAL CORPORATION, BEIJING RESEARCH INSTITUTE OF CHEMICAL INDUSTRY, CHINA PETROLEUM & CHEMICAL CORPORATION
    Inventors: Wei DAI, Jing PENG, Haibo YU, Hui PENG, Genshuan WEI, Maolin ZHAI, Zuwang MAO, Yi LE, Wei MU, Haijiang LIU, Yunxian ZHU
  • Patent number: 9312242
    Abstract: A dense-pitch small-pad copper wire bonded double IC chip stack package comprises a plastic package body, in which a lead frame carrier and a frame lead inner pin are arranged; the upper surface of the lead frame carrier is fixedly connected with a first IC chip; a second IC chip is stacked on the first IC chip; the upper surface of the first IC chip and the upper surface of the second IC chip are respectively provided with a plurality of pads which are arranged as two lines of pad groups in parallel; the two pad groups are respectively a first pad group and a second pad group; a metal ball is implanted on each pad; each metal ball is connected with a first copper bonding ball; and a third copper bonding wire is formed by looping and arching on a corresponding metal ball between the second IC chip and the first IC chip.
    Type: Grant
    Filed: September 27, 2012
    Date of Patent: April 12, 2016
    Assignees: TIANSHUI HUATIAN TECHNOLOGY CO., LTD, HUATIAN TECHNOLOGY (XI'AN) CO., LTD.
    Inventors: Wei Mu, Xizhou Li, Xiaowei Guo
  • Patent number: 9275941
    Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.
    Type: Grant
    Filed: August 31, 2012
    Date of Patent: March 1, 2016
    Assignees: TIANSHUI HUATIAN TECHNOLOGY CO., HUATIAN TECHNOLOGY (XI'AN) CO., LTD.
    Inventors: Wenhui Zhu, Wei Mu, Zhaoming Xu, Xiaowei Guo
  • Patent number: 9210813
    Abstract: A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate.
    Type: Grant
    Filed: December 30, 2010
    Date of Patent: December 8, 2015
    Assignee: TIANSHUI HUATIAN TECHNOLOGY CO., LTD.
    Inventors: Jianyou Xie, Xiaowei Guo, Wenhai He, Wei Mu, Xin Chen