Abstract: A first quality of service identifier is assigned to each subtask associated with each node of a compute workflow, the first quality of service identifier indicative of a level of quality of service associated with each node. A planned resource requirement is assigned to each subtask, the planned resource requirement indicative of a total amount of system resources required to complete each subtask. A resource allocation plan is generated for each subtask, the resource allocation plan indicative of a distribution of the system resources over time in at least one resource manager. The resource allocation plan and the first quality of service identifier are output to the at least one resource manager for enforcement of the level of quality of service on one or more jobs submitted for each node through at least one workflow orchestrator external to the at least one resource manager.

Abstract: An infrared thermopile sensor, an electronic device, and a method for fabricating an infrared thermopile sensor using a front-end process that employ example techniques in accordance with the present disclosure are described herein. In an implementation, the infrared thermopile sensor includes a silicon substrate that has been implanted during front-end processing to form an implant region; a passivation layer disposed on a first side of the silicon substrate, where the passivation layer forms a membrane; and an interlayer dielectric formed on the passivation layer, where the interlayer dielectric includes at least one thermopile that includes at least one thermocouple in series; and at least one metallic interconnect that electrically couples the at least one thermopile to a bond pad; and at least one bond pad interconnect that electrically couples the implant region to the bond pad.

Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A system includes a temperature sensor and a distance sensor. The distance sensor provides an indication of distance between the temperature sensor and an object to be measured. By determining the distance between the temperature sensor and the object, the system determines whether the object is sufficiently close to the temperature sensor to make an accurate temperature measurement, such as by determining whether the object completely fills the field of view of the sensor. In an implementation, the distance sensor includes a light source and a photodetector configured to detect light having wavelengths that correspond to those generated by the light source.

Abstract: A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Abstract: A sensor package can have a reference thermopile sensor and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: The present disclosure describes systems, methods, and devices for estimating spectral contributions in ambient light. The present disclosure also describes systems, methods, and devices for compensating for field of view errors resulting from the user, contextual structures (e.g., buildings, trees, fixtures, or geological formations), atmospheric effects (e.g., ozone coverage, smog, fog, haze, or clouds), device structures, and/or device orientation/tilt relative to a light source being measured (e.g., sun, indoor/outdoor light emitter, or an at least partially reflective surface). The present disclosure also describes systems, methods, and devices for estimating spectral contributions in light or color measurements and accounting for field of view errors to obtain a refined estimate.

Abstract: The present disclosure describes an ultraviolet (UV) sensor configured to detect a target UV spectrum (e.g., UVB spectrum). The UV sensor includes a first photodiode with a first UV spectral response and a second photodiode with a second UV spectral response. A filter layer having a graded spectral response is formed over the second photodiode, and the second UV spectral response is affected by a controlled parameter (e.g., thickness) of the filter layer. The UV sensor further includes a subtraction circuit coupled with the first photodiode and the second photodiode. The subtraction circuit is configured to provide a differential response based on a difference between the first UV spectral response and the second UV spectral response. The controlled parameter of the filter layer can be selected such that the differential response provides a detected spectral response of the target spectrum.

Abstract: A sensor device, a sensor package, and method for fabricating a sensor device are described that include an integrated light blocker disposed on the thermopile device and a lens configured to direct light to the thermopile device. In an implementation, the thermopile device includes a substrate; a thermopile membrane disposed on the substrate, the thermopile membrane including at least one passivation layer; a thermopile disposed within the thermopile membrane, the thermopile including at least one thermocouple; and a light blocking layer disposed proximate to the thermopile membrane, the light blocking layer including an aperture disposed proximate to the thermopile.

Abstract: A mobile sterilization assembly, a mobile sterilization device, and method for sterilization using a mobile sterilization device are described for providing a low-cost and compact sterilization system using an ultraviolet light-emitting diode for sterilization. In an implementation, a mobile sterilization assembly includes a sterilization assembly couplable to a mobile device with a controller, the sterilization assembly including at least one light dispersive element; and an optical coupler configured to couple the at least one light dispersive element to a mobile device; where the at least one light dispersive element at least one of transmits and disperses light from at least one light-emitting diode or transmits light to a photodiode, where the at least one light-emitting diode or the photodiode are configured to be communicatively coupled to the controller.

Abstract: The present disclosure is directed to a sensor package having a reference thermopile sensor, and a reference temperature sensor disposed therein to determine an ambient temperature. In one or more implementations, the sensor package includes a substrate having a substrate surface, a reference thermopile sensor disposed over the substrate surface, a reference temperature sensor disposed over the substrate surface, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a structure having a transparent portion that passes electromagnetic radiation occurring in a limited spectrum of wavelengths. The reference thermopile sensor generates a reference thermopile sensor signal representing a difference between a temperature of the substrate surface and a temperature of a lid assembly surface. An external ambient temperature can be determined based upon the reference thermopile sensor signal.

