Abstract: An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or between exposed portions of adjacent leads. The spark gap distance is designed to achieve required ratings for a given application. Stacked and side-by-side die configurations are described.

Abstract: A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the die and the lead frame such that the die remains level and magnetic coupling remains intact. An insulation structure may control the gap height between the lead frame and the die evenly during transfer molding, by supporting the die across its length and/or width. Epoxy dots are also or instead used to control the gap height and eliminate die tilt.

Abstract: Provided are compositions comprising polynucleotides encoding Rps genes, and soybean plants or soybean seeds comprising the compositions and exhibiting resistance to Phytophthora. Additionally, various methods for employing the polynucleotides to increase resistance to Phytophthora are also provided herein.

Abstract: A guiding laryngoscope includes a holding part, a bending part and a tongue lifting part. The bending part is connected with an end of the holding part, and a guiding groove for guiding an intubation tube is provided in the bending part. One end of the tongue lifting part is connected with an end of the bending part away from the holding part and faces a side of the holding part, and the other end of the tongue lifting part is arranged to extend along a bending direction of the bending part. A first included angle between an extension line of a tube-out end of the guiding groove and a central axis of the holding part is smaller than a second included angle between an extension line of an end of the tongue lifting part and the central axis of the holding part.

Abstract: Provided are compositions comprising polynucleotides encoding Rps genes, and soybean plants or soybean seeds comprising the compositions and exhibiting resistance to Phytophthora. Additionally, various methods for employing the polynucleotides to increase resistance to Phytophthora are also provided herein.

Abstract: A current sensor integrated circuit (IC) package is flip-chip bonded using a conductive film to connect the IC circuit bond pads to the lead frame. A conductive film is positioned between the die surface of a semiconductor die and at least one signal lead of the lead frame. The conductive film is conductive in a first direction between the die and the signal lead and nonconductive in other directions. The conductive film is further configured to control a gap height between the die and the lead frame to reduce die tilt, thus improving the sensitivity and performance consistency of the package.

Abstract: Hydroxybenzamide derivative compounds having ?-cell protective activity against ER stress, and methods of their use in treating diabetes and other conditions and diseases associated with ER stress. In one non-limiting embodiment, the derivative is 3-hydroxy-N-(4-(trifluoromethyl)benzyl)benzamide.

Abstract: An integrated circuit package includes a lead frame with a split die-attach paddle (DAP) that supports a semiconductor die with one or more magnetic field sensing elements. The split paddle reduces magnetic reluctance for enhancing coupling to the die and reducing eddy currents. The package provides mechanical stability to prevent die tilt, limiting sensing errors and protecting the die from stress from downstream mechanical forces during test and assembly pick processes. The mechanical stability is provided by one or more leads, strip tie-bars and/or band bars.

Abstract: A gas sensor is disclosed. The gas sensor can include a housing that has an upper portion and a lower portion. The gas sensor can also include a chamber that is formed in the lower portion of the housing. The chamber can be configured to receive an electrochemical solution. The gas sensor can also include a plurality of electrodes that are formed in the upper portion of the housing. The plurality of electrodes can be molded in the upper portion of the housing and at least partially exposed to the chamber. The gas sensor can further include an access port that is formed in the upper portion. The access port can be configured to provide fluid communication between the an interior of the housing and the outside environs. The gas sensor can be a system-in-package (SiP) sensor.

Abstract: An integrated low-pass and band-pass filter unit comprises an inner cavity formed by a shell of conductive materials; one or more low-pass resonators and two or more band-pass resonators comprised in the inner cavity. The low-pass and band-pass resonators are integrally formed by electroplated sheet metal material, and a part of each of the low-pass and band-pass resonators is coated with dielectric material. The two or more band-pass resonators are arranged at two sides of the inner cavity such that at least two resonators are aligned to face each other. The integrated low-pass and band-pass filter unit further comprises a first separator of electroplated sheet metal arranged in the inner cavity between the low-pass resonators and band-pass resonators and a second separator of electroplated sheet metal arranged in the inner cavity between the band-pass resonators at the two sides of the inner cavity.

Abstract: According to embodiments of the disclosure, a method, an apparatus, a device, and a storage medium for content sharing are provided. The method includes: in response to target content being shared to a chat, displaying a prompt message of the target content being shared in an interface of the chat; and displaying, in association with the prompt message, sharing recommendation information indicating one or more objects. Thus, the target content may be shared with the one or more objects based on the sharing recommendation information, which helps to improve the collaboration efficiency of the target content.

