Patents by Inventor Wei-Sheng Yun
Wei-Sheng Yun has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240105454Abstract: A method for manufacturing a semiconductor device is described. The method includes the following steps. A low-dimensional material (LDM) layer is formed on a semiconductor substrate, wherein the LDM layer includes sublayers stacked upon one another. A plasma treatment is performed to the LDM layer to transform at least one sublayer into an oxide layer, wherein the plasma treatment is performed under a temperature equivalent to or lower than about 80 degrees Celsius. At least one electrode is disposed over the oxide layer.Type: ApplicationFiled: March 2, 2023Publication date: March 28, 2024Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Tung-Ying Lee, Wei-Sheng Yun, Yi-Tse HUNG, Shao-Ming YU, Meng-Zhan Li
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Patent number: 11935958Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first stacked nanostructure and a second stacked nanostructure formed over a substrate. The semiconductor device structure includes a first gate structure formed over the first stacked nanostructure, and the first gate structure includes a first portion of a gate dielectric layer and a first portion of a filling layer. The semiconductor device structure includes a second gate structure formed over the second stacked nanostructure, and the second gate structure includes a second portion of the gate dielectric layer and a second portion of the filling layer. The semiconductor device structure includes a first isolation layer between the first gate structure and the second gate structure, wherein the first isolation layer has an extending portion which is formed in a recess between the gate dielectric layer and the filling layer.Type: GrantFiled: March 27, 2023Date of Patent: March 19, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chao Lin, Wei-Sheng Yun, Tung-Ying Lee
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Publication number: 20230411215Abstract: A method of manufacturing a semiconductor device includes forming a first semiconductor layer having a first composition over a semiconductor substrate, and forming a second semiconductor layer having a second composition over the first semiconductor layer. Another first semiconductor layer having the first composition is formed over the second semiconductor layer. A third semiconductor layer having a third composition is formed over the another first semiconductor layer. The first semiconductor layers, second semiconductor layer, and third semiconductor layer are patterned to form a fin structure. A portion of the third semiconductor layer is removed thereby forming a nanowire comprising the second semiconductor layer, and a conductive material is formed surrounding the nanowire. The first semiconductor layers, second semiconductor layer, and third semiconductor layer include different materials.Type: ApplicationFiled: July 28, 2023Publication date: December 21, 2023Inventors: Shao-Ming YU, Tung Ying LEE, Wei-Sheng YUN, Fu-Hsiang YANG
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Publication number: 20230386936Abstract: A semiconductor structure includes a fin disposed on a substrate, the fin including a channel region comprising a plurality of channels vertically stacked over one another, the channels comprising germanium distributed therein. The semiconductor structure further includes a gate stack engaging the channel region of the fin and gate spacers disposed between the gate stack and the source and drain regions of the fin, wherein each channel of the channels includes a middle section wrapped around by the gate stack and two end sections engaged by the gate spacers, wherein a concentration of germanium in the middle section of the channel is higher than a concentration of germanium in the two end sections of the channel, and wherein the middle section of the channel further includes a core portion and an outer portion surrounding the core portion with a germanium concentration profile from the core portion to the outer portion.Type: ApplicationFiled: August 7, 2023Publication date: November 30, 2023Inventors: Wei-Sheng Yun, Chih-Hao Wang, Jui-Chien Huang, Kuo-Cheng Chiang, Chih-Chao Chou, Chun-Hsiung Lin, Pei-Hsun Wang
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Patent number: 11776852Abstract: A method of manufacturing a semiconductor device includes forming a first semiconductor layer having a first composition over a semiconductor substrate, and forming a second semiconductor layer having a second composition over the first semiconductor layer. Another first semiconductor layer having the first composition is formed over the second semiconductor layer. A third semiconductor layer having a third composition is formed over the another first semiconductor layer. The first semiconductor layers, second semiconductor layer, and third semiconductor layer are patterned to form a fin structure. A portion of the third semiconductor layer is removed thereby forming a nanowire comprising the second semiconductor layer, and a conductive material is formed surrounding the nanowire. The first semiconductor layers, second semiconductor layer, and third semiconductor layer include different materials.Type: GrantFiled: June 14, 2021Date of Patent: October 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Shao-Ming Yu, Tung Ying Lee, Wei-Sheng Yun, Fu-Hsiang Yang
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Publication number: 20230268418Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.Type: ApplicationFiled: May 1, 2023Publication date: August 24, 2023Inventors: Kuo-Cheng CHIANG, Chen-Feng HSU, Chao-Ching CHENG, Tzu-Chiang CHEN, Tung Ying LEE, Wei-sheng YUN, Yu-Lin YANG
