Patents by Inventor Wei Wang

Wei Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11604551
    Abstract: The present disclose provides a touch control substrate and a display device and relates to the field of touch control technologies. The touch control substrate has a fingerprint recognition area and includes a plurality of touch control electrode units. The touch control electrode unit includes a mesh electrode composed of a plurality of electrode lines, and at least one touch control electrode unit is located in the fingerprint recognition area. The touch control electrode unit in the fingerprint recognition area is divided into a first area and a second area surrounding the first area, and a coverage rate of the plurality of electrode lines in the first area is smaller than a coverage rate of the plurality of electrode lines in the second area.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: March 14, 2023
    Assignees: BOE TECHNOLOGY GROUP CO., LTD., Chengdu BOE Optoelectronics Technology Co., Ltd.
    Inventors: Wei Wang, Yi Zhang, Yang Zeng, Yu Wang
  • Patent number: 11606080
    Abstract: A filter device, an RF front-end device and a wireless communication device are provided. The filter device includes a substrate, a passive device and at least one resonance device, wherein the passive device has a first side and a second side opposite to the first side, the substrate is located on the first side, and the at least one resonance device is located on the second side. The RF filter device formed by integrating the resonance device (such as an SAW or BAW resonance device) and the passive device (such as an IPD) can broaden the pass-band width, has a high out-of-band rejection, and occupies less space in an RF front-end chip.
    Type: Grant
    Filed: July 28, 2020
    Date of Patent: March 14, 2023
    Assignee: SHENZHEN SUNWAY COMMUNICATION CO., LTD.
    Inventors: Chengcheng Yu, Yanjie Cao, Wei Wang
  • Patent number: 11602228
    Abstract: An adjustable bed includes a frame structure; a plurality of platforms disposed on the frame structure; and an adjustable assembly coupled with the frame structure and the plurality of platforms for operably adjusting one or more of the plurality of platforms in desired positions; and an aromatherapy system attached onto the one or more platforms for producing desired fragrance in a surrounding space of the adjustable bed so as to promote health and well-being of a user. Each aromatherapy device is configured to produce a fragrance when said aromatherapy device is turned on, and one or more working modes. The fragrance is identical to or different from that produced by other aromatherapy device of the one or more aromatherapy devices.
    Type: Grant
    Filed: August 11, 2020
    Date of Patent: March 14, 2023
    Assignee: NISCO CO., LTD
    Inventors: Wei Wang, Jian Xie, Yifan Mao
  • Publication number: 20230070031
    Abstract: A semiconductor structure includes a buffer layer, a channel layer, a barrier layer, a doped compound semiconductor layer, and a composition gradient layer. The buffer layer is disposed on a substrate, the channel layer is disposed on the buffer layer, the barrier layer is disposed on the channel layer, the doped compound semiconductor layer is disposed on the barrier layer, and the composition gradient layer is disposed between the barrier layer and the doped compound semiconductor layer. The barrier layer and the composition gradient layer include a same group III element and a same group V element, and the atomic percentage of the same group III element in the composition gradient layer is gradually increased in the direction from the barrier layer to the doped compound semiconductor layer. A high electron mobility transistor and a fabrication method thereof are also provided.
    Type: Application
    Filed: September 3, 2021
    Publication date: March 9, 2023
    Applicant: Vanguard International Semiconductor Corporation
    Inventors: Chih-Yen Chen, Tuan-Wei Wang, Franky Juanda Lumbantoruan, Chun-Yang Chen
  • Publication number: 20230073330
    Abstract: Implementations of the semiconductor package may include a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall. Implementations of the semiconductor package may include a first lead and a second lead extending from the first sidewall and a first half-etched tie bar directly coupled to the first lead. An end of the first half-etched tie bar may be exposed on the third sidewall of the semiconductor package. Implementations of the semiconductor package may also include a second half-etched tie bar directly coupled to the second lead. An end of the second half-etched tie bar may be exposed on the fourth sidewall. An end of the first lead and an end of the second lead may each be electroplated. The first die flag and the second die flag may be electrically isolated from the first lead and the second lead.
