Abstract: A method of preventing a collision of a subject wellbore in a downhole environment includes receiving offset wellbore data corresponding with one or more offset wellbores and identifying, based on the offset wellbore data, one or more no-go zones for each of the one or more offset wellbores. The method further includes determining a plurality of safe points corresponding with a potential intersection of the subject wellbore with the one or more no-go zones and, defining an escape zone within the plurality of safe points. The method further includes determining a trajectory for the subject wellbore within the escape zone.

Abstract: Provided is a segmented bending section assembly for a disposable ureteroscope, including a bending sectional tube, elastic tubes, and traction cables. Multiple U-shaped limiting grooves arranged in an axial direction of the bending sectional tube are formed in a side wall of a tail portion of the bending sectional tube. An end portion of each of the elastic tubes abuts against a bottom wall of each U-shaped limiting groove, a side wall of the elastic tube abuts against an inside wall of the U-shaped limiting groove, and the elastic tube is welded to the U-shaped limiting groove. A tube body of the bending sectional tube is internally provided with multiple wire-passing channels for the traction cables to pass through, and the traction cable penetrates through the elastic tube and the wire-passing channel and then are fixedly connected to a front end of the bending sectional tube.

Abstract: A test strip comprising a porous matrix, the test strip includes a sample application zone for applying a liquid sample including an analyte; a reporter release zone, having a sensing material, the sensing material being adapted to selectively interact with the analyte by releasing an optical reporter, the reporter release zone being arranged downstream of the sample application zone; and a detection zone, having a capture material, the capture material being adapted to selectively bind the optical reporter and being arranged downstream of the reporter release zone.

Abstract: Embodiments of the present application disclose a semiconductor structure, a formation method thereof and a memory. The semiconductor structure includes: a substrate; a channel located in the substrate, the channel being configured to form a gate structure; and a convex portion arranged on an inner wall of the channel. The embodiments of the present application can increase a channel length and solve a short-channel effect.

Abstract: A current limiter and a charge pump regulator including the current limiter are provided. The charge pump regulator converts an input voltage to an output voltage and includes a feedback loop including a first transistor for regulating a discharge current from the charge pump regulator. The current limiter limits the current provided by the charge pump regulator. The current limiter includes a sampling block configured to sample a first drain-source voltage of the first transistor and hold it as a reference drain-source voltage; an adaptive tracking block configured to receive the reference drain-source voltage, and to generate a maximum voltage based on the reference drain-source voltage, so that the maximum voltage tracks the reference drain-source voltage; and a voltage clamp block configured to clamp a feedback voltage to the maximum voltage, and to provide the clamped voltage as a first gate-source voltage of the first transistor.

Abstract: A semiconductor structure and a method for forming the same are provided. The method includes: providing a semiconductor substrate; determining a position of a bit line contact opening on a top surface of the semiconductor substrate and a top surface of a first dielectric layer; etching an active region, the first dielectric layer and an isolation structure exposed by the bit line contact opening according to the position of the bit line contact opening until the active region is etched to a preset depth to form a bit line contact window; and forming a second dielectric layer on a surface of the isolation structure and a surface of the first dielectric layer that have a depth greater than a depth of a surface of the active region in the bit line contact window.

Abstract: This application relates to a machine learning model training method and apparatus, and an expression image classification method and apparatus. The machine learning model training method includes: obtaining a machine learning model that includes a model parameter and that is obtained through training according to a general-purpose image training set; determining a sample of a special-purpose image and a corresponding classification label; inputting the sample of the special-purpose image to the machine learning model, to obtain an intermediate classification result; and adjusting the model parameter of the machine learning model according to a difference between the intermediate classification result and the classification label, continuing training, and ending the training in a case that a training stop condition is met. The solutions provided in this application improve the training efficiency of the machine learning model.

Abstract: Disclosed are a device control method and apparatus, an electronic device and a readable storage medium. The device control method includes steps: acquiring real-time picture data, and identifying the real-time picture data to obtain device information of a to-be-controlled device in the real-time picture data; displaying a control module corresponding to the device information; and receiving a setting instruction triggered based on the control module, and sending a control signal corresponding to the setting instruction to the to-be-controlled device.

Abstract: A camera lens module includes an image sensor and a sandwiched lens structure formed over the image sensor, the sandwiched lens structure including a layer lens between a first glass substrate and a second glass substrate, and a baffle formed between the layer lens and the first glass substrate or between the layer lens and the second glass substrate.

Abstract: A multiple-lens optical fingerprint reader for reading fingerprints through a display has an image sensor integrated circuit with photosensor array(s); a spacer; and multiple lenses in a microlens array, each lens of multiple lenses focuses light arriving at that lens from a finger adjacent the display through the spacer to form an image on associated photosensors on a photosensor array of the integrated circuit. A method of verifying identity of a user includes illuminating a finger of the user with an OLED display; focusing light from the fingerprint through arrayed microlenses onto a photosensor array of an integrated circuit, reading the array to overlapping electronic fingerprint images; extracting features from the overlapping electronic fingerprint images or from a stitched fingerprint image, and comparing the features to features of at least one user in a library of features and associated with one or more fingers of one or more authorized users.

Abstract: Disclosed are a device identification method and apparatus, an electronic device and a readable storage medium. The device identification method includes steps: receiving an identification instruction, and acquiring device characteristic information corresponding to the identification instruction; determining a target device corresponding to the device characteristic information among connected devices; and sending an indication signal corresponding to the target device to the target device, so as to enable the target device to execute an indication operation corresponding to the indication signal.

