Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Abstract: Methods and compositions are provided involving high producing cell lines. Embodiments concern efficient methods for screening for such cell lines and for creating such cell lines. These cell lines can be used to create large amounts of protein. To quickly generate large quantity of recombinant proteins or vaccines for both pre-clinical study and clinical trials, almost all drug development will face the same challenging obstacle of rapidly generating a high stable producer. Developing and identifying a stable cell line is a critical part of biopharmaceutical development.

Abstract: A semiconductor package including a plurality of stacked semiconductor die, and methods of forming the semiconductor package, are disclosed. In order to ease wirebonding requirements on the controller die, the controller die may be mounted directly to the substrate in a flip chip arrangement requiring no wire bonds or footprint outside of the controller die. Thereafter, a spacer layer may be affixed to the substrate around the controller die to provide a level surface on which to mount one or more flash memory die. The spacer layer may be provided in a variety of different configurations.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A spacer layer is also mounted to the substrate, with the semiconductor die fitting within an aperture or a notch formed through first and second major opposed surfaces of the spacer layer. Additional semiconductor die, such as flash memory die, may be mounted atop the spacer layer.

Abstract: A semiconductor device, and a method of its manufacture, are disclosed. The semiconductor device includes a semiconductor die, such as a controller die, mounted on a surface of a substrate. A bridge structure is also mounted to the substrate, with the semiconductor die fitting within a trench formed in a bottom surface of the bridge structure. The bridge structure may be formed from a semiconductor wafer into either a dummy bridge structure functioning as a mechanical spacer layer, or an IC bridge structure functioning as both a mechanical spacer layer and an integrated circuit semiconductor die. Memory die may also be mounted atop the bridge structure.

Abstract: A method, device and electronic terminal for unlocking are disclosed. The method is applicable in the electronic terminal. The electronic terminal comprises a touch display unit and receives a touch input operation of a user via the touch display unit. When the electronic terminal is in a user interface lock state, an operation that an operating body made on the touch display unit is detected; a response is made to the operation, a sliding track is formed on the touch display unit, and the time for forming the sliding track is recorded; the distance of the sliding track is calculated; the velocity for forming the sliding track is calculated on the basis of the distance and of the time; whether or not the velocity is greater than or equal to a predetermined velocity is determined; and, when the velocity is greater than or equal to the predetermined velocity, the user interface lock state is deactivated.

Abstract: The present invention features tablet dosage forms comprising two or more different active ingredients. In one embodiment, a tablet dosage form of the invention comprises a first layer and a second layer, wherein the first layer comprises polymer-based solid dispersion particles having a mean particle size of no more than 200 ?m.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: A calling method, device and system are disclosed. The calling method includes: obtaining, by a service platform, subscription information of a roaming prepaid subscriber, modifying and sending the modified subscription information to a visited mobile switching center (VMSC) of the roaming prepaid subscriber so that a call initiated by the roaming prepaid subscriber could be triggered to the service platform by the VMSC; receiving, by the service platform, the call to a called subscriber initiated by the roaming prepaid subscriber and triggered by the VMSC; and instructing, by the service platform, the VMSC to release the call and instructing a call connection device to connect the roaming prepaid subscriber to the called subscriber after determining from the call that the roaming prepaid subscriber has activated a callback service. User operation is simplified and user's experience is improved with the method, device and system in accordance with the embodiments of the invention.

Abstract: Compounds of formula (I) wherein A, R1, R2, and R3 are defined in the specification, and which are useful as therapeutic compounds particularly for treating disorders or conditions associated with inflammation, pain, bladder overactivity, urinary incontinence, and other disorders caused by or exacerbated by TRPV1.

Abstract: Compounds of formula (I) wherein A, R1, R2, and R3 are defined in the specification, and which are useful as therapeutic compounds particularly for treating disorders or conditions associated with inflammation, pain, bladder overactivity, urinary incontinence, and other disorders caused by or exacerbated by TRPV1.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: A system is disclosed for ejecting a semiconductor die from a tape to which the die is affixed during the wafer dicing process. In embodiments, the system includes an ejector tool including a support table, ejector pins and a pick-up arm. The support table is connected to a vacuum source for creating a negative pressure at an interface between the tape and support table. The support table further includes an aperture with one or more chamfered sidewalls. The vacuum source is connected to the aperture so that, upon placement of the tape on the support table with a die centered over the aperture, the vacuum source pulls a portion of the tape around the edges of the semiconductor die away from the die and into the space created by the chamfered edges.

Abstract: A calling method, device and system are disclosed. The calling method includes: obtaining, by a service platform, subscription information of a roaming prepaid subscriber, modifying and sending the modified subscription information to a visited mobile switching centre (VMSC) of the roaming prepaid subscriber so that a call initiated by the roaming prepaid subscriber could be triggered to the service platform by the VMSC; receiving, by the service platform, the call to a called subscriber initiated by the roaming prepaid subscriber and triggered by the VMSC; and instructing, by the service platform, the VMSC to release the call and instructing a call connection device to connect the roaming prepaid subscriber to the called subscriber after determining from the call that the roaming prepaid subscriber has activated a callback service. User operation is simplified and user's experience is improved with the method, device and system in accordance with the embodiments of the invention.

Abstract: A ventilation seat and back cushion for an automobile seat, comprising an integrated seat and back cushion, a main air conduit, an axial flow fan at one end of the main air conduit, and multiple branch air conduits inside the seat cushion and back cushion, all being connected to the main air conduit.

Abstract: The present invention discloses (1S,5S)-3-(5,6-dichloro-3-pyridinyl)-3,6-diazabicyclo[3.2.0]heptane, salts thereof, and its use to treat pain and other disorders associated with the nicotinic acetylcholine receptor.

Abstract: A microwave filter and method for remotely tuning a microwave filter from one sub-band to another sub-band using metallic rings to adjust the capacitance or inductance of the resonator. In adjusting the capacitance, a plurality of metallic rings are disposed in the upper section or end of the resonator. Each ring has an RF switch that connects or disconnects each ring to ground, thereby varying the capacitance of the resonator. In adjusting the inductance, a plurality of metallic rings are disposed perpendicular to the magnetic field of the resonator. Each ring has an RF switch disposed within the electrical path of the ring that opens or closes the electrical path of each ring. By opening and closing each ring, the magnetic field of the resonator is altered, thereby varying the inductance of the resonator.

Abstract: Compounds of formula (I) wherein A, R1, R2, and R3 are defined in the specification, and which are useful as therapeutic compounds particularly for treating disorders or conditions associated with inflammation, pain, bladder overactivity, urinary incontinence, and other disorders caused by or exacerbated by TRPV1.