Abstract: A resonator apparatus, a filter apparatus as well as a radio frequency and microwave device are disclosed. According to an embodiment, the resonator apparatus comprises an electrically conductive case and a dual-mode dielectric resonator provided in the electrically conductive case. The dual-mode dielectric resonator comprises a first dielectric block having a shape of a columnar body whose cross section is a cruciform. A mode coupling structure for coupling two resonant modes of the dual-mode dielectric resonator is provided in the columnar body. A bottom face of the columnar body is supported by an inner face of the electrically conductive case or by a supporting member provided on the inner face of the electrically conductive case. In at least one extending direction of a first extending direction and a second extending direction of the cruciform which are perpendicular to each other, lateral end faces of the columnar body are spaced apart from inner faces of the electrically conductive case.

Abstract: A magnetic field sensor comprises a die, first and second magnetic field sensing elements supported by the die, at respective spaced apart positions, and a lead frame supporting the die. The lead frame comprises a die attach segment having first and second openings formed therein, where there is no lead frame covering either magnetic field sensing element. The die attach segment includes a horizontal support portion disposed between the first and second openings, having a size configured to provide die support along a predetermined portion of at least one predetermined horizontal axis of the die. In other aspects, the lead frame comprises multiple die attach segments separated by slots, where at least one of the multiple die attach segments supports the die along its horizontal axis. At least one of the slots mitigates a current loop arising from operation of at least one of the magnetic field sensing elements.

Abstract: The present disclosure provides a document access method and apparatus, a device, a storage medium, and a program product. The method comprises: in response to a user having a first access permission of a first document, displaying document content of the first document; in response to receiving an access request for target information displayed in the document content of the first document, determining whether the user has a second access permission; and if the user does not have the second access permission, refusing to display associated content of the target information, the target information comprising at least one of the following: a link of a second document, a collaborator of the first document, and a user identifier displayed in the first document.

Abstract: A one-piece resonant element (100, 100?) for a filter (10, 10?), comprising a main body (100-12, 100?-12) which comprises an elongate middle part (100-1, 100?-1) and resonant end parts (100-2, 100?-2) provided on both ends of the middle part (100-1, 100?-1), wherein the one-piece resonant element further comprises a cross-coupling arm (100-3, 100?-3, 100?-3i) extending integrally from the middle part (100-1, 100?-1) and configured for creating inductive or capacitive cross-coupling with a resonator that is located on a signal transmission path of the filter. A resonant unit (200, 200?) comprising above-said resonant element and a filter (10, 10?) comprising the above said resonant element or resonant unit.

Abstract: A current sensor integrated circuit (IC) package includes an insulation structure disposed between a semiconductor die and a lead frame to control gap height and prevent the die from tilting and dropping the magnetic field coupling between the die the primary conductor. An insulation structure is disposed between the die and the lead frame such that the die remains level and magnetic coupling remains intact. An insulation structure may control the gap height between the lead frame and the die evenly during transfer molding, by supporting the die across its length and/or width. Epoxy dots are also or instead used to control the gap height and eliminate die tilt.

Abstract: An integrated circuit package having more than one semiconductor die includes a spark gap to provide a current path designed to protect the device. The spark gap can be provided between an exposed portion of a corner lead and an exposed portion of a tie bar and/or between exposed portions of adjacent leads. The spark gap distance is designed to achieve required ratings for a given application. Stacked and side-by-side die configurations are described.

Abstract: A TM dual-mode dielectric resonator, comprising: a metal cavity; and a TM dielectric resonator body located in the cavity and having grounding surfaces connected with walls of the cavity so that two electric fields are formed in first and second directions perpendicular to each other, characterized in that, two end surfaces of the TM dielectric resonator body which are perpendicular to the first direction and a first end surface of the TM dielectric resonator body which is perpendicular to the second direction are configured as the grounding surfaces, and a second end surface of the TM dielectric resonator body which is perpendicular to the second direction is placed in a non-grounding state. The present disclosure also relates to a TM dual-mode filter comprising an above-said TM dual-mode dielectric resonator.

Abstract: A resonating structure and a dielectric filter having the same are disclosed. The resonating structure comprises a body, at least one set of negative coupling holes, and a conductive material layer. The body is made of a solid dielectric material and comprises at least two resonators. The negative coupling holes are formed at a connection between two adjacent resonators. Each set of negative coupling holes comprises a first blind hole and a second blind hole disposed on two opposite surfaces of the body respectively. The first blind hole and the second blind hole are offset from each other in a plane perpendicular to a direction along which the first or second blind hole is dug. The conductive material layer covers surfaces of the body and surfaces of the first blind hole and the second blind hole.