Patents by Inventor Weili Wang

Weili Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210366875
    Abstract: A semiconductor device includes a vertical column of wire bonds on substrate contact fingers of the device. Semiconductor dies are mounted on a substrate, and electrically coupled to the substrate such that groups of semiconductor dies may have bond wires extending to the same contact finger on the substrate. By bonding those wires to the contact finger in a vertical column, as opposed to separate, side-by-side wire bonds on the contact finger, an area of the contact finger may be reduced.
    Type: Application
    Filed: December 30, 2020
    Publication date: November 25, 2021
    Applicant: WESTERN DIGITAL TECHNOLOGIES, INC.
    Inventors: Xiaofeng Di, Junrong Yan, CheeKeong Chin, Weili Wang, Xin Lu, Qi Deng, Chaur Yang Ng, Cong Zhang, Chenlin Yang, Chin-Tien Chiu
  • Publication number: 20210252308
    Abstract: Methods for directly measuring a patient's relative sensitivity to radiation therapy are provided. In particular, the methods provide for calculating a radiation sensitivity quotient for monocytes in culture. The methods can be incorporated into radiotherapy (RT) treatment planning systems, which are also provided. The methods can be used to optimize patient treatment plans, thereby developing patient-specific radiation treatment plans. Methods for treating a patient with radiotherapy with an optimized treatment plan are provided.
    Type: Application
    Filed: June 10, 2019
    Publication date: August 19, 2021
    Applicant: Indiana University Research and Technology Corporation
    Inventors: Jian-Yue Jin, Wenhu Pi, Feng-Ming Kong, Weili Wang
  • Patent number: 11007739
    Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.
    Type: Grant
    Filed: July 7, 2017
    Date of Patent: May 18, 2021
    Inventors: Biao He, Wei Chen, ChaoFeng Zhang, FengChao Shen, TongFei Jiang, JiaJia Zhu, WeiLi Wang, HaiJun Wang
  • Patent number: 10872989
    Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: December 22, 2020
    Assignees: TIGER NEW SURFACE MATERIALS (SUZHOU) CO., LTD., SUNMAN (SHANGHAI) CO., LTD.
    Inventors: Tianhe Dai, Biao Luo, Zhicheng Wang, Guozhu Long, Jiaoyan Liu, Chengrong Lian, Weili Wang
  • Publication number: 20200316893
    Abstract: A pressing machine comprising a base, wherein a first inner edge side plate and a second outer edge side plate are arranged on the base; a clamping chamber with sealed inner and outer end surfaces is reserved between the outer wall of the first inner edge side plate and the inner wall of the of the second outer edge side plate; the interior of the clamping chamber is used for preparing sandwich panels; the first inner edge side plate comprises a first side plate assembly, a second side plate assembly, a third side plate assembly and a fourth side plate assembly, wherein the four groups of the side plate assemblies are arranged in parallel in pairs; each side plate assembly is formed by assembling a plurality of side plate units along the length direction of the corresponding side plate assembly.
    Type: Application
    Filed: July 7, 2017
    Publication date: October 8, 2020
    Inventors: Biao HE, Wei CHEN, ChaoFeng ZHANG, FengChao SHEN, TongFei JIANG, JiaJia ZHU, WeiLi WANG, HaiJun WANG
  • Patent number: 10553737
    Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.
    Type: Grant
    Filed: April 25, 2019
    Date of Patent: February 4, 2020
    Assignee: SUNMAN (HONG KONG) LIMITED
    Inventors: Zhengrong Shi, Guozhu Long, Jiaoyan Liu, Chengrong Lian, Weili Wang
  • Patent number: 10452929
    Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: October 22, 2019
    Assignees: Beijing University of Technology (CN), Guizhou Expressway Group Co., LTD (CN)
    Inventors: Jiangbi Hu, Wenqian Ma, Shilong Mei, Xiaoshun Lu, Jianping Cao, Weili Wang, Yuanfeng Zhang, Xiaoqin Zhang, Da Guo, Meng Wang, Xiaoyu Li, Linxi Gao, Xiaojuan Gao, Feng Liu
  • Patent number: 10418334
    Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.
