Abstract: The disclosure provides data transmission methods and apparatuses. One example method includes when the terminal device needs to perform the cross-network movement, the terminal device sends a message to a network element of a network accessed by the terminal device, to notify that the terminal device is to perform the cross-network movement from a source network to a target network. Therefore, during the movement of the terminal device, a network side pauses transmission of user plane data of the terminal device, and buffers data that is not sent before the terminal device performs the cross-network movement. After accessing the target network, the network side sends the buffered data to the terminal device.

Abstract: A multi-tag concurrent identification method and a system for a query tree based on feature groups are provided in this disclosure. In the disclosure, a whole data string space is divided into a plurality of disjoint subsets according to features of data strings returned by tags, where each of the subsets contains several different data strings, each of the data strings in the each of the subsets is regarded as a complete tag ID or a partial ID, and the each of the subsets corresponds to a unique query prefix, a length of the prefix is fixed and does not dynamically increase with an actual location of a collision, and when multiple data strings from a same subset return at a same time, a reader is capable of identifying them at a same time in a slot.

Abstract: The present disclosure relates to data transmission methods and apparatus to implement quality of service (QoS) flow-based data transmission in an architecture in which a central unit-control plane (CU-CP) and a central unit-user plane (CU-UP) are separated from each other. In one example method, when receiving data of a QoS flow, the CU-UP may send a QoS flow identity (ID) and a protocol data unit (PDU) session ID that are of the data of the QoS flow to the CU-CP, where a PDU session corresponding to the PDU session ID includes the data of the QoS flow.

Abstract: A method for modulating a threshold voltage of a device. The method includes providing a fin extending from a substrate, where the fin includes a plurality of semiconductor channel layers defining a channel region for a P-type transistor. In some embodiments, the method further includes forming a first gate dielectric layer surrounding at least three sides of each of the plurality of semiconductor channel layers of the P-type transistor. Thereafter, the method further includes forming a P-type metal film surrounding the first gate dielectric layer. In an example, and after forming the P-type metal film, the method further includes annealing the semiconductor device. After the annealing, and in some embodiments, the method includes removing the P-type metal film.

Abstract: An ultrasound imaging method and system. The method comprises: for each of a plurality of steer angles, including a reference steer angle, transmitting acoustic energy to a target region at the particular steer angle, receiving acoustic reflections, and converting the acoustic reflections to an image, with the image being associated with the particular steer angle; computing motion information based on the image associated with the reference steer angle; and generating a compounded ultrasound image based on the image associated with each of the plurality of steer angles and based on the motion information.

Abstract: An analog input device including at least one mounting panel and a matrix of analog push button assemblies mounted thereon. Each analog push button assembly including an analog pressure sensor including a pressure reception arrangement having an optical sensing sub-arrangement configured to measure an amount of light varied according to a pressure sensed at the pressure reception arrangement and an output terminal for outputting an analog signal corresponding to the amount of light measured, and a plunger element configured to exert the pressure on the pressure reception arrangement. The analog input device may include a multiplexer including an input side coupled to the push button assemblies and an output side; an analog-to-digital converter coupled to the output side of the multiplexer; a processor coupled to the analog-to-digital converter and configured to output a data packet; and a communication interface configured to transmit the data packet to a host computing device.

Abstract: A magnetic apparatus includes a first magnetic member, a second magnetic member, a first winding, and a second winding, where the first magnetic member includes a first magnetic cylinder, a second magnetic cylinder, a third magnetic cylinder, and at least one fourth magnetic cylinder, and where the first winding is wound around the first magnetic cylinder and the second magnetic cylinder, the second winding is wound around the first magnetic cylinder and the third magnetic cylinder, and a direction in which the first winding is wound around the second magnetic cylinder is opposite to a direction in which the second winding is wound around the third magnetic cylinder.

Abstract: Methods, systems and computer program products for data fetching in a networked computing environment. In one embodiment, the method comprises receiving a request from an analytical node for a set of data for a defined job, and identifying in networked storage a subset of the data for the job. The subset of data is loaded to the analytical node based on the sequence in which the data are projected to be accessed in the job. In an embodiment, the request includes a specification for the job, and the specification is analyzed to identify the subset of data. In one embodiment, the subset of data is identified by identifying another job having a relationship to the defined job, and identifying the data used for that other job. In an embodiment, the networked computing environment is a cloud computing environment, and the defined job is an analytics job.

Abstract: An electronic device including a bracket and an antenna is provided. The bracket includes first, second, third, and fourth surfaces. The antenna includes a radiator. The radiator includes first, second, third, and fourth portions. The first portion is located on the first surface and includes connected first and second sections. The second portion is located on the second surface and includes third, fourth, fifth, and sixth sections. The third section, the fourth section, and the fifth sections are bent and connected to form a U shape. The third portion is located on the third surface and is connected to the second section and the fourth section. The fourth portion is located on the fourth surface and is connected to the fifth section, the sixth section, and the third portion. The radiator is adapted to resonate at a low frequency band and a first high frequency band.

