Patents by Inventor Wei Wen

Wei Wen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12572322
    Abstract: The present disclosure provides a voice prompt system, a voice prompt method for a bridge girder erection unit, a computing device, and a medium. The voice prompt system includes a control circuit and an alarm circuit; the control circuit includes a control power supply, a programmable controller, and relays; the positive electrode of the control power supply is electrically connected with an input end of the programmable controller, an output end of the programmable controller is electrically connected with input ends of the at least two relays, respectively, and output ends of the relays are connected to the negative electrode of the control power supply after being connected in parallel; the alarm circuit includes relay contacts, a wiring terminal block, and an alarm; the wiring terminal block includes at least two high-potential pins and a low-potential pin.
    Type: Grant
    Filed: September 6, 2023
    Date of Patent: March 10, 2026
    Assignee: China Tiesiju Civil Engineering Group Co., Ltd.
    Inventors: Qinan Duan, Xi Li, Yuhu Pei, Xuesen Du, Daocheng Wang, Yutao Deng, Yunhao Li, Wei Wen, Linfu Liu, Yusong Wu, Jinjun Ge, Mingxiang Ge
  • Publication number: 20260062587
    Abstract: Provided are a solvent-free polyurethane (PU) slurry and a preparation method thereof. Also provided are environmental-friendly resin-coated protective gloves and a preparation method thereof. The solvent-free PU slurry includes a component A and a component B, with a mass ratio of the component A to the component B ranging from 100:67 to 100:93.
    Type: Application
    Filed: August 28, 2024
    Publication date: March 5, 2026
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Publication number: 20260005789
    Abstract: Wireless communication methods, a device and a storage medium are provided. A method includes: a station transmits a first message to an access point, the first message carrying a field indicating a highest modulation and coding scheme (MCS).
    Type: Application
    Filed: September 4, 2025
    Publication date: January 1, 2026
    Applicant: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP., LTD.
    Inventors: Xiaogang CHEN, Wei Wen
  • Patent number: 12423975
    Abstract: An action localization method, device, electronic equipment, and computer-readable storage medium are provided. The action localization method includes: identifying at least one target video segment containing a target object in a video; acquiring a first action recognition result of at least one image frame in the at least one target video segment and a second action recognition result of the target video segment; and acquiring an action localization result of the video based on the first action recognition result and the second action recognition result.
    Type: Grant
    Filed: June 17, 2022
    Date of Patent: September 23, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Shizhuo Liu, Jingjun Jiao, Xiaobing Wang, Lanlan Zhang, Wei Li, Haifeng Zhang, Zhezhu Jin, Wei Wen
  • Publication number: 20250285243
    Abstract: Provided are an image processing method, an electronic device and a storage medium. In the method, a to-be-inpainted image is obtained based on an original image, where an image size of the to-be-inpainted image is a target image size to which the original image is desired to be adjusted, the to-be-inpainted image includes a first image area corresponding to the original image and a second image area other than the first image area, and the second image area is an area for which image inpainting is to be performed. The second image area in the to-be-inpainted image is inpainted with a pre-trained image inpainting model, and an intermediate image is obtained. The second image area in the intermediate image is inpainted with a pre-trained large language model, and a first target image is obtained.
    Type: Application
    Filed: March 4, 2025
    Publication date: September 11, 2025
    Inventor: Wei WEN
  • Patent number: 12400302
    Abstract: An image processing method, an image processing apparatus, an electronic device, and a computer-readable storage medium, relating to the technical field of image processing are provided. The image processing method may include performing blur classification on pixels of an image to obtain a classification mask image; and determining a blurred area of the image based on the classification mask image.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: August 26, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Dafeng Zhang, Yanjun Gao, Bin Dai, Zhezhu Jin, Wei Wen
  • Patent number: 12400789
    Abstract: The present invention provides a multi-degree-of-freedom conductor depositing system for tokamak toroidal field coil winding packs, belongs to the field of development of toroidal field superconducting coils for nuclear fusion. The multi-degree-of-freedom conductor depositing system is mounted on a winding table and distributed along the contour of the toroidal field coil. The optical proximity switches detect the position signals between the winding table and the bending unit and transmit them to an automatic control system. The multi-degree-of-freedom conductor depositing system is distributed in a spiral shape from the top to the bottom from the position of the bending unit along the direction of coil winding. The conductor is deposited onto the track drive mechanism of the multi-degree-of-freedom conductor depositing device, which has a bidirectional moving and rotating function.
    Type: Grant
    Filed: August 12, 2024
    Date of Patent: August 26, 2025
    Assignees: Hefei Institutes of Physical Sciences, Chinese Academy of Sciences, Institute of Energy, Hefei Comprehensive National Science Center (Anhui Province Energy Laboratory)
    Inventors: Jian He, Wei Wen, Zhaohui Yan, Yu Wu, Chao Zhou
  • Publication number: 20250066883
    Abstract: New 7xxx aluminum alloys are disclosed. The new 7xxx aluminum alloys may comprise from 5-10 wt. % Zn, 1-3 wt. % Mg, 1-3 wt. % Cu, a thickness of at least 2 inches, from 10% to 40% recrystallized grains, and an average grain size of at least 300 micrometers. The new 7xxx aluminum alloys may have recrystallized areas and the ratio of intercept distances for the recrystallized areas to the average to grain size may be from 0.5 and 2.0. In some embodiments, at least some recrystallized grains are located on a periphery of unrecrystallized grains. The recrystallized grains may be achieved at least partially due to (i) the use of not greater than 0.11 wt. % Zr in the 7xxx aluminum alloy product, (ii) particle stimulated nucleation, or (iii) both.
