Patents by Inventor Wei-Wen Chen

Wei-Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240163454
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video coding with multi-direction intra prediction (MDIP). In one method, a decoder determines a blending parameter for the MDIP based a size of a coding unit. In another method, the decoder may determine a size of each coding block, and in response to determining that the size of the coding block is smaller than or equal to a first preset threshold, the decoder may determine that the MDIP mode is disabled for the coding block.
    Type: Application
    Filed: January 19, 2024
    Publication date: May 16, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Hong-Jheng JHU, Xiaoyu XIU, Yi-Wen CHEN, Wei CHEN, Che-Wei KUO, Ning YAN, Xianglin WANG, Bing YU
  • Publication number: 20240162356
    Abstract: A light detecting device includes a substrate that has a lattice constant. A buffer layer is disposed on the substrate. A gradient layer is formed on the buffer layer opposite to the substrate, and includes a plurality of sublayers that have respectively lattice constants each of which is greater than the lattice constant of the substrate. The sublayers are arranged in a manner that the lattice constants of the sublayers undergo a gradual increase in lattice constant in a direction away from the substrate. A barrier layer is formed on the gradient layer opposite to the buffer layer, and has a lattice constant which is greater than that of the substrate and no smaller than the lattice constants of the sublayers. An absorption layer is formed on the barrier layer opposite to the gradient layer.
    Type: Application
    Filed: March 29, 2023
    Publication date: May 16, 2024
    Inventors: Hung-Wen HUANG, Yung-Chao CHEN, Yi-Hsiang WANG, Wei LIN
  • Publication number: 20240151900
    Abstract: A method for manufacturing a semiconductor device includes: forming a first waveguide structure and a second waveguide structure on a substrate in which the first waveguide structure and the second waveguide structure is spaced apart from each other by a recess; conformally forming an un-doped dielectric layer to cover the first and second waveguide structures and to form a gap between two corresponding portions of the un-doped dielectric layer laterally covering the first waveguide structure and the second waveguide structure, respectively; and forming a doped filling layer to fill the gap.
    Type: Application
    Filed: February 22, 2023
    Publication date: May 9, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Wei-Li LO, Huan-Chieh CHEN, Yao-Wen CHANG, Chih-Ming CHEN
  • Publication number: 20240143455
    Abstract: A virtual machine backup method, performed by a first host, includes: capturing a request to write data from a virtual machine to a hard disk image file, wherein the request includes written data and input and output location information, copying the written data to a temporary storage area, calculating a first key of the written data, storing the first key, the input and output location information into a first resource location structure, pausing an operation of the virtual machine and generating a second resource location structure according to the first resource location structure, the first key and a second key, and outputting a backup data set to a second host according to the second resource location structure, wherein the backup data set includes the second resource location structure and only one of existing data and the written data when the first key and the second key are the same.
    Type: Application
    Filed: May 15, 2023
    Publication date: May 2, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Lee Chung CHEN, Li Hao CHIANG, Gin CHI, Wei Jie HSU, Jiann Wen WANG, Wen Dwo HWANG
  • Publication number: 20240136117
    Abstract: A multi-phase coupled inductor includes a first iron core, a second iron core, and a plurality of coil windings. The first iron core includes a first body and a plurality of first core posts. The plurality of first core posts are connected to the first body. The second iron core is opposite to the first iron core. The second iron core and the first body are spaced apart from each other by a gap. The plurality of coil windings wrap around the plurality of first core posts, respectively. Each of the coil windings has at least two coils.
    Type: Application
    Filed: October 1, 2023
    Publication date: April 25, 2024
    Inventors: HUNG-CHIH LIANG, PIN-YU CHEN, HANG-CHUN LU, YA-WEN YANG, YU-TING HSU, WEI-ZHI HUANG
  • Publication number: 20240135745
    Abstract: An electronic device has a narrow viewing angle state and a wide viewing angle state, and includes a panel and a light source providing a light passing through the panel. In the narrow viewing angle state, the light has a first relative light intensity and a second relative light intensity. The first relative light intensity is the strongest light intensity, the second relative light intensity is 50% of the strongest light intensity, the first relative light intensity corresponds to an angle of 0°, the second relative light intensity corresponds to a half-value angle, and the half-value angle is between ?15° and 15°. In the narrow angle state, a third relative light intensity at each angle between 20° and 60° or each angle between ?20° and ?60° is lower than 20% of the strongest light intensity.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Applicant: InnnoLux Corporation
    Inventors: Kuei-Sheng Chang, Po-Yang Chen, Kuo-Jung Wu, I-An Yao, Wei-Cheng Lee, Hsien-Wen Huang
  • Publication number: 20240113080
    Abstract: A semiconductor device and a method of manufacture are provided. In particular, a semiconductor device using blocks, e.g., discrete connection blocks, having through vias and/or integrated passive devices formed therein are provided. Embodiments such as those disclosed herein may be utilized in PoP applications. In an embodiment, the semiconductor device includes a die and a connection block encased in a molding compound. Interconnection layers may be formed on surfaces of the die, the connection block and the molding compound. One or more dies and/or packages may be attached to the interconnection layers.
