Abstract: An interface control circuit includes an interface signal transceiver circuit and a protection circuit. The interface signal transceiver circuit transmits and/or receives an interface signal through a transmission interface which includes at least a first interface pin. The protection circuit includes a switch and a comparison circuit. The switch controls a conduction between the first interface pin and a signal source. The comparison circuit senses a voltage of the first interface pin, and determines whether the voltage of the first interface pin is within a threshold voltage range which corresponds to a foreign object attachment event, whereby the interface signal transceiver circuit is triggered to execute a protection operation.

Abstract: Provided is an integral single-frame two-way headrest with a U-shaped single rod, comprising a U-shaped rod, an integral frame and a cover, the integral frame being externally covered with the cove, and the integral frame is hollow inside. An opening is arranged at a lower end of the integral frame, and an upper portion of the U-shaped rod is inserted into the inner frame from the opening, a plurality of positioning grooves is arranged on the right side of two downwardly extending ends of the U-shaped rod. A rod guide sleeve sleeved on both ends of the U-shaped rod is mounted at both ends of the opening, and the outer side of the integral frame is mounted with an unlocking steel wire corresponding to the positioning groove at both ends of the U-shaped rod, an unlocking lever connected with the unlocking steel wire and laterally movable is mounted in a hollow portion of the integral frame.

Abstract: An antenna comprising first and second radiating elements disposed in a collinear configuration on a dielectric substrate, wherein the first radiating element comprises a feed point. A first inter-element phasing section is conductively coupled to the first and second radiating elements, and has a meander line configuration adapted such that the first and second radiating elements radiate electro-magnetic radiation in-phase over a first range of frequencies. Third and fourth radiating elements are disposed in a collinear configuration on the substrate, and the third radiating element is electromagnetically coupled in parasitic relation to the first radiating element. A second inter-element phasing section is conductively coupled to the third and fourth radiating elements, and has a meander line configuration adapted such that the third and fourth radiating elements radiate electromagnetic radiation in-phase over a second range of frequencies which is different from the first range of frequencies.

Abstract: Search results may include both objective results and person results. In one example, a search query is evaluated to determine whether it is the type of query that a user might want to ask to a friend. If the query is of such a type, then the search engine may examine a social graph to determine which friends of the user who entered the query may have information that is relevant to answering the query. If such friends exist, then the friends may be displayed along with objective search results, along with an explanation of each friend's relevance to the query. Clicking on a person in the results may cause a conversation to be initiated with that person, thereby allowing the user who entered the query to ask his or her friend about the subject of the query.

Abstract: An antenna comprising first and second radiating elements disposed in a collinear configuration on a dielectric substrate, wherein the first radiating element comprises a feed point. A first inter-element phasing section is conductively coupled to the first and second radiating elements, and has a meander line configuration adapted such that the first and second radiating elements radiate electro-magnetic radiation in-phase over a first range of frequencies. Third and fourth radiating elements are disposed in a collinear configuration on the substrate, and the third radiating element is electromagnetically coupled in parasitic relation to the first radiating element. A second inter-element phasing section is conductively coupled to the third and fourth radiating elements, and has a meander line configuration adapted such that the third and fourth radiating elements radiate electromagnetic radiation in-phase over a second range of frequencies which is different from the first range of frequencies.

Abstract: A metal loaded catalyst comprises a support and main active metal components and optional auxiliary active metal components, wherein the main active metal components are elementary substances and obtained by ionizing radiation reducing precursors of main active metal components. The catalyst can be widely used in the catalytic reactions of petrochemistry industry with high activity and selectivity. The catalyst can be used directly without being reduced preliminarily by hydrogen.

Abstract: Disclosed herein are compositions comprising an oxidizer, water, and optionally a neutralizer, and methods of making and using the same. Also disclosed herein are compositions comprising biomass, a biomass-oxidizer, water, and optionally an accelerant, and methods of making and using the same.

Abstract: A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC chips are provided on the substrate, an adhesive film is disposed between each of the two IC chips and the substrate, the IC chips are connected to first pads on the substrate through bonding wires, and the substrate is covered by a mold cap. A third IC chip may be further disposed on one of the IC chips, and the third IC chip is connected to the first pad and the IC chip under the third IC chip respectively through a bonding wire. A substrate adopting a surface mount technology (SMT) PAD window-opening manner is used, chip mounting is performed on the substrate, and the substrate undergoes reflow soldering, cleaning, die bonding, plasma cleaning, bonding, marking, cutting, and packing, so that the SiP system-integration IC chip package is manufactured.

Abstract: A metal loaded catalyst comprises a support and main active metal components and optional auxiliary active metal components, wherein the main active metal components are elementary substances and obtained by ionizing radiation reducing precursors of main active metal components. The catalyst can be widely used in the catalytic reactions of petrochemistry industry with high activity and selectivity. The catalyst can be used directly without being reduced preliminarily by hydrogen.

Abstract: A dense-pitch small-pad copper wire bonded double IC chip stack package comprises a plastic package body, in which a lead frame carrier and a frame lead inner pin are arranged; the upper surface of the lead frame carrier is fixedly connected with a first IC chip; a second IC chip is stacked on the first IC chip; the upper surface of the first IC chip and the upper surface of the second IC chip are respectively provided with a plurality of pads which are arranged as two lines of pad groups in parallel; the two pad groups are respectively a first pad group and a second pad group; a metal ball is implanted on each pad; each metal ball is connected with a first copper bonding ball; and a third copper bonding wire is formed by looping and arching on a corresponding metal ball between the second IC chip and the first IC chip.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire. The IC chip, the passive device, and the crystal oscillator are adhered to the organic laminated substrate.

