Abstract: A photographing optical lens system includes, in order from an object side to an image side, a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element and an eighth lens element. The second lens element has positive refractive power. The eighth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface of the eighth lens element has at least one convex shape in an off-axis region thereof, and both an object-side surface and the image-side surface thereof are aspheric. The photographing optical lens system has a total of eight lens elements. An air gap in a paraxial region is located between every two lens elements of the photographing optical lens system that are adjacent to each other.

Abstract: An electronic apparatus including a package substrate and a structure disposed on and electrically connected to the package substrate through conductive bumps is provided. The material of the conductive bumps includes a bismuth (Bi) containing alloy or an indium (In) containing alloy. In some embodiments, the bismuth (Bi) containing alloy includes Sn—Ag—Cu—Bi alloy. In some embodiments, a concentration of bismuth (Bi) contained in the Sn—Ag—Cu—Bi alloy ranges from about 1 wt % to about 10 wt %. Methods for forming the Sn—Ag—Cu—Bi alloy are also provided.

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

Abstract: A method includes forming a composite package substrate. The formation of the composite package substrate includes encapsulating an interconnect die in an encapsulant, with the interconnect die including a plurality of through-vias therein, and forming a first plurality of redistribution lines (RDLs) and a second plurality of RDLs on opposite sides of the interconnect die. The method further includes bonding an organic package substrate to the composite package substrate, and bonding a first package component and a second package component to the first plurality of RDLs. The first package component and the second package component are electrically interconnected through the interconnect die and the first plurality of RDLs.

Abstract: An optical imaging lens assembly includes seven lens elements which are, in order from an object side to an image side: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element and a seventh lens element. The seventh lens element has an image-side surface being concave in a paraxial region thereof. At least one of an object-side surface and the image-side surface of the seventh lens element has at least one critical point in an off-axis region thereof. The object-side surface and the image-side surface of the seventh lens element are both aspheric.

Abstract: A system for reflowing a semiconductor workpiece including a stage, a first vacuum module and a second vacuum module, and an energy source is provided. The stage includes a base and a protrusion connected to the base, the stage is movable along a height direction of the stage relative to the semiconductor workpiece, the protrusion operably holds and heats the semiconductor workpiece, and the protrusion includes a first portion and a second portion surrounded by and spatially separated from the first portion. The first vacuum module and the second vacuum module respectively coupled to the first portion and the second portion of the protrusion, and the first vacuum module and the second vacuum module are operable to respectively apply a pressure to the first portion and the second portion. The energy source is disposed over the stage to heat the semiconductor workpiece held by the protrusion of the stage.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, first conductive terminals, an insulating encapsulation, and a semiconductor device is provided. The redistribution circuit structure includes stacked dielectric layers, redistribution wirings and first conductive pads. The first conductive pads are disposed on a surface of an outermost dielectric layer among the stacked dielectric layers, the first conductive pads are electrically connected to outermost redistribution pads among the redistribution wirings by via openings of the outermost dielectric layer, and a first lateral dimension of the via openings is greater than a half of a second lateral dimension of the outermost redistribution pads. The wiring substrate includes second conductive pads. The first conductive terminals are disposed between the first conductive pads and the second conductive pads. The insulating encapsulation is disposed on the surface of the redistribution circuit structure.

Abstract: A method of manufacturing a package structure includes the following processes. An encapsulant is formed to laterally encapsulate a die. A plurality of first connectors are formed over the encapsulant. A warpage control material is formed over the die, wherein the first connectors are exposed by the warpage control material. A protection material is formed over the encapsulant between the first connectors. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: A package structure includes a die, an encapsulant, a warpage control material and a protection material. The encapsulant laterally encapsulates the die. The warpage control material is disposed over the die. The protection material is disposed on a first sidewall of the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.

Abstract: An imaging optical lens system includes eleven lens elements which are, in order from an object side to an image side along an optical path: a first lens element, a second lens element, a third lens element, a fourth lens element, a fifth lens element, a sixth lens element, a seventh lens element, an eighth lens element, a ninth lens element, a tenth lens element and an eleventh lens element. There is an air gap in a paraxial region between each of all adjacent lens elements of the imaging optical lens system. At least one of an object-side surface and an image-side surface of each of at least two lens elements located between an aperture stop and an image surface of the imaging optical lens system is concave in a paraxial region thereof and has at least one convex critical point in an off-axis region thereof.

Abstract: A package structure including a first semiconductor die, at least one second semiconductor die conductive terminals and an insulating encapsulation is provided. The at least one second semiconductor die is stacked on and electrically connected to the first semiconductor die. The conductive terminals are disposed on and electrically connected to the first semiconductor die. The insulating encapsulation laterally encapsulates the first semiconductor die, the at least one second semiconductor die and the conductive terminals, wherein the conductive terminals protrude from a surface of the insulating encapsulation. Furthermore, a method for forming the above-mentioned is also provided.

