Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.

Abstract: A display panel and an assembling method of the same are described. An image capture module is electrically disposed on a substrate of a display module, such that the image capture module and the display module are combined into an integrated structure, so as to reduce the overall size of a display assembled by using the display panel.

Abstract: A mouse wheel assembly is provided according to the present invention. The mouse wheel assembly includes a member and an optical module. The member has a pattern formed thereon. The optical module is adapted to illuminate the pattern on the member, capture an image of the pattern as a result of the illumination and recognize a feature change of the image of the pattern to obtain the change direction and change speed of the member.

Abstract: A display panel and an assembling method of the same are described. An image capture module is electrically disposed on a substrate of a display module, such that the image capture module and the display module are combined into an integrated structure, so as to reduce the overall size of a display assembled by using the display panel.

Abstract: A fastening structure of a computer peripheral device includes a combining slot and a fastening body disposed on a housing member of the computer peripheral device. The fastening body has a first restricting surface and a second restricting surface. The computer peripheral device is clamped to a first object through the first restricting surface of the fastening body and the combining slot, or a second object is hooked to the computer peripheral device through the second restricting surface of the fastening body.

Abstract: An image sensor module is installed in a sensing device, and is used to detect a reflected light of an object. The image sensor module includes a carrier, a light sensing element, and a package body. The light sensing element is disposed on a substrate. The carrier is disposed on the substrate in the sensing device. The light sensing element is installed in the carrier, and is electrically connected with the substrate via multiple solder balls. The package body is installed on the carrier, and has a reflecting and diverting element, which is located between the light sensing element and the object and is used for reflecting reflected light of the object and diverting the reflected light towards a receiving direction of the light sensing element. The light sensing element receives the reflected light and generates a corresponding sensing signal.

Abstract: A sensing device includes a housing and an image sensing system disposed in the housing and used for detecting a reflected light from an object. The image sensing system includes a substrate, a light sensing element, and a reflection and redirection element. The light sensing element is disposed on the substrate. The reflection and redirection element is disposed between the light sensing element and the object, and used for reflecting and redirecting the reflected light from the object to a receiving direction of the light sensing element, such that the light sensing element receives the reflected light and generates a corresponding sensing signal.

Abstract: A fastening structure of a computer peripheral device includes a combining slot and a fastening body disposed on a housing member of the computer peripheral device. The fastening body has a first restricting surface and a second restricting surface. The computer peripheral device is clamped to a first object through the first restricting surface of the fastening body and the combining slot, or a second object is hooked to the computer peripheral device through the second restricting surface of the fastening body.

Abstract: A circuit interface device is presented. A circuit board is secured by a circuit board cover, a plurality of electrical contacts is disposed on the circuit board, and a connector cover is coupled to a front end of the circuit board, such that a socket disposed at one end of the connector cover is corresponding to an upper side of the electrical contacts of the circuit board, thereby forming a connector of the circuit interface device. As such, through a structural design of buckling the connector cover on the circuit board without completely covering the connector cover on outer edge of the circuit board, a thickness of the connector cover covering the circuit board cover is reduced.

Abstract: A mouse wheel assembly is provided according to the present invention. The mouse wheel assembly includes a member and an optical module. The member has a pattern formed thereon. The optical module is adapted to illuminate the pattern on the member, capture an image of the pattern as a result of the illumination and recognize a feature change of the image of the pattern to obtain the change direction and change speed of the member.

Abstract: An optical touch module is adapted to provide a touch area. At least one sensor is disposed at a corner of the touch area. The optical touch module includes at least one light emitting element and at least one waveguide element. The waveguide element is disposed on at least one side of the touch area, for guiding and emitting light rays provided by the light emitting element to the touch area. Each waveguide element includes a light incident surface and a light emitting surface. The light incident surface faces the light emitting element. The light emitting surface faces the touch area. Thereby, the light rays emitted from the light emitting element are distributed on the touch area through the waveguide element, so as to lower the luminance of the light emitting element and reduce the current consumption.

Abstract: A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.

Abstract: A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar.

Abstract: A MEMS package includes a first board, a second board and a laminate material. The first board includes a lower metallic trace, a metallic diaphragm and a through opening. The lower metallic trace is located on the lower surface of the first board, and the metallic diaphragm is disposed on the lower metallic trace. The second board includes an upper metallic trace and a metallic electrode. The upper metallic trace is located on the upper surface of the second board, the metallic electrode is disposed on the upper metallic trace, and the metallic electrode is corresponding to the metallic diaphragm. The laminate material is disposed between the lower and upper metallic traces, and includes a hollow portion for accommodating the metallic electrode and metallic diaphragm, wherein a sensing unit is formed by the metallic electrode, the hollow portion and the metallic diaphragm, and is corresponding to the through opening.

Abstract: A method for manufacturing a device having a via structure includes the following steps. A seed metallic layer is formed on a substrate. A patterned metallic-trace layer is formed on the seed metallic layer. A positive-type photoresist layer is formed on the patterned metallic-trace layer and seed metallic layer. The photoresist layer is patterned for defining a through hole which exposes a part of the patterned metallic-trace layer, wherein the through hole has a high aspect ratio. A metallic material is electroplated in the through hole so as to form a metallic pillar. The photoresist layer is removed. A part of the seed metallic layer is etched, whereby traces of the patterned metallic-trace layer are electrically isolated from each other. A dielectric material layer is formed on the substrate for sealing the patterned metallic-trace layer and a part of the metallic pillar and exposing a top surface of the metallic pillar.

Abstract: In a personal digital assistant assembly, a coupling block disposed on an operating surface of a base module is rotatable about a pivot axle transverse to the operating surface. An elongated hinge unit interconnects pivotally a connecting end of a personal digital assistant and the coupling block such that the personal digital assistant is rotatable about a longitudinal axis parallel to the operating surface and transverse to the pivot axle and is movable to a desired angular position relative to the coupling block. The coupling block is movable between an expanded position, where the personal digital assistant uncovers a user input unit on the operating surface of the base module, and a closed position, where the personal digital assistant is capable of covering the user input unit.