    Type: Application
    Filed: November 7, 2024
    Publication date: February 27, 2025
    Inventors: Steve R. Claves, Gregory B. Venema, Wei Wen, Kimberly Maciejewski
  • Publication number: 20250062069
    Abstract: The present invention provides a multi-degree-of-freedom conductor depositing system for tokamak toroidal field coil winding packs, belongs to the field of development of toroidal field superconducting coils for nuclear fusion. The multi-degree-of-freedom conductor depositing system is mounted on a winding table and distributed along the contour of the toroidal field coil. The optical proximity switches detect the position signals between the winding table and the bending unit and transmit them to an automatic control system. The multi-degree-of-freedom conductor depositing system is distributed in a spiral shape from the top to the bottom from the position of the bending unit along the direction of coil winding. The conductor is deposited onto the track drive mechanism of the multi-degree-of-freedom conductor depositing device, which has a bidirectional moving and rotating function.
    Type: Application
    Filed: August 12, 2024
    Publication date: February 20, 2025
    Inventors: Jian HE, Wei WEN, Zhaohui YAN, Yu WU, Chao ZHOU
  • Publication number: 20250029212
    Abstract: A method may include acquiring a first image that is obtained by adding noise to a second image, the second image comprising a target restoration region. The method may include performing at least one first denoising process on the first image using a first artificial intelligence (AI) network to obtain a first denoising result. The method may include restoring the target restoration region based on the first denoising result using a second AI network to obtain a restored image.
    Type: Application
    Filed: January 19, 2024
    Publication date: January 23, 2025
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mengmeng BAI, Jiahui Yuan, Xiansong Song, Jaekeun Na, Changwei Wang, Li Zuo, Wei Wen
  • Patent number: 12194529
    Abstract: New 2xxx aluminum alloys having are disclosed. The new 2xxx aluminum alloys generally include 2.5-3.9 wt. % Cu, 0.82-1.20 wt. % Li, 0.5-2.0 wt. % Zn, 0.10-0.60 wt. % Mn, 0.05-0.35 wt. % Mg, from 0.05 to 0.50 wt. % of at least one grain structure control element, wherein the at least one grain structure control element is selected from the group consisting of Zr, Sc, Cr, V, Hf, other rare earth elements, and combinations thereof, up to 0.22 wt. % Ag, up to 0.15 wt. % Fe, up to 0.12 wt. % Si, and up to 0.15 wt. % Ti, the balance being aluminum, incidental elements and impurities. The new 2xxx aluminum alloys may realize an improved combination of two or more of strength, fracture toughness, elongation, and corrosion resistance.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: January 14, 2025
    Assignee: Arconic Technologies LLC
    Inventors: Julien Boselli, Jen C. Lin, Lynette M. Karabin, Wei Wen
  • Patent number: 12199462
    Abstract: This disclosure provides a multifunctional interface conversion device and a multifunctional interface conversion system. The multifunctional interface conversion device includes a power adapter module and an interface conversion module. The power adapter module includes an AC-to-DC conversion unit, a first DC-to-DC conversion unit, and a power output terminal. The interface conversion module includes a first power management unit and a first interface. This disclosure combines the power adapter module and the interface conversion module to obtain the multifunctional interface conversion device.
    Type: Grant
    Filed: June 22, 2023
    Date of Patent: January 14, 2025
    Assignee: SHENZHEN HONOR ELECTRONIC CO., LTD
    Inventors: Liyan Lin, Wei Wen, Yuetian Wang
  • Publication number: 20240412337
    Abstract: A method performed by an electronic device, includes acquiring a first image comprising at least a first region and a second region and a target object to be moved in the first image from the second region to the first region; and performing target object removal processing on the first image using a first artificial intelligence (AI) network based on guidance information related to at least one of first region and the second region, wherein the second region is a region of the target object in the first image in which the target object is located prior to the removal processing.
    Type: Application
    Filed: August 19, 2024
    Publication date: December 12, 2024
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Mengmeng BAI, Huiling Chang, Zhuoxin Gan, Jaekeun Na, Changwei Wang, Li Zuo, Wei Wen
  • Publication number: 20240389023
    Abstract: According to one aspect of the present disclosure, a method of wireless communication of a first node is provided. The method may include generating, by at least one processor, a first low-power listening (LPL) frame with a first LPL subfield set to “enable.” The method may include transmitting, by a communication interface, the first LPL frame with the first LPL subfield set to “enable” to a second node. The method may include enabling, by the at least one processor, an LPL mode after the first LPL frame with the first LPL subfield set to “enable” is transmitted to the second node.
    Type: Application
    Filed: April 18, 2023
    Publication date: November 21, 2024
    Inventors: Xiaogang CHEN, Wei WEN, Bo LU, Bo WANG
  • Patent number: D1094956
    Type: Grant
    Filed: October 15, 2024
    Date of Patent: September 30, 2025
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Patent number: D1094957
    Type: Grant
    Filed: October 15, 2024
    Date of Patent: September 30, 2025
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Patent number: D1108074
    Type: Grant
    Filed: October 15, 2024
    Date of Patent: January 6, 2026
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Patent number: D1121262
    Type: Grant
    Filed: October 15, 2024
    Date of Patent: April 7, 2026
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Patent number: D1124582
    Type: Grant
    Filed: June 17, 2025
    Date of Patent: May 5, 2026
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen
  • Patent number: D1124583
    Type: Grant
    Filed: July 31, 2025
    Date of Patent: May 5, 2026
    Inventors: Guoda Dai, Menglu Dai, Genkai Watanabe, Wei Wen