Patents by Inventor Wei Yang

Wei Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250151357
    Abstract: Semiconductor structures and methods for forming the same are provided. A semiconductor structure according to the present disclosure includes a substrate, a first base fin and a second base fin rising from the substrate, an isolation feature disposed over the substrate and between the first base fin and the second base fin, a first bottom epitaxial feature over the first base fin, a second bottom epitaxial feature over the second base fin, an isolation layer on the first bottom epitaxial feature, a first source/drain feature over the isolation layer, a second source/drain feature disposed over and in contact with the second bottom epitaxial feature, a contact etch stop layer (CESL) over the first source/drain feature and the isolation feature, a first interlayer dielectric (ILD) layer over the CESL, and a second ILD layer over and in direct contact with the second source/drain feature.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 8, 2025
    Inventors: Bo-Yu Lai, Chung-I Yang, Wei-Yang Lee, Chih-Ching Wang
  • Publication number: 20250151504
    Abstract: An array substrate includes a base substrate, a first conductive layer, a first electrode, an organic planarization layer and an organic active layer. The first conductive layer is provided on a side of the base substrate. The first electrode is provided on a side of the first conductive layer away from the base substrate, an orthographic projection of the first electrode on the base substrate overlapping an orthographic projection of the drain electrode on the base substrate. The organic planarization layer is provided on a side of the first electrode away from the base substrate, first via holes being provided in the organic planarization layer. The organic active layer is provided on a side of the organic planarization layer away from the base substrate, the organic active layer being connected to the source electrode by a first via hole and connected to the drain electrode by a first via hole.
    Type: Application
    Filed: January 13, 2025
    Publication date: May 8, 2025
    Applicant: BOE Technology Group Co., Ltd.
    Inventors: Guangcai YUAN, Hehe HU, Changhan HSIEH, Wei YANG, Liwen DONG, Jiayu HE, Dongfei HOU, Zhen ZHANG, Ce NING, Xin GU, Zhengliang LI
  • Publication number: 20250150210
    Abstract: Methods, systems, and devices for wireless communication are described. Generally, the described techniques provide for avoiding collisions between hybrid automatic repeat request (HARQ) feedback transmissions and between HARQ feedback transmissions and other transmissions. In one example, a base station may configure resources for HARQ feedback transmissions such that the resources are exclusive of each other to avoid collisions between HARQ feedback transmissions. In another example, a base station may indicate resources for a user equipment (UE) to use for HARQ feedback transmissions such that the resources are exclusive of each other to avoid collisions between HARQ feedback transmissions. In yet another example, if a HARQ feedback transmission and another transmission are scheduled on overlapping resources, a UE may be configured to multiplex bits of the HARQ feedback transmission and the other transmission or drop the other transmission.
    Type: Application
    Filed: January 9, 2025
    Publication date: May 8, 2025
    Inventors: Seyedkianoush HOSSEINI, Amir AMINZADEH GOHARI, Wei YANG, Jing JIANG
  • Publication number: 20250149436
    Abstract: A method for manufacturing an interconnect structure includes: forming sacrificial portions and electrically conductive portions on a base structure such that the sacrificial portions are disposed to alternate with the electrically conductive portions in a first direction, and such that each of the sacrificial portions and the electrically conductive portions is elongated in a second direction transverse to the first direction; forming blocking portions respectively on the sacrificial portions; forming a sacrificial layer to cover the electrically conductive portions and the blocking portions; forming an electrically conductive via which extends through the sacrificial layer so as to permit the electrically conductive via to be electrically connected to one of the electrically conductive portions; after forming the electrically conductive via, performing a removal process to remove the sacrificial layer, the blocking portions and the sacrificial portions so as to form a cavity; and forming a dielectric portio
    Type: Application
    Filed: November 6, 2023
    Publication date: May 8, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Gary LIU, Ting-Ya LO, Shao-Kuan LEE, Zi-Yi YANG, Chi-Lin TENG, Kuang-Wei YANG, Hsin-Yen HUANG, Hsiao-Kang CHANG, Ming-Han LEE, Shau-Lin SHUE
  • Publication number: 20250150751
    Abstract: A covering structure disposed within a sound producing package includes a tube structure, a first chamber and a first connecting structure. The tube structure has a first sound opening and a second sound opening, wherein a tube cavity connected between the first sound opening and the second sound opening exists inside the tube structure. A first cavity exists inside the first chamber and is connected to the tube cavity of the tube structure. The first connecting structure is connected between the tube structure and the first chamber, wherein the first connecting structure is between the first sound opening and the second sound opening, and the first cavity of the first chamber is connected to the tube cavity of the tube structure through the first connecting structure. An acoustic pathway of the covering structure is formed between the first sound opening and the second sound opening.