Abstract: The present disclosure describes an ultraviolet (UV) sensor configured to detect a target UV spectrum (e.g., UVB spectrum). The UV sensor includes a first photodiode with a first UV spectral response and a second photodiode with a second UV spectral response. A filter layer having a graded spectral response is formed over the second photodiode, and the second UV spectral response is affected by a controlled parameter (e.g., thickness) of the filter layer. The UV sensor further includes a subtraction circuit coupled with the first photodiode and the second photodiode. The subtraction circuit is configured to provide a differential response based on a difference between the first UV spectral response and the second UV spectral response. The controlled parameter of the filter layer can be selected such that the differential response provides a detected spectral response of the target spectrum.

Abstract: A sensor package having a thermopile sensor and a reference thermopile sensor disposed therein. In one or more implementations, the sensor package includes a substrate, a thermopile sensor disposed over the substrate, a reference thermopile sensor disposed over the substrate, and a lid assembly disposed over the thermopile sensor and the reference thermopile sensor. The lid assembly includes a transparent structure that passes electromagnetic radiation occurring in a limited spectrum of wavelengths and an electromagnetic blocker disposed over the lid assembly. The electromagnetic blocker defines an aperture over the thermopile sensor such that at least a portion of the electromagnetic blocker is positioned over the reference thermopile sensor. The electromagnetic blocker is configured to at least substantially block the electromagnetic radiation occurring in a limited spectrum of wavelengths from reaching the reference thermopile sensor.

Abstract: Electronic devices with a VCOM display panel are configured to provide a common voltage VCOM to a VCOM display panel backplane, referred to as a VCOM reference plane. The common voltage is supplied by a VCOM application circuit coupled to the VCOM reference plane. The VCOM application circuit includes a VCOM amplifier having a closed-loop gain. The VCOM application circuit is configurable to quickly adjust the closed-loop gain so as to adjust the settling characteristics of the common voltage VCOM output by the VCOM application circuit. The VCOM application circuit having adjustable closed-loop gain also reduces the amount of power to be dissipated, and therefore the amount of heat generation, in the VCOM amplifier.

Abstract: Electronic devices with a VCOM display panel are configured to provide a common voltage VCOM to a VCOM display panel backplane, referred to as a VCOM reference plane. The common voltage is supplied by a VCOM application circuit coupled to the VCOM reference plane. The VCOM application circuit includes a linear amplifier, such as a Class AB amplifier, coupled to a switched transient assist circuit configured to output the common voltage. The switched transient assist circuit stabilizes the amplifier in the presence of large transient output currents but with minimized power dissipation and heat rise in the amplifier.

Abstract: The present disclosure describes systems, methods, and devices for estimating spectral contributions in ambient light. The present disclosure also describes systems, methods, and devices for compensating for field of view errors resulting from the user, contextual structures (e.g., buildings, trees, fixtures, or geological formations), atmospheric effects (e.g., ozone coverage, smog, fog, haze, or clouds), device structures, and/or device orientation/tilt relative to a light source being measured (e.g., sun, indoor/outdoor light emitter, or an at least partially reflective surface). The present disclosure also describes systems, methods, and devices for estimating spectral contributions in light or color measurements and accounting for field of view errors to obtain a refined estimate.

Abstract: A temperature sensing device and method for fabrication of the temperature sensing device are described that include a second temperature sensor disposed on and/or in the lid assembly. In an implementation, the temperature sensing device includes a substrate, a ceramic structure disposed on the substrate, a thermopile disposed on the substrate, a first temperature sensor disposed on the substrate, and a lid assembly disposed on the ceramic structure, where the lid assembly includes a base layer, a first filter layer disposed on a first side of the base layer, a first metal layer disposed on a second side of the base layer, a passivation layer disposed on the first metal layer, where the passivation layer includes at least one of a second metal layer, a via, a metal plate, or an epoxy ring, and a second temperature sensor disposed on and/or in the passivation layer.

Abstract: Techniques are provided to furnish a light sensor that includes a filter positioned over a photodetector to filter visible and infrared wavelengths to permit the sensing of ultraviolet (UV) wavelengths. In one or more implementations, the light sensor comprises a semiconductor device (e.g., a die) that includes a substrate. A photodetector (e.g., photodiode, phototransistor, etc.) is formed in the substrate proximate to the surface of the substrate. In one or more implementations, the substrate comprises a silicon on insulator substrate (SOI). A filter (e.g., absorption filter, interference filter, flat pass filter, McKinlay-Diffey Erythema Action Spectrum-based filter, UVA/UVB filter, and so forth) is disposed over the photodetector. The filter is configured to filter infrared light and visible light from light received by the light sensor to at least substantially block infrared light and visible light from reaching the photodetector.

Abstract: The invention provides novel pyrimidine and pyridine derivatives and pharmaceutical compositions thereof, and methods for using such compounds. For example, the pyrimidine and pyridine derivatives of the invention may be used to treat, ameliorate or prevent a condition which responds to inhibition of anaplastic lymphoma kinase (ALK) activity, focal adhesion kinase (FAK), zeta-chain-associated protein kinase 70 (ZAP-70), insulin-like growth factor (IGF-1R), or a combination thereof.