Abstract: A color calibration element is provided, including: a main body having a first plane, a first side, a second side, a third side, and a fourth side, where the first side is opposite the third side, and the second side is opposite the fourth side; a first marking region disposed on the first plane and located on the first side; a second marking region disposed on the first plane and relative to the first marking region to be located on the third side; a first color comparison region disposed on the first plane and located on the second side; and a second color comparison region disposed on the first plane and relative to the first marking region to be located on the fourth side. This allows for color comparison between a tooth photo and prosthetic teeth to enhance the color reliability.

Abstract: The present disclosure provides a touch display substrate, a manufacturing method thereof, and a display device. The touch display substrate includes a base substrate and a touch layer, the touch layer includes a plurality of touch units, the plurality of touch units includes a plurality of first touch units with complete touch patterns and a plurality of second touch units with incomplete touch patterns, at least a part of the plurality of second touch units is arranged in an outer edge region of the touch layer, a ratio of an area of the touch pattern of the second touch unit to an area of the touch pattern of the first touch unit is greater than 0 and less than or equal to a first threshold, and/or greater than or equal to a second threshold and less than 100%, and the first threshold is less than the second threshold.

Abstract: A method, computer program, and computer system is provided for video encoding and decoding. Video data including a current picture is received. A virtual reference frame is generated for the current picture based on hierarchical level associated with the current picture and a nearest decoded picture. The video data is decoded based on the generated reference frame.

Abstract: Implementations of the semiconductor package may include a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall. Implementations of the semiconductor package may include a first lead and a second lead extending from the first sidewall and a first half-etched tie bar directly coupled to the first lead. An end of the first half-etched tie bar may be exposed on the third sidewall of the semiconductor package. Implementations of the semiconductor package may also include a second half-etched tie bar directly coupled to the second lead. An end of the second half-etched tie bar may be exposed on the fourth sidewall. An end of the first lead and an end of the second lead may each be electroplated. The first die flag and the second die flag may be electrically isolated from the first lead and the second lead.

Abstract: Semiconductor devices having improved source/drain features and methods for fabricating such are disclosed herein. An exemplary device includes a semiconductor layer stack disposed over a mesa structure of a substrate. The device further includes a metal gate disposed over the semiconductor layer stack and an inner spacer disposed on the mesa structure of the substrate. The device further includes a first epitaxial source/drain feature and a second epitaxial source/drain feature where the semiconductor layer stack is disposed between the first epitaxial source/drain feature and the second epitaxial source/drain feature. The device further includes a void disposed between the inner spacer and the first epitaxial source/drain feature.

Abstract: Disclosed are a series of compounds with a nitrogen-containing spiro structure and an application thereof in the preparation of an RET kinase inhibitor. Specifically, disclosed is a compound as shown in formula (II) or a pharmaceutically acceptable salt thereof.

Abstract: New aluminum alloys are disclosed. The new aluminum alloys may include from 1.05 to 1.55 wt. % Si, from 0.85 to 2.10 wt. % Mg, from 0.15 to 0.75 wt. % Cu, from 0.20 to 0.90 wt. % Fe, from 0.5 to 1.5 wt. % Mn, from 0.01 to 0.15 wt. % Ti, up to 0.4 wt. % Zn, up to 0.25 wt. % of any of Cr, Zr and V, and up to 0.05 wt. % Ni, the balance being aluminum, incidental elements and impurities. The new aluminum alloys may be at least partially derived from scrap materials, such as UBC or brazing scrap. The new aluminum alloy may be processed into an H-temper sheet product. The new aluminum alloys may realize and improved combination of at least two of strength, elongation and corrosion resistance.

Abstract: A touch control structure includes a plurality of touch signal lines in a peripheral area. A respective touch signal line includes a double-layer structure in a double-layer region and a single-layer structure in a single-layer region. The peripheral area includes a first sub-area on a first side, a second sub-area on a second side, a third sub-area on a third side, a fourth sub-area on a fourth side, of the touch control area. The first sub-area includes a side region, and one or more corner regions. The double-layer region and the single-layer region are in the first sub-area, the first sub-area has a first shortest width along a direction from the touch control area to the first sub-area, the first shortest width is greater than a shortest width of at least one of sub-areas of the peripheral area other than the first sub-area.

Abstract: A cable assembly, configured to be mounted to a circuit board having a first conductive pad and a second conductive pad, includes a first cable, a second cable and a support member. The first cable includes a first core, a first insulator and a first shielding layer. The second cable includes a second core, a second insulator and a second shielding layer. The first core and the second core are configured to be in contact with the first conductive pad and the second conductive pad. The support member includes a support portion. The support portion is configured to support the first insulator and the second insulator. The connection portion is in contact with the first shielding layer and the second shielding layer. A cable connector having the cable assembly is also disclosed.