Abstract: Disclosed are a device and method for detecting defects of a high-voltage cable cross-bonded grounding system. The method comprises: selecting a protective grounding box of a cross-bonded grounding system, respectively connecting a signal excitation coupler to A-phase, B-phase and C-phase coaxial cables of the protective grounding box, selecting a stable signal with a frequency different from a power frequency or a field interference frequency, and testing effective current values and phases responded by the A-phase, B-phase and C-phase coaxial cables when the stable signal with the frequency F1 is injected into the A-phase, B-phase and C-phase coaxial cables of the protective grounding box in a coupled manner; and obtaining resistances and inductances of branch circuits of the cable cross-bonded grounding system by calculation according to measurement data, and determining if the cable cross-bonded grounding system has a connection defect.

Abstract: The present invention relates to a medical implant, and more particularly, to a vascular implant having a dual coating structure for preventing in-stent restenosis and thrombosis. In one embodiment, the invention contemplates a vascular stent with a coating comprising a hydrophobic, degradable core with a coaxial sheath comprising at least one polyethylene-glycol derivative. In one embodiment, the at least one polyethylene-glycol derivative comprises polyethylene-glycol dimethacrylate.

Abstract: Implementations of the present specification provide a method and an apparatus for managing a TLB cache in a virtualization platform, where the virtualization platform runs a plurality of virtual machines, each virtual machine is allocated with a unique VPID, and all virtual logical processors in the virtual machine share the VPID; and a guest process running in the virtual machine is allocated with a PCID. An identifier field of a TLB entry in the TLB cache includes a VPID and a PCID.

Abstract: Implementations of a method of forming a semiconductor package may include forming a plurality of notches into a first side of a wafer, the first side of the wafer including a plurality of electrical contacts. The method may also include coating the first side of the wafer and an interior of the plurality of notches with a molding compound, grinding a second side of the wafer to thin the wafer to a desired thickness, forming a back metal on a second side of the wafer, exposing the plurality of electrical contacts through grinding a first side of the molding compound, and singulating the wafer at the plurality of notches to form a plurality of semiconductor packages.

Abstract: An audio signal processing method, an audio signal processing apparatus, a computer device and a storage medium are provided. The audio signal processing method includes acquiring, by using the voice registration module based on a first audio signal, a first hidden state corresponding to a voice registration module is acquired, and, extracting, based on the first hidden state, a target audio signal from a second audio signal.

Abstract: A spectrometer and a fabrication method thereof. The spectrometer includes: a first base substrate; a second base substrate opposite to the first base substrate; a detection channel between the first base substrate and the second base substrate; a quantum dot light emitting layer on a side of the first base substrate that is close to the second base substrate, and including a plurality of quantum dot light emitting units; a black matrix on the side of the first base substrate that is close to the second base substrate, and configured to separate the plurality of quantum dot light emitting units; and a sensor layer, including a plurality of sensors, the plurality of sensors being in one-to-one correspondence with the plurality of quantum dot light emitting units.

Abstract: A processor device has a CPU cooperating with an input device and an output device, under control of stored instructions, and is arranged to receive service requests at the input device, assign service requests received in successive time periods to respective batches of requests; access stored service provider data to identify available service providers from among a pool of service providers; after completing the assignment of service requests to a batch, perform a matching process to endeavour to match each service request of the batch of requests to a service provider; and for each service provider to whom a match is made, output a notification of the respective potential match from the output device.

Abstract: Embodiments of methods and apparatus for reducing warpage of a substrate are provided herein. In some embodiments, a method for reducing warpage of a substrate includes: applying an epoxy mold over a plurality of dies on the substrate in a dispenser tool; placing the substrate on a pedestal in a curing chamber, wherein the substrate has an expected post-cure deflection in a first direction; inducing a curvature on the substrate in a direction opposite the first direction; and curing the substrate by heating the substrate in the curing chamber.

Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: An electronic device includes a metal back cover, a metal frame, a first antenna module and a second antenna module. The metal frame includes a first and a second disconnection portion, a first and a second connection portion. The first and the second connection portion are connected to the metal back cover. The first disconnection portion is separated from the first connection portion, the metal back cover and the second disconnection portion to form a first slot. The second disconnection portion is connected to the second connection portion and is separated from the metal back cover to form a second slot. The first antenna module is connected to the first disconnection portion, and forms a first antenna path. The second antenna module is connected to the second disconnection portion, and forms a second and a third antenna path with the second disconnection portion and the metal back cover.

Abstract: A semiconductor device assembly includes a semiconductor die and a substrate coupled to the semiconductor die. The substrate includes a primary conductive layer including a first surface of the substrate and a first solder mask layer coupled to the first surface. The substrate also includes a secondary conductive layer including a second surface of the substrate and a second solder mask layer coupled to the second surface. The substrate further includes an inner conductive layer positioned between the primary layer and the secondary layer, where the inner layer includes a bond pad positioned at the end of an opening that extends from the second solder mask layer through the secondary layer to the bond pad of the inner layer. By attaching a solder ball to the bond pad of the inner layer, standoff height is reduced.