Patents by Inventor Wei-Yan Shih

Wei-Yan Shih has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11393971
    Abstract: An improved differential sensor and corresponding apparatus implementing same. The differential sensor includes a substrate, an amplifier coupled to the substrate, and a plurality of highly-matched piezoelectric capacitors formed onto the substrate. A first set of the highly-matched piezoelectric capacitors are electrically coupled to a non-inverting input of the amplifier, and a second set of the highly-matched piezoelectric capacitors are electrically coupled to an inverting input of the amplifier to form an open loop differential amplifier.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: July 19, 2022
    Assignee: Texas Instruments Incorporated
    Inventors: Sudhanshu Khanna, Michael Zwerg, Steven C. Bartling, Brian Elies, Krishnasawamy Nagaraj, Wei-Yan Shih
  • Publication number: 20220011177
    Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
    Type: Application
    Filed: September 27, 2021
    Publication date: January 13, 2022
    Inventor: Wei-Yan Shih
  • Publication number: 20210389174
    Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
    Type: Application
    Filed: August 31, 2021
    Publication date: December 16, 2021
    Inventors: Michael Zwerg, Sudhanshu Khanna, Steven C. Bartling, Brian Elies, Krishnasawamy Nagaraj, Wei-Yan Shih
  • Patent number: 11131589
    Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
    Type: Grant
    Filed: April 6, 2018
    Date of Patent: September 28, 2021
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Wei-Yan Shih
  • Patent number: 11105676
    Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
    Type: Grant
    Filed: November 14, 2018
    Date of Patent: August 31, 2021
    Assignee: Texas Instruments Incorporated
    Inventors: Michael Zwerg, Sudhanshu Khanna, Steven C. Bartling, Brian Elies, Krishnasawamy Nagaraj, Wei-Yan Shih
  • Patent number: 10873020
    Abstract: A piezoelectric sensor with: (i) a capacitive element, comprising piezoelectric material; (ii) a pre-conditioning circuit, comprising circuitry for establishing a polarization of the capacitive element in a polarizing mode; and (iii) signal amplification circuitry for providing a piezoelectric-responsive output signal, in response to charge across the capacitive element in a sensing mode.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: December 22, 2020
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wei-Yan Shih, Sudhanshu Khanna, Michael Zwerg, Juergen Luebbe, Gregory Allen North, Steven C. Bartling, Leah Trautmann, Scott Robert Summerfelt
  • Publication number: 20200168786
    Abstract: An improved differential sensor and corresponding apparatus implementing same. The differential sensor includes a substrate, an amplifier coupled to the substrate, and a plurality of highly-matched piezoelectric capacitors formed onto the substrate. A first set of the highly-matched piezoelectric capacitors are electrically coupled to a non-inverting input of the amplifier, and a second set of the highly-matched piezoelectric capacitors are electrically coupled to an inverting input of the amplifier to form an open loop differential amplifier.
    Type: Application
    Filed: November 27, 2018
    Publication date: May 28, 2020
    Inventors: Sudhanshu Khanna, Michael Zwerg, Steven C. Bartling, Brian Elies, Krishnasawamy Nagaraj, Wei-Yan Shih
  • Publication number: 20190339806
    Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.
    Type: Application
    Filed: July 15, 2019
    Publication date: November 7, 2019
    Inventors: Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Alok Lohia, Terry Lee Sculley, Seung Bae Lee, Scott Robert Summerfelt
  • Patent number: 10353503
    Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element may include a conditioning circuit, temperature gauge, FRAM and a processor core.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: July 16, 2019
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Alok Lohia, Terry Lee Sculley, Seung Bae Lee, Scott Robert Summerfelt
  • Publication number: 20190162590
    Abstract: In described examples, each node between adjacent capacitive elements of a stack of series-coupled capacitive elements is biased during a reset mode, where each of the capacitive elements includes piezoelectric material. A strain-induced voltage is generated across each of the capacitive elements. Each of the strain-induced voltages is combined to generate a piezoelectric-responsive output signal during a sensing mode at a time different from the time of the reset mode.
    Type: Application
    Filed: November 14, 2018
    Publication date: May 30, 2019
    Inventors: Michael Zwerg, Sudhanshu Khanna, Steven C. Bartling, Brian Elies, Krishnasawamy Nagaraj, Wei-Yan Shih
  • Publication number: 20190051812
    Abstract: A piezoelectric sensor with: (i) a capacitive element, comprising piezoelectric material; (ii) a pre-conditioning circuit, comprising circuitry for establishing a polarization of the capacitive element in a polarizing mode; and (iii) signal amplification circuitry for providing a piezoelectric-responsive output signal, in response to charge across the capacitive element in a sensing mode.