Abstract: An example augmented-reality headset comprises a frame portion, a temple arm portion coupled with the frame portion, and a metal-encased battery cell having an exterior surface that defines a non-rectangular shape. The metal-encased battery cell is configured to be housed within the temple arm portion, and the non-rectangular shape of the exterior surface follows an interior shape of an internal surface of the temple arm portion. The augmented-reality headset also comprises one or more artificial-reality processing or presentation devices, wherein at least one of the one or more artificial-reality processing or presentation devices is configured to receive power from the metal-encased battery cell.

Abstract: A display panel includes a plurality of light emitting elements; an encapsulating layer on the plurality of light emitting elements; and a touch control structure on the encapsulating layer. The touch control structure includes a plurality of first mesh electrodes along a row direction and a plurality of second mesh electrodes along a column direction. The touch control structure is limited in a touch control region and absent in a window region surrounded by the touch control region. The plurality of second mesh electrodes includes a first mesh block and a second mesh block respectively on a first side and a second side of the window region; and a first conductive bridge connecting the first mesh block and the second mesh block. The first conductive bridge comprises a first segment and a second segment. The second segment is in a layer different from the first segment.

Abstract: A computer system facilitates participation in a communication session with one or more participants, including displaying a spatial representation of one of the participants. In response to detecting that a virtual object is in spatial conflict with a first portion of the spatial representation, the computer system displays the portion of the virtual object in spatial conflict with the spatial representation with reduced visual prominence compared to the visual prominence of a portion of the virtual object not in spatial conflict with the spatial representation.

Abstract: A semiconductor structure includes a first source/drain (S/D) epitaxial feature, a second S/D epitaxial feature adjacent to the first S/D epitaxial feature, an insulating structure between the first and the second S/D epitaxial features, and a shared S/D contact over top surfaces of the first and the second S/D epitaxial features. A center portion of the shared S/D contact is directly between a side surface of the first S/D epitaxial feature and a side surface of the second S/D epitaxial feature. The center portion is directly above the insulating structure. The semiconductor structure further includes a backside via penetrating through the insulating structure to directly land on a bottom surface of the center portion.

Abstract: A method and a device for compensating a surface error of a holographic grating substrate based on scanning and exposure technology relates to a technical field of grating development. The method and the device adopt surface error compensation technology based on phase modulation of interference fringes of a scanning beam interference lithography system. The method and the device solve a poor grating diffraction wavefront quality caused by a surface processing error in a field of holographic grating research and improves full-aperture diffraction wavefront quality of a grating.

Abstract: A method includes forming first nanostructures over a first region of a substrate; forming second nanostructures over a second region of the substrate; forming first gate structures around the first nanostructures; replacing the second nanostructures with isolation regions; and forming a seal ring over the substrate, wherein the seal ring is between the first region and the second region.

Abstract: An embodiment is a device including a first die and a substrate including a first surface and a second surface opposite the first surface. The device also includes an active device on the first surface of the substrate. The device also includes a first interconnect structure on the first surface of the substrate. The device also includes a through substrate via extending through the first interconnect structure and the substrate to the second surface of the substrate, the through substrate via being electrically coupled to metallization patterns in the first interconnect structure. The device also includes one or more material-filled trench structures extending from the second surface of the substrate into the substrate, the one or more material-filled trench structures being electrically isolated from the through substrate via.

Abstract: A package comprising an integrated device and a substrate coupled to the integrated device through at least a plurality of solder interconnects. The substrate comprises at least one dielectric layer; a frame at least partially located in the at least one dielectric layer; and a plurality of interconnects located at least partially in the at least one dielectric layer. The frame may be an embedded frame.

Abstract: The disclosure relates to fluorescent fibers and methods of making and using the fluorescent fibers. The fluorescent fibers can be made using natural sourced materials and green chemistry methods. The fluorescent fibers can be used as a tracer in mud logging applications by tagging drill cuttings with the fluorescent fibers at a drill bit during a drilling process, or as tracers in fracturing fluids for tracing the gas flow in a gas reservoir.

Abstract: Provided are a semiconductor structure and a manufacturing method thereof. The manufacturing method of the semiconductor structure includes the following. A gate structure is formed on a substrate. A tilt implanting process is performed to implant group IV elements into the substrate to form a doped region, and the doped region is located on two sides of the gate structure and partially located under the gate structure. A part of the substrate on two sides of the gate structure is removed to form a first recess. A cleaning process is performed on the surface of the first recess. A wet etching process is performed on the first recess to form a second recess. A semiconductor layer is formed in the second recess.

Abstract: The disclosed technology is directed towards presenting communications data to a responding entity that are relevant to an emergency situation at an emergency location. The communications data can be obtained from communications (e.g., text messages, transmitted video, voice calls and the like) that involve at least one user device at the situation, including communications that do not involve the responding entity. Users may opt in to such an emergency service to allow access to their communications, whereby their device locations are tracked and known in the event of an emergency. Upon obtaining the communications data, a responder can receive a view of the scene augmented with the communications data. The view can include a three-dimensional and/or two-dimensional representation of the zone/area of the emergency situation. Filtering can be used to eliminate irrelevant communications, and summarization can be used to combine generally redundant communications.