Abstract: The present invention provides a fractional order sliding mode synchronous control method for a teleoperation system based on an event trigger mechanism. The method comprises: establishing a dynamics model for the teleoperation system by considering external disturbance and parameter uncertainty, selecting a master robot and a slave robot, interactively establishing the teleoperation system through a communication network, determining system parameters of the dynamics model, designing a fractional order nonsingular rapid terminal sliding mode surface equation by utilizing a position tracking error and a fractional order calculus, setting a trigger event condition of information interaction between the master robot and the slave robot, designing a self-adaptive fractional order nonsingular rapid terminal sliding mode controller based on the sliding mode, designing a Lyapunov function to carry out stability analysis, proving the boundedness of a closed-loop state signal of the system.

Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Abstract: Semiconductor dies formed on a wafer may be picked from the wafer with little or no stress, thus preventing cracking and damage to the semiconductor dies. A die attach film (DAF) layer is laminated onto an inactive surface of the wafer and the DAF layer is cut in the outline of the dies. The inactive surface of the wafer may then be supported on a vacuum chuck without using a dicing tape, and dies transferred from the wafer using a pick and place robot.

Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.

Abstract: Methods for directly measuring a patient's relative sensitivity to radiation therapy are provided. In particular, the methods provide for calculating a radiation sensitivity quotient for monocytes in culture. The methods can be incorporated into radiotherapy (RT) treatment planning systems, which are also provided. The methods can be used to optimize patient treatment plans, thereby developing patient-specific radiation treatment plans. Methods for treating a patient with radiotherapy with an optimized treatment plan are provided.

Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.

Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.

Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.

Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.

Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.

Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.

Abstract: The present invention relates to a visual efficacy determining method for non-colored objects in different light environments, comprising: a) setting light environment; b) placing an object for performing visual recognition of a driver; c) resetting the light environment, and repeating the step b); d) processing visual recognition information data obtained after experiments, and establishing a correlating relationship between visual recognition time and color temperature, color rendering index and brightness parameters of the light environment; and e) performing visual efficiency analysis according to the visual recognition information data processing results. The present invention further provides a system for implementing the visual efficacy determining method for non-colored objects in different light environments, wherein the system comprises a simulated tunnel middle section subsystem, a testing subsystem and a data processing subsystem.

Abstract: Methods and compositions are provided involving high producing cell lines. Embodiments concern efficient methods for screening for such cell lines and for creating such cell lines. These cell lines can be used to create large amounts of protein. To quickly generate large quantity of recombinant proteins or vaccines for both pre-clinical study and clinical trials, almost all drug development will face the same challenging obstacle of rapidly generating a high stable producer. Developing and identifying a stable cell line is a critical part of biopharmaceutical development.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth, and between 50 and 70 parts by weight of a polyester powder coating. The polyester powder coating includes a polyester resin and a curing agent. The polyester resin is a polymer of monomers selected from terephthalic acid, m-phthalic acid, neopentyl glycol, adipic acid, ethylene glycol, or a mixture thereof. The curing agent accounts for 2-20 wt. % of the polyester powder coating. The polyester powder coating is evenly distributed on the fiber cloth. A method of preparing the packaging material includes: evenly distributing the polyester powder coating on the fiber cloth using a coating device; and thermally bonding the polyester powder coating and the fiber cloth.

Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.

Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.

Abstract: The present application provides a VEGFR1 antigen polypeptide containing three polypeptides, namely H-DEGVYHCKATNQKGSVESSAYLTVQGTSDKSNLE-OH, H-DLKLSCTVNKFLYRDVTWILLRTVNNRTMHYSI-OH and H-ESGLSDVSRP SFCHSSCGHVSEG KRRFTYDHAEL-OH, and an application of the antigen polypeptide to detection of a serum immunity marker, namely a VEGFR1 autoantibody. The present invention also provides a method for detecting the serum immunity marker-VEGFR1 autoantibody by using the VEGFR1 antigen polypeptide described in the present application and a test kit containing the VEGFR1 antigen polypeptide.

Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.

Abstract: The present invention relates to a visual efficacy determining method for non-colored objects in different light environments, comprising: a) setting light environment; b) placing an object for performing visual recognition of a driver; c) resetting the light environment, and repeating the step b); d) processing visual recognition information data obtained after experiments, and establishing a correlating relationship between visual recognition time and color temperature, color rendering index and brightness parameters of the light environment; and e) performing visual efficiency analysis according to the visual recognition information data processing results. The present invention further provides a system for implementing the visual efficacy determining method for non-colored objects in different light environments, wherein the system comprises a simulated tunnel middle section subsystem, a testing subsystem and a data processing subsystem.