    Type: Application
    Filed: November 17, 2022
    Publication date: March 9, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Hui Min LER, Soon Wei WANG, Chee Hiong CHEW
  • Publication number: 20230071387
    Abstract: A coated separator includes a porous separator base material including a porous polymer film; a first coating layer including electrochemically stable thermoplastic polymer particles disposed on a first surface of the porous separator base material, wherein the electrochemically stable thermoplastic polymer particles have a melting temperature of 90 to 135° C.; and a second coating layer including ceramic particles having an average particle size of greater than 100 nanometers; wherein the second coating layer is disposed on the first coating layer on a side opposite the porous separator base material; or the second coating layer is disposed on the porous separator base material on a second side opposite first coating layer; or the first coating layer and the second coating layer are combined to form an intermixed coating layer disposed on the first surface of the porous separator base material.
    Type: Application
    Filed: December 21, 2020
    Publication date: March 9, 2023
    Inventors: Yang ZHONG, Wei WANG, Jing JIANG
  • Publication number: 20230076745
    Abstract: A method for assessing the risk of cutaneous adverse drug reactions (CADRs) caused by an epidermal growth factor receptor inhibitor is provided, wherein the CADRs comprises but not limited to: maculopapular eruption (MPE), erythema multiforme (EM), Stevens Johnson syndrome (SJS), toxic epidermal necrolysis (TEN), and drug rash with eosinophilia and systemic symptoms (DRESS). Also provided is a detection kit for assessing the risk of developing CADRs in patients, said kit comprising a reagent for determining specific HLA alleles and a use of the detection kit in assessing the risk of developing CADR in a patient.
    Type: Application
    Filed: August 16, 2019
    Publication date: March 9, 2023
    Inventors: Wen-Hung CHUNG, Shuen-Iu HUNG, Chun-Bing CHEN, Chun-Wei LU, Chuang-Wei WANG
  • Publication number: 20230073773
    Abstract: Implementations of the semiconductor package may include a first sidewall opposite a second sidewall, and a third sidewall opposite a fourth sidewall. Implementations of the semiconductor package may include a first lead and a second lead extending from the first sidewall and a first half-etched tie bar directly coupled to the first lead. An end of the first half-etched tie bar may be exposed on the third sidewall of the semiconductor package. Implementations of the semiconductor package may also include a second half-etched tie bar directly coupled to the second lead. An end of the second half-etched tie bar may be exposed on the fourth sidewall. An end of the first lead and an end of the second lead may each be electroplated. The first die flag and the second die flag may be electrically isolated from the first lead and the second lead.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 9, 2023
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Hui Min LER, Soon Wei WANG, Chee Hiong CHEW
  • Publication number: 20230074192
    Abstract: An unmanned aerial vehicle (UAV) task cooperation method based on an overlapping coalition formation (OCF) game includes: constructing a sequential OCF game model for a UAV multi-task cooperation problem; using a bilateral mutual benefit transfer (BMBT) order that is biased toward the utility of a whole coalition to evaluate a preference of a UAV for a coalitional structure; optimizing task resource allocation of the UAV under an overlapping coalitional structure by using a preference gravity-guided Tabu Search algorithm to form a stable coalitional structure; and optimizing a transmission strategy based on the current coalitional structure, an updated status of a task resource allocation scheme of the UAV, and a current fading environment, so as to maximize task execution utility of a UAV network. The method quantifies characteristics of resource properties of the UAV and a task, and optimizes the task resource allocation of the UAV under the overlapping coalitional structure.