    Type: Application
    Filed: November 30, 2023
    Publication date: April 4, 2024
    Inventors: Ching-Wen Hsiao, Chen-Shien Chen, Wei Sen Chang, Shou-Cheng Hu
  • Publication number: 20240107070
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video decoding. In one method, a decoder receives a Sequence Parameter Set (SPS) rice extension flag that indicates whether an extension of rice parameter derivation for binarization of abs_remainder and dec_abs_level is enabled. In a second method, the decoder may receive a Sequence Parameter Set (SPS) rice adaption enabled flag that indicates whether rice parameter derivation for binarization of abs_remainder and dec_abs_level is used.
    Type: Application
    Filed: November 25, 2023
    Publication date: March 28, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Hong-Jheng JHU, Xiaoyu XIU, Yi-Wen CHEN, Wei CHEN, Che-Wei KUO, Ning YAN, Xianglin WANG, Bing YU
  • Patent number: 11942993
    Abstract: An optical transmission device includes: a control module generate a control signal output which includes a slope adjust signal and a bias voltage offset adjust signal according to an input signal indicating a dispersion amount an electrical level adjust signal; a multi-level pulse amplitude modulator; and an asymmetrical optical modulator which is controlled by the slope adjust signal to be operated at one of a positive slope and a negative slope of a transfer function of the asymmetrical optical modulator itself, and is controlled by the bias voltage offset adjust signal of the control signal output to offset a bias voltage point of the asymmetrical optical modulator itself from a quadrature point of the transfer function, and modulates the multi-level pulse amplitude modulation signal to an optical signal to generate an optical modulate signal having a chirp.
    Type: Grant
    Filed: December 18, 2020
    Date of Patent: March 26, 2024
    Assignee: Molex, LLC
    Inventors: Kuen-Ting Tsai, Wei-Hung Chen, Zuon-Min Chuang, Yao-Wen Liang
  • Publication number: 20130282923
    Abstract: A system and method for managing overlapping address domains are described herein. The method includes receiving, at a global network node management system, communications from a plurality of tenants within a network address translation (NAT) environment, wherein each of the plurality of tenants includes a group of network devices with non-overlapping internet protocol (IP) addresses. The method also includes tracking, via the global network node management system, a state of the NAT environment based on the communications.
    Type: Application
    Filed: April 20, 2012
    Publication date: October 24, 2013
    Inventors: Joseph Elisha Taylor, Wei Wen Chen, Zhenjun Cao, Max C. Knees, Lawrence M. Besaw, Peter C. Zwetkof
  • Publication number: 20130282886
    Abstract: The present disclosure provides methods, computer-readable media, and systems for managing a network with a network management device. Vendor specific discovery protocol data can be collected with the network management device from a network device in response to the network device having vendor specific discovery protocol data. Vendor neutral discovery protocol data can be collected with the network management device in response to the network device having vendor neutral discovery protocol data. A network connection can be assessed using the at least one of the vendor specific discovery protocol data and the vendor neutral discovery protocol data.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Inventors: Joseph E. Taylor, Wei Wen Chen, Peter C. Zwetkof
  • Patent number: 8526325
    Abstract: An automated method for ascertaining interconnectivity in a network comprises operating a customer edge device at a site that is physically linked with at least one provider edge router and communicates directly with peer sites via a virtual private network (VPN) connection. Inter-site connectivity is discovered among a plurality of customer edge devices in the network and effective communication paths among the plurality of customer edge devices across geographically distributed sites are presented.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: September 3, 2013
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Wei Wen Chen, Peter C. Zwetkof
  • Publication number: 20130206201
    Abstract: A solar cell assembly provides a solar cell with a reduced size potting ring that retains the conductive contact strips that extend through the solar cell substrate and are coupled to the solar cell circuitry on the front surface of the solar cell substrate. A reduced volume of potting material is required and the solar cells are advantageously packed, shipped and stored in this configuration. Diode connections and power cable connections are made external the potting box once the solar cell assemblies are received at their installation location.
    Type: Application
    Filed: February 10, 2012
    Publication date: August 15, 2013
    Applicant: TSMC Solar Ltd.