    Type: Application
    Filed: March 28, 2024
    Publication date: May 8, 2025
    Applicant: XMEMS TAIWAN CO., LTD.
    Inventor: Wei-Yang Li
  • Patent number: 12294043
    Abstract: The present application discloses a drive backplane and a preparation method thereof, a display panel, and a display device. The drive backplane includes a flexible substrate provided with a first via hole; a first passivation layer located on a side of the flexible substrate and provided with a second via hole, an orthographic projection of the second via hole being at least partially overlapped with an orthographic projection of the first via hole; a thin film transistor located on a side, facing away from the flexible substrate, of the first passivation layer; and an electrical connecting structure, including a signal trace and a connecting terminal.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: May 6, 2025
    Assignee: BOE Technology Group Co., Ltd.
    Inventors: Wei Yang, Ke Wang, Muxin Di
  • Patent number: 12294952
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment may determine a transmission power for an uplink shared channel communication based at least in part on at least one of a code rate parameter, a block length parameter, or a target block error rate parameter associated with the uplink shared channel communication. In some aspects, the user equipment may transmit the uplink shared channel communication using the transmission power based at least in part on determining the transmission power. Numerous other aspects are provided.
    Type: Grant
    Filed: April 17, 2019
    Date of Patent: May 6, 2025
    Assignee: Qualcomm Incorporated
    Inventors: Ying Wang, Wei Yang, Jing Jiang, Gabi Sarkis, Wanshi Chen, Xiao Feng Wang
  • Patent number: 12294980
    Abstract: Methods, systems, and devices for wireless communications are described. A user equipment (UE) may receive control signaling indicating a set of sidelink shared resources of a sidelink shared resource pool, a threshold quantity of mini-slot reservations for the set of sidelink shared resources, and an indication of a sidelink transmission mode of operation, where each slot of one or more slots of the set of sidelink shared resources may include multiple mini-slots. The UE may transmit to one or more sidelink UEs, sidelink control information that may include a reservation of a set of mini-slots of a first slot of the multiple slots, where the quantity of the set of mini-slots satisfies the threshold quantity of mini-slot reservations. The UE may transmit sidelink signaling to the one or more sidelink UEs, via the set of mini-slots according to the sidelink transmission mode of operation associated with the set of mini-slots.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: May 6, 2025
    Assignee: Qualcomm Incorporated
    Inventors: Ahmed Elshafie, Seyedkianoush Hosseini, Wei Yang
  • Patent number: 12294825
    Abstract: Ear buds may have sensors to gather orientation information such as accelerometer measurements during user movements. A host electronic device may communicate wirelessly with the ear buds and may form part of an ear bud system that supplies the user with coaching and feedback while evaluating user performance of a head movement routine or other exercise routine. During operation, the ear buds may gather accelerometer data in a first reference frame such as a reference frame associated with the ear buds and may use a rotation matrix to rotate the data in the first reference frame into a second reference frame such as a neutral reference frame with a fixed orientation to the earth. The data in the neutral reference frame may be analyzed using a user head pose look-up table to categorize measured user head positions as corresponding to respective user head poses.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: May 6, 2025
    Inventors: Daniel J. Perry, Maulik V. Choksi, Wei-Yang Sun
  • Patent number: 12295004
    Abstract: This disclosure provides systems, methods, and apparatus, including computer programs encoded on computer storage media, for multiple downlink control information (DCI) message handling for multiple control resource set (CORESET) groups. In one aspect, a user equipment (UE) may provide separate or joint feedback for data messages received from different CORESET groups. In some examples, the UE may be configured with code block group (CBG)-based transmissions for a component carrier (CC) or a CORESET group in a CC. If implementing a dynamic codebook, the UE may track separate transport block (TB)-based and CBG-based downlink assignment indexes (DAIs) for each CORESET group or may track joint TB-based and CBG-based DAIs across the set of CORESET groups to handle the CBG configuration. Additionally, or alternatively, if implementing a semi-static codebook, the UE may apply skipping rules across the set of CORESET groups or separately for each CORESET group to reduce signaling overhead.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: May 6, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Mostafa Khoshnevisan, Xiaoxia Zhang, Wei Yang, Jing Sun
  • Patent number: 12295005
    Abstract: Methods, systems, and devices for wireless communications are described. A receiving device (such as user equipment (UE)) may receive a downlink grant including an indication to report channel state information. The receiving device may identify, based on the downlink grant, a number of channel state information processing units associated with reporting the channel state information, and may determine that an available number of channel state information processing units is less than the number of channel state information processing units. In some cases, the receiving device may allocate, based on the determining, a set of channel state information processing units including the available number of channel state information processing units and one or more additional channel state information processing units. The receiving device may then transmit the channel state information report based on the set of channel state information processing units.