    Type: Application
    Filed: January 20, 2022
    Publication date: March 9, 2023
    Applicant: Nanjing University of Aeronautics and Astronautics
    Inventors: Nan QI, Zanqi HUANG, Diliao YE, Luliang JIA, Yueyue SU, Kewei WANG, Wei WANG, Yijia LIU
  • Patent number: 11600936
    Abstract: A circuit board structure has a first flexible circuit board, a second flexible circuit board, and a rigid board structure. The first flexible circuit board has a first dielectric layer and a first conductive circuit. The second flexible circuit board has a second dielectric layer and a second conductive circuit. The rigid board structure connects the first flexible circuit board and the second flexible circuit board. The rigid board structure has a third dielectric layer and a third conductive circuit. A dielectric loss value of the third dielectric layer is less than that of each of the first dielectric layer and the second dielectric layer. The third conductive circuit is electrically connected to the first and second conductive circuits.
    Type: Grant
    Filed: May 18, 2021
    Date of Patent: March 7, 2023
    Assignee: Unimicron Technology Corp.
    Inventors: Tzyy-Jang Tseng, Pei-Wei Wang, Ching-Ho Hsieh, Shao-Chien Lee, Kuo-Wei Li
  • Patent number: 11599727
    Abstract: An intelligent text cleaning method includes: acquiring a text set, and preprocessing the text set to obtain a word vector text set; subjecting the word vector text set to a full-text matrix numeralization to generate a principal word vector matrix and a text word vector matrix; inputting the principal word vector matrix to a BiLSTM model to generate an intermediate text vector; inputting the text word vector matrix to a convolution neural network model to generate a target text vector; and concatenating the intermediate text vector and the target text vector to obtain combined text vectors, inputting the combined text vectors to a pre-constructed semantic recognition classifier model, outputting an aggregated text vector, subjecting the aggregated text vector to reverse recovery using a word2vec reverse algorithm, and outputting a standard text. The present application realizes accurate text cleaning.
    Type: Grant
    Filed: August 23, 2019
    Date of Patent: March 7, 2023
    Assignee: PING AN TECHNOLOGY (SHENZHEN) CO., LTD.
    Inventors: Ziou Zheng, Wei Wang
  • Patent number: 11600625
    Abstract: A semiconductor device and method of fabricating thereof where the device includes a fin structure between a first isolation region and a second isolation region. A first source/drain feature is formed over a recessed portion of the first fin structure. The first source/drain feature interfaces a top surface of the first isolation region for a first distance and interfaces the top surface of the second isolation region for a second distance. The first distance is different than the second distance. The source/drain feature is offset in a direction.
    Type: Grant
    Filed: October 14, 2020
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chih-Chuan Yang, Chia-Hao Pao, Wen-Chun Keng, Lien Jung Hung, Ping-Wei Wang
  • Patent number: 11601426
    Abstract: A device authentication method, a service access control method, a device, and a non-transitory computer-readable recording medium are provided. In the device authentication method, an authentication request device issues an authentication request transaction in a distributed ledger, and an authentication response device reads the authentication request transaction in the distributed ledger and performs authentication. Thus, no third-party authentication center or coordinate device is required to participate in an authentication handshake process, thereby reducing deployment overhead of an authentication system and improving efficiency of authentication and access service control.
    Type: Grant
    Filed: April 16, 2020
    Date of Patent: March 7, 2023
    Assignee: Ricoh Company, Ltd.
    Inventors: Xiaojing Fan, Wei Wang, Haihua Yu, Ke Liao, Liyan Liu
  • Patent number: 11599825
    Abstract: Embodiments of the present disclosure relate to a method for training a trajectory classification model. The method includes: acquiring trajectory data; computing a trajectory feature of the trajectory data based on a temporal feature and a spatial feature of the trajectory data, the trajectory feature comprising at least one of a curvature or a rotation angle; and training the trajectory feature to obtain the trajectory classification model. Embodiments of the present disclosure further provide an apparatus for training a trajectory classification model, an electronic device, and a computer readable medium.
    Type: Grant
    Filed: December 11, 2019
    Date of Patent: March 7, 2023
    Assignee: Beijing Baidu Netcom Science and Technology Co., Ltd.
