Patents by Inventor Wei-Feng Fan

Wei-Feng Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink assembly with heat pipe
    Patent number: 6909608
    Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe is disposed in a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.
    Type: Grant
    Filed: July 1, 2003
    Date of Patent: June 21, 2005
    Assignee: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Heat sink assembly with heat pipe
    Publication number: 20040165350
    Abstract: The present invention provides a heat sink assembly. The heat sink assembly comprises a first heat sink with a fan disposed therein, a second heat sink and a heat pipe. The heat pipe has two ends respectively being disposed inside the first heat sink and the second heat sink, The heat pipe Is disposed In a side of the first heat sink and the second heat sink and connects the first heat sink and the second heat sink with a space therein for positioning the fan. Therefore, the first heat sink and the second heat sink become a main heat-dissipating region and a sub heat-dissipating region. Heat is dissipated first in the first heat sink (the main heat-dissipating region) and then transferred via the heat pipe to the second heat sink (the sub heat-dissipating region) for being dissipated again.
    Type: Application
    Filed: July 1, 2003
    Publication date: August 26, 2004
    Applicant: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan
  • Heat pipe heat sink assembly
    Patent number: D487885
    Type: Grant
    Filed: May 2, 2003
    Date of Patent: March 30, 2004
    Assignee: Datech Technology Co., Ltd.
    Inventor: Wei-Feng Fan