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Publication number: 20230263081Abstract: A semiconductor structure includes a first dielectric layer, an electrode in the first dielectric layer, a second dielectric layer in the electrode, and a phase change material over the first dielectric layer, the electrode, and the second dielectric layer. According to some embodiments, an uppermost surface of the electrode is at least one of above an uppermost surface of the first dielectric layer, above an uppermost surface of the second dielectric layer, or above a lowermost surface of the phase change material.Type: ApplicationFiled: February 15, 2022Publication date: August 17, 2023Inventors: Kerem Akarvardar, Yu Chao LIN, Wei-Sheng Yun, Shao-Ming Yu, Tzu-Chiang Chen, Tung Ying Lee
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Patent number: 11721594Abstract: A semiconductor structure includes a fin disposed on a substrate, the fin including a channel region comprising a plurality of channels vertically stacked over one another, the channels comprising germanium distributed therein. The semiconductor structure further includes a gate stack engaging the channel region of the fin and gate spacers disposed between the gate stack and the source and drain regions of the fin, wherein each channel of the channels includes a middle section wrapped around by the gate stack and two end sections engaged by the gate spacers, wherein a concentration of germanium in the middle section of the channel is higher than a concentration of germanium in the two end sections of the channel, and wherein the middle section of the channel further includes a core portion and an outer portion surrounding the core portion with a germanium concentration profile from the core portion to the outer portion.Type: GrantFiled: June 8, 2022Date of Patent: August 8, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTDInventors: Wei-Sheng Yun, Chih-Hao Wang, Jui-Chien Huang, Kuo-Cheng Chiang, Chih-Chao Chou, Chun-Hsiung Lin, Pei-Hsun Wang
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Publication number: 20230238451Abstract: A device includes a plurality of semiconductor fins extending from a substrate. A plurality of first source/drain regions are epitaxially grown from first regions of the semiconductor fins. Adjacent two of the plurality of first source/drain regions grown from adjacent two of the plurality of semiconductor fins are spaced apart by an isolation dielectric. A gate structure laterally surrounds second regions of the plurality of semiconductor fins above the first regions of the plurality of semiconductor fins. A plurality of second source/drain regions are over third regions of the plurality of semiconductor fins above the second regions of the plurality of semiconductor fins.Type: ApplicationFiled: April 3, 2023Publication date: July 27, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Sheng YUN, Shao-Ming YU, Tung-Ying LEE, Chih-Chieh YEH
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Publication number: 20230231054Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first stacked nanostructure and a second stacked nanostructure formed over a substrate. The semiconductor device structure includes a first gate structure formed over the first stacked nanostructure, and the first gate structure includes a first portion of a gate dielectric layer and a first portion of a filling layer. The semiconductor device structure includes a second gate structure formed over the second stacked nanostructure, and the second gate structure includes a second portion of the gate dielectric layer and a second portion of the filling layer. The semiconductor device structure includes a first isolation layer between the first gate structure and the second gate structure, wherein the first isolation layer has an extending portion which is formed in a recess between the gate dielectric layer and the filling layer.Type: ApplicationFiled: March 27, 2023Publication date: July 20, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Yu-Chao LIN, Wei-Sheng YUN, Tung-Ying LEE
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Patent number: 11677010Abstract: In a method of manufacturing a semiconductor device, a fin structure, in which first semiconductor layers and second semiconductor layers are alternately stacked, is formed. A sacrificial gate structure is formed over the fin structure. A source/drain region of the fin structure, which is not covered by the sacrificial gate structure, is etched, thereby forming a source/drain space. The first semiconductor layers are laterally etched through the source/drain space. An inner spacer made of a dielectric material is formed on an end of each of the etched first semiconductor layers. A source/drain epitaxial layer is formed in the source/drain space to cover the inner spacer. A lateral end of each of the first semiconductor layers has a V-shape cross section after the first semiconductor layers are laterally etched.Type: GrantFiled: October 26, 2020Date of Patent: June 13, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Kuo-Cheng Chiang, Chen-Feng Hsu, Chao-Ching Cheng, Tzu-Chiang Chen, Tung Ying Lee, Wei-Sheng Yun, Yu-Lin Yang
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Publication number: 20230121202Abstract: A semiconductor structure is provided. The semiconductor structure includes a semiconductor fin. The semiconductor structure also includes a first nanowire vertically overlapping a top surface of the semiconductor fin, a second nanowire vertically overlapping the first nanowire, and a third nanowire vertically overlapping the second nanowire. The semiconductor structure further includes a gate wrapping around the first nanowire, the second nanowire, and the third nanowire. A first portion of the gate vertically sandwiched between the first nanowire and the second nanowire is greater than a second portion of the gate vertically sandwiched between the second nanowire and the third nanowire.Type: ApplicationFiled: December 15, 2022Publication date: April 20, 2023Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Meng-Hsuan HSIAO, Wei-Sheng YUN, Winnie Victoria Wei-Ning CHEN, Tung Ying LEE, Ling-Yen YEH