Abstract: A carrier-free land grid array (LGA) Integrated Circuit (IC) chip package and a preparation method thereof are provided. The IC chip package includes: an inner pin, an IC chip, a pad, a bonding wire, and a mold cap. The inner pin is designed to be a multi-row matrix form at a front side of the package, and is designed to be an exposed multi-row approximate square-shaped circular gold-plated contacts at a back side; the IC chip is provided on the inner pin, the inner pin is adhered to the IC chip with an adhesive film sheet, the pad on the IC chip is connected to the inner pin by the bonding wire, and the mold cap encircles the adhesive film sheet, the IC chip, the bonding wire, and edges of the inner pin, so as to form a whole circuit. The present invention adopts approximate square-shaped spherical array contacts, thereby having a simple and flexible structure, and achieving a desirable heat-dissipation effect. A cooper lead frame (L/F) has a high yield, and reduces the material cost.

Abstract: The present invention discloses a quad flat no lead package and a production method thereof. The quad flat no lead package comprises a lead frame carrier consisting of a carrier pit and three circles of leads arranged around the carrier pit, wherein the three circles of leads respectively consist of a plurality of leads that are disconnected mutually; an IC chip is adhered in the carrier pit; and an inner lead chemical nickel and porpezite plated layer is plated on all the leads; the inner lead chemical nickel and porpezite plated layer is arranged in the same direction as the IC chip; the IC chip is connected with the inner lead chemical nickel and porpezite plated layer through a bonding wire; and the IC chip, the ends of all the leads plated with the inner lead chemical plating nickel and palladium metal layers and the bonding wire are all packaged in a plastic package.

Abstract: A dense-pitch small-pad copper wire bonded double IC chip stack package comprises a plastic package body, in which a lead frame carrier and a frame lead inner pin are arranged; the upper surface of the lead frame carrier is fixedly connected with a first IC chip; a second IC chip is stacked on the first IC chip; the upper surface of the first IC chip and the upper surface of the second IC chip are respectively provided with a plurality of pads which are arranged as two lines of pad groups in parallel; the two pad groups are respectively a first pad group and a second pad group; a metal ball is implanted on each pad; each metal ball is connected with a first copper bonding ball; and a third copper bonding wire is formed by looping and arching on a corresponding metal ball between the second IC chip and the first IC chip.

Abstract: Search results may include both objective results and person results. In one example, a search query is evaluated to determine whether it is the type of query that a user might want to ask to a friend. If the query is of such a type, then the search engine may examine a social graph to determine which friends of the user who entered the query may have information that is relevant to answering the query. If such friends exist, then the friends may be displayed along with objective search results, along with an explanation of each friend's relevance to the query. Clicking on a person in the results may cause a conversation to be initiated with that person, thereby allowing the user who entered the query to ask his or her friend about the subject of the query.

Abstract: A carrier-free land grid array (LGA) Integrated Circuit (IC) chip package and a preparation method thereof are provided. The IC chip package includes: an inner pin, an IC chip, a pad, a bonding wire, and a mold cap. The inner pin is designed to be a multi-row matrix form at a front side of the package, and is designed to be an exposed multi-row approximate square-shaped circular gold-plated contacts at a back side; the IC chip is provided on the inner pin, the inner pin is adhered to the IC chip with an adhesive film sheet, the pad on the IC chip is connected to the inner pin by the bonding wire, and the mold cap encircles the adhesive film sheet, the IC chip, the bonding wire, and edges of the inner pin, so as to form a whole circuit. The present invention adopts approximate square-shaped spherical array contacts, thereby having a simple and flexible structure, and achieving a desirable heat-dissipation effect. A cooper lead frame (L/F) has a high yield, and reduces the material cost.

Abstract: Search results may include both objective results and person results. In one example, a search query is evaluated to determine whether it is the type of query that a user might want to ask to a friend. If the query is of such a type, then the search engine may examine a social graph to determine which friends of the user who entered the query may have information that is relevant to answering the query. If such friends exist, then the friends may be displayed along with objective search results, along with an explanation of each friend's relevance to the query. Clicking on a person in the results may cause a conversation to be initiated with that person, thereby allowing the user who entered the query to ask his or her friend about the subject of the query.

Abstract: A high-density Subscriber Identity Module (SIM) card package and a production method thereof are provided. The SIM card package includes a substrate, an Integrated Circuit (IC) chip, a bonding wire, and a mold cap. The substrate is a two-layer, a four-layer, a six-layer or an eight-layer high-density interlinked and packaged organic laminated substrate that is manufactured through an etching-back process, and a passive device and a crystal oscillator are provided on the organic laminated substrate. Two IC chips are provided side by side, or one of the IC chips is stacked with a third IC chip, the third IC chip being respectively connected to the organic laminated substrate and the IC chip under the third IC chip by the bonding wire.

Abstract: A system-in-package (SiP) system-integration integrated circuit (IC) chip package and a manufacturing method thereof are provided. The package includes a substrate, a passive device and two IC chips are provided on the substrate, an adhesive film is disposed between each of the two IC chips and the substrate, the IC chips are connected to first pads on the substrate through bonding wires, and the substrate is covered by a mold cap. A third IC chip may be further disposed on one of the IC chips, and the third IC chip is connected to the first pad and the IC chip under the third IC chip respectively through a bonding wire. A substrate adopting a surface mount technology (SMT) PAD window-opening manner is used, chip mounting is performed on the substrate, and the substrate undergoes reflow soldering, cleaning, die bonding, plasma cleaning, bonding, marking, cutting, and packing, so that the SiP system-integration IC chip package is manufactured.