    Type: Grant
    Filed: June 22, 2017
    Date of Patent: September 17, 2019
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Hang Zhang, Weili Wang, Junrong Yan, Kim Lee Bock, Chee Keong Chin, Chong Un Tan, Xin Tian
  • Publication number: 20190252563
    Abstract: A laminated structure, including: a first encapsulation layer, a second encapsulation layer, and a solar cell string between the first encapsulation layer and the second encapsulation layer. The first encapsulation layer includes 30-50 wt. % of fiber cloth and 50-70 wt. % of a first powder coating evenly disposed on the fiber cloth. The second encapsulation layer includes 30-50 wt. % of the fiber cloth and 50-70 wt. % of a second powder coating evenly disposed on the fiber cloth. The first powder coating includes an acrylic powder coating or a polyester powder coating. The second powder coating includes the polyester powder coating. The acrylic powder coating includes an acrylic resin and an acrylic resin curing agent. The polyester powder coating includes a polyester resin and a polyester resin curing agent.
    Type: Application
    Filed: April 25, 2019
    Publication date: August 15, 2019
    Inventors: Zhengrong SHI, Guozhu LONG, Jiaoyan LIU, Chengrong LIAN, Weili WANG
  • Patent number: 10354022
    Abstract: The present invention relates to a visual efficacy determining method for non-colored objects in different light environments, comprising: a) setting light environment; b) placing an object for performing visual recognition of a driver; c) resetting the light environment, and repeating the step b); d) processing visual recognition information data obtained after experiments, and establishing a correlating relationship between visual recognition time and color temperature, color rendering index and brightness parameters of the light environment; and e) performing visual efficiency analysis according to the visual recognition information data processing results. The present invention further provides a system for implementing the visual efficacy determining method for non-colored objects in different light environments, wherein the system comprises a simulated tunnel middle section subsystem, a testing subsystem and a data processing subsystem.
    Type: Grant
    Filed: October 15, 2015
    Date of Patent: July 16, 2019
    Assignees: BEIJING UNIVERSITY OF TECHNOLOGY (CN), GUIZHOU EXPRESSWAY GROUP CO., LTD (CN)
    Inventors: Jiangbi Hu, Xiaoqin Zhang, Yuanfeng Zhang, Xiaoyu Li, Guiping Guan, Weili Wang, Wenqian Ma, Da Guo, Meng Wang, Feng Liu, Xiaojuan Gao, Linxi Gao
  • Patent number: 10316335
    Abstract: Methods and compositions are provided involving high producing cell lines. Embodiments concern efficient methods for screening for such cell lines and for creating such cell lines. These cell lines can be used to create large amounts of protein. To quickly generate large quantity of recombinant proteins or vaccines for both pre-clinical study and clinical trials, almost all drug development will face the same challenging obstacle of rapidly generating a high stable producer. Developing and identifying a stable cell line is a critical part of biopharmaceutical development.
    Type: Grant
    Filed: March 14, 2014
    Date of Patent: June 11, 2019
    Assignee: MaxCyte, Inc.
    Inventors: Weili Wang, James P. Brady, Madhusudan V. Peshwa
  • Publication number: 20190097071
    Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth, and between 50 and 70 parts by weight of a polyester powder coating. The polyester powder coating includes a polyester resin and a curing agent. The polyester resin is a polymer of monomers selected from terephthalic acid, m-phthalic acid, neopentyl glycol, adipic acid, ethylene glycol, or a mixture thereof. The curing agent accounts for 2-20 wt. % of the polyester powder coating. The polyester powder coating is evenly distributed on the fiber cloth. A method of preparing the packaging material includes: evenly distributing the polyester powder coating on the fiber cloth using a coating device; and thermally bonding the polyester powder coating and the fiber cloth.
    Type: Application
    Filed: November 22, 2018
    Publication date: March 28, 2019
    Inventors: Tianhe DAI, Biao LUO, Zhicheng WANG, Guozhu LONG, Jiaoyan LIU, Chengrong LIAN, Weili WANG
  • Publication number: 20180374974
    Abstract: An encapsulant material for a photovoltaic module. The encapsulant material includes: between 30 and 50 parts by weight of fiber cloth and between 50 and 70 parts by weight of acrylic powder coating. The fiber cloth is made of fiber material. The acrylic powder coating includes an acrylic resin, a curing agent, and an additive. The acrylic powder coating is uniformly coated on the fiber cloth. A method of preparing the encapsulant material includes: uniformly coating the acrylic powder coating on the fiber cloth, thermally bonding the acrylic powder coating and the fiber cloth using pressure and heat, and piecewise cutting the thermally bonded acrylic powder coating and the fiber cloth.