Abstract: A method for manufacturing the semiconductor structure includes: providing a substrate, in which active regions and isolation regions are formed; forming grooves in the active regions, which include first grooves located at upper portions and second grooves located at lower portions and communicating with the first grooves, and a width of the first grooves is greater than a width of the second grooves; and forming gate structures in the first grooves and the second grooves.

Abstract: An electrical connector including an insulating body, a first metallic member, a second metallic member, a plurality of terminals, and a metallic shell is provided. The insulating body has a base portion, a thickened step portion, and a tongue portion. The thickened step portion is located at a root of the base portion. The first metallic member and the second metallic member are disposed on an upper surface and a lower surface of the insulating body. The metallic shell is disposed on an exterior of the insulating body to surround the first metallic member, the second metallic member, and the terminals, wherein the front flat contact portion of each of the terminals is exposed out of the tongue portion, and a portion of the first metallic member and a portion of the second metallic member are exposed out of the thickened step portion.

Abstract: This application provides a semiconductor switch device and a preparation method thereof, and a solid-state phase shifter. The semiconductor switch device includes a second semiconductor layer, a first intrinsic layer, a first semiconductor layer, a second intrinsic layer, and a third semiconductor layer that are stacked in a sandwich structure. The first intrinsic layer is located between the second semiconductor layer and the first semiconductor layer, and the first intrinsic layer, the second semiconductor layer, and the first semiconductor layer form a first PIN diode. The second intrinsic layer is located between the third semiconductor layer and the first semiconductor layer, and the second intrinsic layer, the third semiconductor layer, and the first semiconductor layer form a second PIN diode. The first PIN diode and the second PIN diode are axisymmetrically disposed.

Abstract: An electrical connector with HDMI 2.1 specification, including an insulating body, multiple terminals, and a metallic shell partially enclosing the insulating body and the terminals, is provided. The terminals include ten terminals located in an upper row and nine terminals located in a lower row. The ten terminals are sequentially a first terminal Data2+, a third terminal Data2?, a fifth terminal Data Shield, a seventh terminal Data0+, a ninth terminal Data0?, a eleventh terminal Data3 Shield, a thirteenth terminal CEC, a fifteenth terminal SCL, a seventeenth terminal DDC/CEC Ground, and a nineteenth terminal Hot Plug Detec1 along an arrangement direction. The nine terminals are sequentially a second terminal Data2 Shield, a fourth terminal Data1+, a sixth terminal Data1?, an eighth terminal Data0 Shield, a tenth terminal Data3+, a twelfth terminal Data3?, a fourteenth terminal Utility, a sixteenth terminal SDA, and an eighteenth terminal +5V Power along the arrangement direction.

Abstract: The present disclosure provides systems and methods for associating data with non-material concepts that allows for subsequent searching and retrieval of such non-material concepts. A concept definition is received that defines a concept identifier used for identifying data associated with the concept, and a plurality of discrete stages of the concept. Retrieved data is analyzed to determine if the data corresponds to the concept, and to determine at least one discrete stage of the concept definition that the data corresponds to. The data is stored in association with the concept identifier and the at least one discrete stage to allow for subsequent searching and retrieval. When a search request relating to the concept is received, the data associated with the different stages of the concept can be retrieved and output in a manner to capture the holistic nature of the concept.

Abstract: A method and system for recommending content using a chatbot are provided. The content recommendation method includes calling a chatbot to a chatroom based on a first user interaction with the chatroom; providing first content corresponding to a second user interaction with the chatroom while the chatbot is in the chatroom; and recommending second content related to the first content.

Abstract: A fingerprint sensor has an array of microlenses formed on an upper surface of a transparent substrate; with a lower surface of the transparent substrate bonded to an upper surface of a fingerprint image sensor integrated circuit. In embodiments, it includes one or two filter layers on the lower surface of the transparent substrate, and may also include masked black baffle layers on one or more of the upper and lower surface of the transparent substrate. The sensor is made by forming the microlenses and black baffle layers on the transparent substrate, then aligning the transparent substrate to a wafer of fingerprint sensor integrated circuits and bonding the transparent substrate to the wafer, then dicing the wafer into individual fingerprint sensors.

Abstract: An electrical connector complied with HDMI 2.1 including an insulating body, multiple terminals, and a metallic shell enclosing portions of the insulating body and the terminals is provided. The ten terminals includes a first terminal Data2+, a third terminal Data2?, a fifth terminal Data Shield, a seventh terminal Data0+, a ninth terminal Data0?, an eleventh terminal Data3 Shield, a thirteenth terminal CEC, a fifteenth terminal SCL, a seventeenth terminal DDC/CEC Ground, and a nineteenth terminal Hot Plug Detec1 arranged in an arrangement direction in sequence. The nine terminals includes a second terminal Data2 Shield, a fourth terminal Data1+, a sixth terminal Data1?, an eighth terminal Data0 Shield, a tenth terminal Data3+, a twelfth terminal Data3?, a fourteenth terminal Utility, a sixteenth terminal SDA, and an eighteenth terminal +5V Power arranged in an arrangement direction in sequence.

Abstract: Embodiments relate to a semiconductor structure and a method for fabricating the same. The semiconductor structure includes: a base substrate including a trench, where the trench includes a gate structure whose top surface is lower than a top surface of the trench; first etch stop layers, where the first etch stop layers cover the top surface of the gate structure, part of a side wall of the trench, and an upper surface of the base substrate; an enclosed isolation structure positioned between the first etch stop layers in the trench, where the enclosed isolation structure at least plugs an opening of the trench; and an air gap positioned between the first etch stop layer and the enclosed isolation structure, where the air gap at least includes a transverse portion, and a bottom of the enclosed isolation structure is positioned on the transverse portion.