    Type: Grant
    Filed: February 6, 2020
    Date of Patent: May 6, 2025
    Assignee: QUALCOMM Incorporated
    Inventors: Seyedkianoush Hosseini, Yi Huang, Wei Yang, Yu Zhang, Wanshi Chen, Krishna Kiran Mukkavilli
  • Publication number: 20250140986
    Abstract: A battery system includes multiple battery cells each having a cell vent configured to vent flames originating from the battery cell in the event of a thermal runaway condition of the battery cell, and an insulator disposed adjacent a first battery cell, wherein the insulator comprises a hinged element configured to align with the cell vent of the first battery cell. In a closed position, the hinged element provides insulation for the first battery cell, and in an open position, the hinged element provides a vent to enable flames venting from the cell vent of the first battery cell to escape from between the insulator and the first battery cell to thereby inhibit the flames venting from the cell vent of the first battery cell from reaching a second battery cell.
    Type: Application
    Filed: October 30, 2023
    Publication date: May 1, 2025
    Applicant: Terex South Dakota, Inc.
    Inventors: Kai WANG, Wei YANG, Ling ZHANG, Zachary FUNG
  • Publication number: 20250136788
    Abstract: Provided in the present invention are a reactive composite light stabilizer and the use thereof, and a light-stable modified polymer material. The reactive composite light stabilizer comprises a reactive ultraviolet light absorber and a reactive hindered amine light stabilizer, the reactive ultraviolet light absorber being a reactive triazine ultraviolet light absorber. The reactive triazine ultraviolet light absorber and the reactive hindered amine light stabilizer are combined to achieve a higher absorptivity, a better combining effect, a lower volatility and a higher light-degradation resistance stability, and, both being reactive components, they can exist in the form of chemical bonding in a polymer material, thus having a better long-effective property.
    Type: Application
    Filed: July 13, 2022
    Publication date: May 1, 2025
    Inventors: Wei YANG, Huijing ZHANG, Yanqing LI, Hai LUO, Xiaopeng FAN
  • Publication number: 20250141728
    Abstract: Aspects relate to scrambling and probabilistic shaping of a signal. In some examples, scrambling may be applied to a signal and probabilistic shaping is applied to the scrambled signal. The resulting signal is then modulated and output for transmission (e.g., via a wireless communication resource or some other communication resource).
    Type: Application
    Filed: April 15, 2022
    Publication date: May 1, 2025
    Inventors: Wei YANG, Jing JIANG, Wei LIU
  • Publication number: 20250137977
    Abstract: A measuring system includes a first chamber, a sound sensing device, a sound source and a top cover. A first cavity exists inside the first chamber. The sound sensing device is configured to sense a sound in the first cavity. The sound source is configured to generate a sound wave propagating towards the first cavity. The top cover is disposed on the first chamber. The measuring system is configured to measure a degree of opening of a vent formed by a venting device. The venting device is disposed between the first chamber and the top cover and connected to the first cavity of the first chamber for being measured the degree of opening, the first cavity of the first chamber is between the venting device and the sound sensing device, and the degree of opening is obtained according to a result generated by the sound sensing device.
    Type: Application
    Filed: October 14, 2024
    Publication date: May 1, 2025
    Applicant: XMEMS TAIWAN CO., LTD.