Abstract: A manufacturing method of a modified polymer layer modified by hydroxyapatite is provided in the present disclosure, including following steps: (a) providing a polymer layer; (b) plasma-activating acrylic acid using an atmospheric cold plasma device to modify a surface of the polymer layer to obtain an acrylic-modified polymer layer; (c) immersing the acrylic-modified polymer layer in a first solution containing a calcium ion to obtain a calcium-containing modified layer; and (d) immersing the calcium-containing modified layer in a second solution containing phosphate salt to obtain a modified polymer layer modified by hydroxyapatite.

Abstract: A photographing lens assembly includes, in order from an object side to an image side: a first, a second, a third, a fourth, a fifth and a sixth lens elements. The first lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, wherein the object-side surface has at least one convex critical point in an off-axis region thereof. The third lens element has an image-side surface being convex in a paraxial region thereof. The fourth lens element has positive refractive power. The fifth lens element with negative refractive power has an object-side surface being concave in a paraxial region thereof, and an image-side surface being convex in a paraxial region thereof. The sixth lens element has an image-side surface being concave in a paraxial region thereof, wherein the image-side surface has at least one convex critical point in an off-axis region thereof.

Abstract: A detection system includes a first electron source configured to generate a first electron beam and to cause the first electron beam to impinge on a sample, a second electron source configured to generate a second electron beam and to cause the second electron beam to impinge on the sample, a detector, and a control system. The control system is configured to control the first electron source to cause the first electron beam to scan an area of the sample, control a charge state of the sample by varying at least one of a landing energy and a beam current of the second electron beam, control the detector to detect electrons emitted by the sample, receive a detector signal from the detector, and generate a voltage contrast image from the detector signal.

Abstract: A dual-mode transmission device includes a dual-mode signal output port, a detection module and a signal mode switching module. The dual-mode signal output port is configured to switchably connect a data source to a DP signal receiving port or an HDMI signal receiving port. The detection module is configured for detecting the type of a signal receiving port connected to the dual-mode signal output port. The signal mode switching module converts the dual-mode signal output port into a DP specification signal output port according to the type of the signal receiving port, and connects to the DP signal receiving port accordingly; or converts the dual-mode signal output port into an HDMI specification signal output port, and connects to the HDMI signal receiving port. The signal mode switching module switches the DP and the HDMI specification signal output ports by detecting potentials of pins through the detection module.

Abstract: An electronic device includes an optical lens assembly. The optical lens assembly includes four lens elements which are, in order from an outer side to an inner side: a first lens element, a second lens element, a third lens element and a fourth lens element. The first lens element has negative refractive power. An outer-side surface of the first lens element is concave in a paraxial region thereof and has at least one convex critical point in an off-axis region thereof. The third lens element has positive refractive power. The fourth lens element has an inner-side surface being convex in a paraxial region thereof and having at least one concave critical point in an off-axis region thereof. The optical lens assembly has a total of four lens elements.

Abstract: A method includes performing a first laser shot on a first portion of a top surface of a first package component. The first package component is over a second package component, and a first solder region between the first package component and the second package component is reflowed by the first laser shot. After the first laser shot, a second laser shot is performed on a second portion of the top surface of the first package component. A second solder region between the first package component and the second package component is reflowed by the second laser shot.

Abstract: An apparatus to facilitate a fused instruction to accelerate performance of secure hash algorithm 2 (SHA-2) in a graphics environment is disclosed. The apparatus includes a processor comprising processing resources, the processing resources comprising execution circuitry to receive a fused SHA instruction identifying a length corresponding to a data size of the fused SHA instruction and a functional control identifying an operation type of the fused SHA instruction; based on decoding the fused SHA instruction, cause a sub-function identified by the length and the function control to be scheduled to an integer pipeline of the execution resource; and execute the sub-function of the fused SHA instruction in an integer pipeline of the execution circuitry, the sub-function to perform merged operations on a source operand of the fused SHA instruction, the merged operations comprising a rotate operation, a shift operation, and an xor operation.

Abstract: A method includes attaching a carrier to a semiconductor wafer using a release film; removing the carrier from the semiconductor wafer; and performing a treatment process to remove the release film from the semiconductor wafer, the treatment process comprising: flowing an etchant through a diffusion plate within a treatment chamber, the diffusion plate comprising concentric rings separated by dividers, the concentric rings comprising a first concentric ring of holes, a second concentric ring of holes, and a third concentric ring of holes, each of the concentric rings having a different hole density; and performing a cleaning process on the semiconductor wafer.

Abstract: A package structure includes a die, an encapsulant laterally encapsulating the die, a warpage control material disposed over the die, and a protection material disposed over the encapsulant and around the warpage control material. A coefficient of thermal expansion of the protection material is less than a coefficient of thermal expansion of the encapsulant.