    Inventors: Szu-Han Li, Tong Hong Fu, Wei-Wen Chen
  • Publication number: 20110206327
    Abstract: An active optical cable electrical connector with bi-directional optical sub-assembly, including: a circuit board having a front end serving as an electrical connector; an optical cable having an internal optical fiber for transmitting and receiving optical signals; and a bi-directional optical sub-assembly electrically connected to the circuit board and connected with a terminal of the optical fiber. The bi-directional optical sub-assembly serves to convert electrical signals received by the electrical connector into optical signals, which are then transmitted through the optical fiber. The bi-directional optical sub-assembly also serves to convert optical signals transmitted from the optical fiber into electrical signals, which are then transmitted through the electrical connector.
    Type: Application
    Filed: February 25, 2010
    Publication date: August 25, 2011
    Inventor: WEI-WEN CHEN
  • Publication number: 20090196621
    Abstract: A fiber-optic to USB Ethernet converter includes fiber-optic jacks for connecting to optical cables; a USB connecting end for plugging into a USB connector on a computer device; a USB-Ethernet converting module for converting USB serial electric signal format into Ethernet electric signal format and Ethernet electric signal format into USB serial electric signal format; an optical-electric signal converting circuit for converting the Ethernet electric signal format received from the USB-Ethernet converting module into an optical signal for sending out via one optical cable, and converting an optical signal received from one optical cable into the Ethernet electric signal format for sending back to the USB-Ethernet converting module; and a power supply detecting and converting module connected to first and fourth pins in the USB connecting end to acquire and convert +5V DC into 5V or 3.3V for use by the optical-electric signal converting circuit and the USB-Ethernet converting module.
    Type: Application
    Filed: September 4, 2008
    Publication date: August 6, 2009
    Applicant: OPTOWAY TECHNOLOGY INC.
    Inventor: Wei-Wen CHEN
  • Publication number: 20080183715
    Abstract: A network system comprises a discovery subsystem that identifies, enables for consumption, and consumes information. The discovery subsystem isolates business contents and device-specific logic using modular domain-specific contents and data definitions for normalizing the domain-specific contents and describing attributes and value types that uniquely define domain content independently of a device.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Inventors: Wei Wen Chen, Craig W. Bryant, Eric Pulsipher, Srikanth Natarajan, Chiachu Sun Dorland, Zhi-Qiang Wang, Manas Kumar Behera, Kumar Ramiah Karungulam, Frank Trujillo, Peter C. Notess, Daniel Okine
  • Publication number: 20080181219
    Abstract: An automated method for ascertaining interconnectivity in a network comprises operating a customer edge device at a site that is physically linked with at least one provider edge router and communicates directly with peer sites via a virtual private network (VPN) connection. Inter-site connectivity is discovered among a plurality of customer edge devices in the network and effective communication paths among the plurality of customer edge devices across geographically distributed sites are presented.
    Type: Application
    Filed: January 31, 2007
    Publication date: July 31, 2008
    Inventors: Wei Wen Chen, Peter C. Zwetkof
  • Patent number: 7307552
    Abstract: A method and apparatus provide for data compression with deflate block overhead reduction through the use of “pseudo-dynamic” Huffman codes to enable single deflate block encoding in a deflate algorithm implementation. Further, provided is data compression with deflate block overhead reduction through the use of “pseudo-dynamic” Huffman codes to enable single deflate block encoding in a deflate algorithm implementation, with inflation detection and mitigation capabilities.
    Type: Grant
    Filed: November 16, 2005
    Date of Patent: December 11, 2007
    Assignee: Cisco Technology, Inc.
    Inventors: Kevin Ma, Wayne Wei-Wen Chen
  • Patent number: 6916730
    Abstract: First of all, a semiconductor substrate is provided. Then a gate oxide layer having an uniform thickness is formed on the semiconductor substrate by way of using thermal oxidation. Subsequently, a doping layer is formed on the gate oxide layer by a plasma doped process. Next, forming a poly-layer on the doping layer of the gate oxide layer, wherein the poly-layer has an ions-distribution. Afterward, defining the poly-layer to form a poly-gate. The P-type ions are then implanted into the poly-gate and the substrate by way of using a self-aligned process. Finally, performing a thermal annealing process to form a uniform ion-implanting region and a poly-gate having a lower contact-resistance.
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: July 12, 2005
    Assignee: Macronix International Co., Ltd.
    Inventor: Wei-Wen Chen
  • Patent number: D1026916
    Type: Grant
    Filed: January 5, 2022
    Date of Patent: May 14, 2024
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Hao-Jen Fang, Kung-Ju Chen, Wei-Yi Chang, Chun-Chieh Chen, Chih-Wen Chiang, Sheng-Hung Lee