    Inventors: Yuan-Shuang Liu, Ping-Sheng Wang, Ming-che Chuang, Wei-Yang Li, Kuan-Ju Tseng
  • Patent number: 12289098
    Abstract: A 6 GHz Wi-Fi bandpass filter includes a ladder filter circuit with two or more shunt transversely-excited film bulk acoustic resonators (XBARs) and two or more series XBARs. Each of the two or more shunt XBARS includes a diaphragm having an LN-equivalent thickness greater than or equal to 310 nm, and each of the two or more series XBARS includes a diaphragm having an LN-equivalent thickness less than or equal to 305 nm.
    Type: Grant
    Filed: March 30, 2022
    Date of Patent: April 29, 2025
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Wei Yang, Andrew Guyette, Gregory Dyer
  • Patent number: 12286884
    Abstract: A rotary digging drill includes three disk drills arranged in ascending order of diameter, each with a cavity therein. The disk drill includes two circular ring seats arranged side by side, multiple toothed digging buckets disposed at peripheries of the two circular ring seats, and ring gear racks respectively disposed on inner sides of the two circular ring seats. Adjacent ones of the disk drills have the toothed digging buckets facing opposite directions, and the disk drills all rotate in a direction facing a large opening, enabling adjacent two of the three disk drills to rotate in opposite directions. The rotary digging drill further includes three disk drill supports that match the three disk drills in quantity and are configured to support and drive the three disk drills.
    Type: Grant
    Filed: April 19, 2023
    Date of Patent: April 29, 2025
    Assignees: WUHAN CONSTRUCTION ENGINEERING GROUP CO., LTD., INSTITUTE OF ROCK AND SOIL MECHANICS, CHINESE ACADEMY OF SCIENCES
    Inventors: Shuai Wang, Aixun Wang, Qingshan Meng, Mingzhao Wang, Wenxiang Li, Tong Lu, Ming You, Xin Li, Hui Wang, Zhizhen Wu, Keyang Wu, Chen Liu, Chen Qian, Li Wang, Wei Yang, Yunjie Dong, Shenghao Li
  • Patent number: 12287947
    Abstract: A method for determining multimedia editing information includes: obtaining a first playback time of a first target frame in first multimedia data to be edited, a second playback time of the first target frame for second multimedia data after editing and a playback multi-times speed set for the first multimedia data; determining, based on the first playback time and the second playback time, a time deviation that occurs while editing the first multimedia data at the playback multi-times speed for the first multimedia data; and determining, based on the time deviation, the first playback time, the second playback time and the playback multi-times speed, a playback time of the first multimedia data corresponding to each playback time of the second multimedia data after the second playback time.
    Type: Grant
    Filed: November 29, 2022
    Date of Patent: April 29, 2025
    Assignee: BEIJING BAIDU NETCOM SCIENCE TECHNOLOGY CO., LTD.
    Inventors: Tong Wu, Wei Yang
  • Publication number: 20250132247
    Abstract: An interconnection structure is provided to include a substrate, a first metal trench, a boron nitride dielectric, a second metal trench, and a metal via. The substrate is formed with a first metal trench. The boron nitride dielectric is disposed over the substrate. The second metal trench is formed in the boron nitride dielectric. The metal via is disposed to interconnect the first metal trench and the second metal trench.
    Type: Application
    Filed: October 24, 2023
    Publication date: April 24, 2025
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chi-Lin TENG, Gary LIU, Ting-Ya LO, Yen-Ju WU, Shao-Kuan LEE, Kuang-Wei YANG, Hsin-Yen HUANG, Hsiao-Kang CHANG
  • Publication number: 20250127613
    Abstract: The present invention provides a prosthetic heart valve, including a stent, prosthetic leaflets and an occlusion mechanism. Both the prosthetic leaflets and the occlusion mechanism are connected to the stent. The occlusion mechanism is able to extend outwards away from the stent and fill up a recessed portion of a native valve annulus, thereby closely fitting the prosthetic heart valve against the native valve annulus and effectively preventing paravalvular leakage.
    Type: Application
    Filed: August 19, 2022
    Publication date: April 24, 2025
    Applicants: SHANGHAI TRULIVE MEDTECH CO., LTD., JIANGSU TRULIVE MEDTECH CO., LTD.
    Inventors: Kaiqiang HU, Wei YANG, Yongqiang WEI