    Type: Application
    Filed: August 8, 2017
    Publication date: February 14, 2019
    Inventors: Wei-Yan Shih, Sudhanshu Khanna, Michael Zwerg, Juergen Luebbe, Gregory Allen North, Steven C. Bartling, Leah Trautmann, Scott Robert Summerfelt
  • Publication number: 20180231423
    Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
    Type: Application
    Filed: April 6, 2018
    Publication date: August 16, 2018
    Inventor: Wei-Yan SHIH
  • Patent number: 9970831
    Abstract: A piezoelectric sensor comprises a support structure, a channel extending through the support structure, a sensing material stack coupled to the support structure and extending over the channel, and a filler material disposed within the channel and over the sensing material stack. The sensing material stack comprises an structural layer, a first electrode layer disposed on the structural layer, a piezoelectric material disposed in a piezoelectric layer on the first electrode, and a second electrode disposed on the piezoelectric layer opposite the first electrode layer.
    Type: Grant
    Filed: February 10, 2015
    Date of Patent: May 15, 2018
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventor: Wei-Yan Shih
  • Patent number: 9751108
    Abstract: An ultrasonic transducer. The ultrasonic transducer has an interposer having electrical connectivity contacts. The ultrasonic transducer also has an ultrasonic receiver, comprising an array of receiving elements, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer. The ultrasonic transducer also has at least one ultrasonic transmitter, separate from the ultrasonic receiver, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer.
    Type: Grant
    Filed: July 31, 2015
    Date of Patent: September 5, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Wei-Yan Shih, Xiaochen Xu
  • Publication number: 20170217759
    Abstract: A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
    Type: Application
    Filed: March 20, 2017
    Publication date: August 3, 2017
    Inventors: Stuart M. Jacobsen, Wei-Yan Shih
  • Patent number: 9679864
    Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.
    Type: Grant
    Filed: October 13, 2016
    Date of Patent: June 13, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Steven Alfred Kummerl, Wei-Yan Shih
  • Publication number: 20170123548
    Abstract: An integrated force sensing element includes a piezoelectric sensor formed in an integrated circuit (IC) chip and a strain gauge at least partially overlying the piezoelectric sensor, where the piezoelectric sensor is able to flex. A human-machine interface using the integrated force sensing element is also disclosed and may include a conditioning circuit, temperature gauge, FRAM and a processor core.
    Type: Application
    Filed: October 29, 2015
    Publication date: May 4, 2017
    Inventors: Wei-Yan Shih, Steve Kummerl, Mark Stephen Toth, Alok Lohia, Terry Lee Sculley, Seung Bae Lee, Scott Robert Summerfelt
  • Patent number: 9630835
    Abstract: A MEMS device is formed by applying a lower polymer film to top surfaces of a common substrate containing a plurality of MEMS devices, and patterning the lower polymer film to form a headspace wall surrounding components of each MEMS device. Subsequently an upper polymer dry film is applied to top surfaces of the headspace walls and patterned to form headspace caps which isolate the components of each MEMS device. Subsequently, the MEMS devices are singulated to provide separate MEMS devices.
    Type: Grant
    Filed: August 25, 2014
    Date of Patent: April 25, 2017
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: Stuart M. Jacobsen, Wei-Yan Shih
  • Publication number: 20170028439
    Abstract: An ultrasonic transducer. The ultrasonic transducer has an interposer having electrical connectivity contacts. The ultrasonic transducer also has an ultrasonic receiver, comprising an array of receiving elements, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer. The ultrasonic transducer also has at least one ultrasonic transmitter, separate from the ultrasonic receiver, physically fixed relative to the interposer and coupled to electrically communicate with electrical connectivity contacts of the interposer.
    Type: Application
    Filed: July 31, 2015
    Publication date: February 2, 2017
    Inventors: Wei-Yan Shih, Xiaochen Xu
  • Publication number: 20170033072
    Abstract: A method forming a packaged semiconductor device includes providing a first semiconductor die (first die) having bond pads thereon mounted face-up on a package substrate or on a die pad of a lead frame (substrate), wherein the substrate includes terminals or contact pads (substrate pads). A first dielectric layer is formed including printing a first dielectric precursor layer including a first ink having a first liquid carrier solvent extending from the substrate pads to the bond pads. A first interconnect precursor layer is printed including a second ink having a second liquid carrier over the first dielectric layer extending from the substrate pads to the bond pads. Sintering or curing the first interconnect precursor layer removes at least the second liquid carrier to form an electrically conductive interconnect including an ink residue which connects respective substrate pads to respective bond pads.
    Type: Application
    Filed: October 13, 2016
    Publication date: February 2, 2017
    Inventors: Benjamin Stassen Cook, Juan Alejandro Herbsommer, Matthew David Romig, Steven Alfred Kummerl, Wei-Yan Shih