    Inventors: Enyang Bai, Kedi Chen, Miao Zhou, Quan Meng, Wei Wang
  • Patent number: 11600623
    Abstract: Well pick-up regions are disclosed herein for improving performance of memory arrays, such as static random access memory arrays. An exemplary integrated circuit (IC) device includes a circuit region; a first well pick-up (WPU) region; a first well oriented lengthwise along a first direction in the circuit region and extending into the first WPU region, the first well having a first conductivity type; and a second well oriented lengthwise along the first direction in the circuit region and extending into the first WPU region, the second well having a second conductivity type different from the first conductivity type, wherein the first well has a first portion in the circuit region and a second portion in the first WPU region, and the second portion of the first well has a width larger than the first portion of the first well along a second direction perpendicular to the first direction.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: March 7, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chih-Chuan Yang, Chang-Ta Yang, Ping-Wei Wang
  • Patent number: 11601661
    Abstract: A method, apparatus and storage medium for performing video coding are provided. The method includes obtaining a plurality of image frames in a video sequence; determining a feature map for each of the plurality of image frames and determining an offset map based on the feature map; determining an aligned feature map by performing a temporal deformable convolution (TDC) on the feature map and the offset map; and generating a plurality of aligned frames based on the aligned feature map.
    Type: Grant
    Filed: August 5, 2021
    Date of Patent: March 7, 2023
    Assignee: TENCENT AMERICA LLC
    Inventors: Wei Jiang, Wei Wang, Zeqiang Li, Shan Liu
  • Publication number: 20230067756
    Abstract: The system may obtain log data and other device/statistical information and automatically identify a normal user experience, positive user experience, negative user experience, or the like. For the negative user experience, different groups of anomalies can be further identified as different types of negative user experiences. Such a system can initiate more targeted user experience study, identify software bugs, configuration issues, or security risks.
    Type: Application
    Filed: September 2, 2021
    Publication date: March 2, 2023
    Inventor: Wei Wang
  • Publication number: 20230061494
    Abstract: An antenna structure is arranged at an edge region of a shell of a mobile terminal. The antenna structure includes at least one segment of antenna body and includes a first surface and a second surface opposite to each other, in which a first surface of the antenna body includes an attachment region attached to the edge region in a conformal manner. The antenna structure further includes a connecting portion connected to the antenna body, at least one of a first surface of the connecting portion and a second surface of the connecting portion being used for electrical connection with a feed unit of the mobile terminal or grounding.
    Type: Application
    Filed: February 25, 2022
    Publication date: March 2, 2023
    Applicant: Beijing Xiaomi Mobile Software Co., Ltd.
    Inventors: Linping XIE, Fang GUO, Wei WANG, Jie ZHANG
  • Publication number: 20230062842
    Abstract: Semiconductor device and methods of forming the same are provided. A semiconductor device according to one embodiment includes a first source/drain feature and a second source/drain feature, a first metal line disposed in a first dielectric layer and electrically connected to the first source/drain feature, a second metal line disposed in the first dielectric layer and electrically connected to the second source/drain feature, and a first memory element disposed over the first dielectric layer and electrically connected to the first source/drain feature by way of the first metal line. A width of the first metal line is different from a width of the second metal line. By changing the widths of the first metal line and the second metal line, a source line series resistance of a semiconductor device can be advantageously reduced without changing a pitch of two metal lines.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Inventors: Chih-Fan Huang, Wen-Chiung Tu, Liang-Wei Wang, Dian-Hau Chen, Yen-Ming Chen
  • Publication number: 20230062216
    Abstract: Embodiments of the present disclosure relate to data transport for an event machine based application. An electronic device identifies a first higher layer protocol for processing an Ethernet frame. The electronic device extracts an ingress payload from the Ethernet frame based on the identified first higher layer protocol. In accordance with a determination that the ingress payload is associated with a plurality of services, the electronic device converts the ingress payload into a first group of events associated with the plurality of services. The electronic device provides the first group of events to an ingress queue so as to be scheduled to the plurality of services.
    Type: Application
    Filed: February 10, 2020
    Publication date: March 2, 2023
    Inventors: Wei WANG, Bing ZHANG, Hanxiao SHEN