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Patent number: 11621344Abstract: A device includes a semiconductor fin, a first epitaxy structure and a gate stack. The semiconductor fin protrudes from a substrate. The first epitaxy feature laterally surrounds a first portion of the semiconductor fin. The gate stack laterally surrounds a second portion of the semiconductor fin above the first portion of the semiconductor fin, wherein the second portion of the semiconductor fin has a lower surface roughness than the first epitaxy feature.Type: GrantFiled: October 7, 2020Date of Patent: April 4, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Wei-Sheng Yun, Shao-Ming Yu, Tung-Ying Lee, Chih-Chieh Yeh
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Patent number: 11616146Abstract: A semiconductor device structure is provided. The semiconductor device structure includes a first stacked nanostructure and a second stacked nanostructure formed over a substrate. The semiconductor device structure includes a first gate structure formed over the first stacked nanostructure, and the first gate structure includes a first portion of a gate dielectric layer and a first portion of a filling layer. The semiconductor device structure includes a second gate structure formed over the second stacked nanostructure, and the second gate structure includes a second portion of the gate dielectric layer and a second portion of the filling layer. The semiconductor device structure includes a first isolation layer between the first gate structure and the second gate structure, and a sidewall of the first portion of the gate dielectric layer extends beyond a sidewall of the filling layer.Type: GrantFiled: April 26, 2022Date of Patent: March 28, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Yu-Chao Lin, Wei-Sheng Yun, Tung-Ying Lee
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Patent number: 11605562Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes a plurality of fins on a substrate. A fin end spacer is formed on an end surface of each of the plurality of fins. An insulating layer is formed on the plurality of fins. A source/drain epitaxial layer is formed in a source/drain space in each of the plurality of fins. A gate electrode layer is formed on the insulating layer and wrapping around the each channel region. Sidewall spacers are formed on the gate electrode layer.Type: GrantFiled: January 4, 2021Date of Patent: March 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Tung Ying Lee, Tzu-Chung Wang, Kai-Tai Chang, Wei-Sheng Yun
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Publication number: 20230061475Abstract: A memory array includes a first bit-line stack disposed over a substrate, a first spacer, a first data storage structure, and a word line. The first bit-line stack includes a first bit line disposed over the substrate; and a first hard mask layer partially covering a top surface of the first bit line. The first spacer is disposed on a lower sidewall of a first sidewall of the first bit line. The first hard mask layer and the first spacer expose a top corner of the first bit line. The first data storage structure covers the top corner of the first bit line. The word line covers a sidewall of the first data storage structure.Type: ApplicationFiled: August 30, 2021Publication date: March 2, 2023Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.Inventor: Wei-Sheng Yun
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Patent number: 11594615Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.Type: GrantFiled: March 29, 2021Date of Patent: February 28, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Chao-Ching Cheng, Yu-Lin Yang, Wei-Sheng Yun, Chen-Feng Hsu, Tzu-Chiang Chen
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Patent number: 11581421Abstract: A semiconductor device and a method of manufacturing the same are disclosed. The semiconductor device includes semiconductor wires disposed over a substrate, a source/drain epitaxial layer in contact with the semiconductor wires, a gate dielectric layer disposed on and wrapping around each channel region of the semiconductor wires, a gate electrode layer disposed on the gate dielectric layer and wrapping around the each channel region, and dielectric spacers disposed in recesses formed toward the source/drain epitaxial layer.Type: GrantFiled: June 21, 2021Date of Patent: February 14, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Chao-Ching Cheng, Yu-Lin Yang, Wei-Sheng Yun, Chen-Feng Hsu, Tzu-Chiang Chen
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Patent number: 11545582Abstract: A method for forming a gate-all-around structure is provided. The method includes forming a plurality of a first type of semiconductor layers and a plurality of a second type of semiconductor layers alternately stacked over a fin. The first type of semiconductor layers includes a first semiconductor layer and a second semiconductor layer, and the first semiconductor layer has a thickness greater than that of the second semiconductor layer. The method also includes removing the second type of semiconductor layers. In addition, the method includes forming a gate to wrap around the first type of semiconductor layers.Type: GrantFiled: November 2, 2020Date of Patent: January 3, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Meng-Hsuan Hsiao, Wei-Sheng Yun, Winnie Victoria Wei-Ning Chen, Tung Ying Lee, Ling-Yen Yeh
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Patent number: 11532521Abstract: A semiconductor structure includes a first fin, which includes a first plurality of suspended nanostructures vertically stacked over one another, each of the first plurality of suspended nanostructure having a center portion that has a first cross section, and a second fin, which includes a second plurality of suspended nanostructures vertically stacked over one another, the first plurality of suspended nanostructures and the second plurality of suspended nanostructures having different material compositions, each of the second plurality of suspended nanostructure having a center portion that has a second cross section, wherein a shape or an area of the first cross section is different from that of the second cross section.Type: GrantFiled: December 7, 2020Date of Patent: December 20, 2022Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Wei-Sheng Yun, Chih-Hao Wang, Jui-Chien Huang, Kuo-Cheng Chiang, Chih-Chao Chou, Chun-Hsiung Lin, Pei-Hsun Wang