    Type: Application
    Filed: August 22, 2018
    Publication date: December 27, 2018
    Inventors: Tianhe DAI, Biao LUO, Zhicheng WANG, Guozhu LONG, Jiaoyan LIU, Chengrong LIAN, Weili WANG
  • Publication number: 20180307918
    Abstract: The invention relates to an illumination standard calculation method for a tunnel entrance section in daytime based on safe visual recognition.
    Type: Application
    Filed: October 15, 2015
    Publication date: October 25, 2018
    Inventors: Jiangbi HU, Wenqian MA, Shilong MEI, Xiaoshun LU, Jianping CAO, Weili WANG, Yuanfeng ZHANG, Xiaoqin ZHANG, Da GUO, Meng WANG, Xiaoyu LI, Linxi GAO, Xiaojuan GAO, Feng LIU
  • Publication number: 20180284116
    Abstract: The present application provides a VEGFR1 antigen polypeptide containing three polypeptides, namely H-DEGVYHCKATNQKGSVESSAYLTVQGTSDKSNLE-OH, H-DLKLSCTVNKFLYRDVTWILLRTVNNRTMHYSI-OH and H-ESGLSDVSRP SFCHSSCGHVSEG KRRFTYDHAEL-OH, and an application of the antigen polypeptide to detection of a serum immunity marker, namely a VEGFR1 autoantibody. The present invention also provides a method for detecting the serum immunity marker-VEGFR1 autoantibody by using the VEGFR1 antigen polypeptide described in the present application and a test kit containing the VEGFR1 antigen polypeptide.
    Type: Application
    Filed: August 7, 2015
    Publication date: October 4, 2018
    Applicant: Qingdao Hailanshen Biotechnology Co., Ltd.
    Inventors: Jun Wei, Weili Wang
  • Publication number: 20180174983
    Abstract: A semiconductor die is disclosed including corner recesses to prevent cracking of the semiconductor die during fabrication. Prior to dicing the semiconductor die from the wafer, recesses may be formed in the wafer at corners between any pair of semiconductor die. The recesses may be formed by a laser or photolithographic processes in the kerf area between semiconductor die. Once formed, the corner recesses prevent cracking and damage to semiconductor die which could otherwise occur at the corners of adjacent semiconductor die as the adjacent semiconductor die move relative to each other during the backgrind process.
    Type: Application
    Filed: June 22, 2017
    Publication date: June 21, 2018
    Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
    Inventors: Hang Zhang, Weili Wang, Junrong Yan, Kim Lee Bock, Chee Keong Chin, Chong Un Tan, Xin Tian
  • Publication number: 20170337297
    Abstract: The present invention relates to a visual efficacy determining method for non-colored objects in different light environments, comprising: a) setting light environment; b) placing an object for performing visual recognition of a driver; c) resetting the light environment, and repeating the step b); d) processing visual recognition information data obtained after experiments, and establishing a correlating relationship between visual recognition time and color temperature, color rendering index and brightness parameters of the light environment; and e) performing visual efficiency analysis according to the visual recognition information data processing results. The present invention further provides a system for implementing the visual efficacy determining method for non-colored objects in different light environments, wherein the system comprises a simulated tunnel middle section subsystem, a testing subsystem and a data processing subsystem.
    Type: Application
    Filed: October 15, 2015
    Publication date: November 23, 2017
    Inventors: Jiangbi HU, Xiaoqin ZHANG, Yuanfeng ZHANG, Xiaoyu LI, Guiping GUAN, Weili WANG, Wenqian MA, Da GUO, Meng WANG, Feng LIU, Xiaojuan GAO, Linxi GAO
  • Patent number: 9773766
    Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: September 26, 2017
    Assignees: SanDisk Information Technology (Shanghai) Co., Ltd., SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Ning Ye, Chin-Tien Chiu, Suresh Upadhyayula, Peng Fu, Zhong Lu, Cheeman Yu, Yuang Zhang, Li Wang, Pradeep Kumar Rai, Weili Wang, Enyong Tai, King Hoo Ong, Kim Lee Bock
  • Publication number: 20170179101
    Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.
    Type: Application
    Filed: March 1, 2017
    Publication date: June 22, 2017
    Applicants: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD., SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
    Inventors: Junrong Yan, Peng Lu, Weili Wang, Li Wang, Pradeep Rai, Jeff Xue, Zhong Lu
  • Patent number: 9462694
    Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.
    Type: Grant
    Filed: December 5, 2014
    Date of Patent: October 4, 2016
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Junrong Yan, Weili Wang, Li Wang, Pradeep Rai, Xin Lu, Jianbin Gu, Peng Lu