Abstract: The present application discloses a display panel and manufacturing method thereof and a display apparatus. The display panel includes: a first sub-pixel disposed in the first display area and including a first light-emitting structure, and the first light-emitting structure including at least one first common layer disposed between the first electrode and the second electrode; and a second sub-pixel disposed in the second display area and including a second light-emitting structure, and the second light-emitting structure including at least one second common layer disposed between the third electrode and the fourth electrode, in which a thickness of the fourth electrode is smaller than a thickness of the second electrode, and a total thickness of the at least one second common layer is greater than a total thickness of the at least one first common layer.

Abstract: This application discloses an input device and an electronic device input system. The input device includes a device body, a touchpad (400), and a first key (300); the device body includes a handheld part, the first key (300) and the touchpad (400) are arranged on the device body and located on the same side of the device body, and in a case that the handheld part is in a first state, a curvature of the handheld part is a first curvature; and in a case that the handheld part is in a second state, the curvature of the handheld part is a second curvature, and the first curvature is greater than the second curvature.

Abstract: A method and system for positioning a target in a brain region are provided. The method includes: obtaining datasets of N persons at a first time point and a second time point after stroke; constructing a first lesion mapping functional network based on each resting-state functional magnetic resonance imaging image in a first stroke dataset; constructing an acute phase cognitive-lesion mapping functional network; constructing a chronic phase cognitive-lesion mapping functional network; comparing the acute phase cognitive-lesion mapping functional network with the chronic phase cognitive-lesion mapping functional network to obtain a key improvement network; calculating a whole-brain functional connectivity network with each voxel as a seed point, and performing spatial correlation calculation on the whole-brain functional connectivity network and the key improvement network to obtain a spatial correlation network; and determining a therapeutic target of the functional image to be positioned.

Abstract: The present disclosure provides a model training method; and the model training method includes: by a host process, acquiring training data, and dividing the training data for a training node cluster employing a master-workers architecture to obtain multiple pieces of sub-training data; wherein the training node cluster comprises a master node and multiple worker nodes; wherein the host process runs in a non-trusted execution environment, and the training node cluster runs in a trusted execution environment; by the host process, encrypting each piece of sub-training data, and storing the encrypted sub-training data in a shared memory of the host process; and controlling the master node and each of the worker nodes to acquire corresponding encrypted sub-training data from the shared memory in accordance with corresponding data storage addresses, respectively, and train a preset model by using corresponding respective decrypted sub-training data, respectively, to obtain a trained model.

Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Abstract: Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.

Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Abstract: Methods for directly measuring a patient's relative sensitivity to radiation therapy are provided. In particular, the methods provide for calculating a radiation sensitivity quotient for monocytes in culture. The methods can be incorporated into radiotherapy (RT) treatment planning systems, which are also provided. The methods can be used to optimize patient treatment plans, thereby developing patient-specific radiation treatment plans. Methods for treating a patient with radiotherapy with an optimized treatment plan are provided.

Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.

Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.

Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.

Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.

Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.

Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.

Abstract: The present invention relates to a visual efficacy determining method for non-colored objects in different light environments, comprising: a) setting light environment; b) placing an object for performing visual recognition of a driver; c) resetting the light environment, and repeating the step b); d) processing visual recognition information data obtained after experiments, and establishing a correlating relationship between visual recognition time and color temperature, color rendering index and brightness parameters of the light environment; and e) performing visual efficiency analysis according to the visual recognition information data processing results. The present invention further provides a system for implementing the visual efficacy determining method for non-colored objects in different light environments, wherein the system comprises a simulated tunnel middle section subsystem, a testing subsystem and a data processing subsystem.

Abstract: Methods and compositions are provided involving high producing cell lines. Embodiments concern efficient methods for screening for such cell lines and for creating such cell lines. These cell lines can be used to create large amounts of protein. To quickly generate large quantity of recombinant proteins or vaccines for both pre-clinical study and clinical trials, almost all drug development will face the same challenging obstacle of rapidly generating a high stable producer. Developing and identifying a stable cell line is a critical part of biopharmaceutical development.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth, and between 50 and 70 parts by weight of a polyester powder coating. The polyester powder coating includes a polyester resin and a curing agent. The polyester resin is a polymer of monomers selected from terephthalic acid, m-phthalic acid, neopentyl glycol, adipic acid, ethylene glycol, or a mixture thereof. The curing agent accounts for 2-20 wt. % of the polyester powder coating. The polyester powder coating is evenly distributed on the fiber cloth. A method of preparing the packaging material includes: evenly distributing the polyester powder coating on the fiber cloth using a coating device; and thermally bonding the polyester powder coating and the fiber cloth.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.

Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.