Patents by Inventor Weimin Shi

Weimin Shi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240186206
    Abstract: Systems, apparatuses and methods may provide for technology that includes a voltage regulator, a board assembly including a die and a circuit board electrically coupled to a first side of the die, and a thermal dissipation assembly thermally and electrically coupled to a second side of the die, wherein the thermal dissipation assembly is further electrically coupled to the voltage regulator. In one example, the thermal dissipation assembly includes a vapor chamber and the technology further includes a plurality of copper plates electrically coupled to the voltage regulator and a package substrate containing the die, wherein the plurality of copper plates are further thermally coupled to the vapor chamber.
    Type: Application
    Filed: February 10, 2024
    Publication date: June 6, 2024
    Inventors: Satish PRATHABAN, Ramaswamy PARTHASARATHY, Biswajit PATRA, Tongyan ZHAI, Jeff KU, Min Suet LIM, Yi HUANG, Kai XIAO, Gene F. YOUNG, Weimin SHI
  • Patent number: 11975376
    Abstract: The embodiment of the present disclosure provides fluid bulging equipment for thin plate parts, which includes a main mechanism, a left mold opening mechanism and a right mold opening mechanism located on both sides of the main mechanism, a left mobile working platform, and a right mobile working platform. The main mechanism includes a main frame and a main oil cylinder located under the main frame. The main oil cylinder is connected to a master cylinder mold-locked booster cylinder through an oil circuit block. A hydraulic control system is arranged above the main mechanism. An ultra-high pressure generating device is arranged in the hydraulic control system. The ultra-high pressure generating device is connected to the master cylinder mold-locked booster cylinder through a pipeline. The hydraulic control system is also connected to the left mold opening mechanism and the right mold opening mechanism.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: May 7, 2024
    Assignee: FRD SCIENCE & TECHNOLOGY (JIANGSU) CO., LTD.
    Inventors: Hongming Pan, Heng Xiao, Weimin Shi
  • Publication number: 20240040657
    Abstract: A novel method for service based network resource allocation is disclosed. In one embodiment, a method is disclosed comprising receiving from a UE at a base station over a Primary Cell (PCell), a request message to perform an action with respect to a Secondary Cell (SCell), the request message including service information. The method then determines a specific action to be performed with respect to the SCell based on the service information. Finally, the method performs the specific action with respect to the SCell at the base station and transmits a connection reconfiguration message to the UE to direct the UE to perform the specific action based on a service to be supported.
    Type: Application
    Filed: July 26, 2022
    Publication date: February 1, 2024
    Applicant: VERIZON PATENT AND LICENSING INC.
    Inventors: Jun YUAN, Hongkun LI, Weimin SHI, Anil Babu VONTIKOMMU
  • Patent number: 11812306
    Abstract: An improved cellular network communications scheme enables synchronization of end-to-end session parameters between a radio access network and user equipment. In one embodiment, a method is disclosed comprising receiving, at an access point, a first notification from user equipment (UE), the first notification including data representing a capability of the UE; receiving, at the access point, a second notification from the UE, the second notification including data representing a negotiated session parameter; detecting, by the access point, a change in quality of a network link associated with the UE; and disabling, by the access point, a transmission of a recommendation to the UE based on the negotiated session parameter.
    Type: Grant
    Filed: April 2, 2021
    Date of Patent: November 7, 2023
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Weimin Shi, Jun Yuan, Hui Zhao, Nanjun Qian
  • Publication number: 20230294154
    Abstract: The embodiment of the present disclosure provides fluid bulging equipment for thin plate parts, which includes a main mechanism, a left mold opening mechanism and a right mold opening mechanism located on both sides of the main mechanism, a left mobile working platform, and a right mobile working platform. The main mechanism includes a main frame and a main oil cylinder located under the main frame. The main oil cylinder is connected to a master cylinder mold-locked booster cylinder through an oil circuit block. A hydraulic control system is arranged above the main mechanism. An ultra-high pressure generating device is arranged in the hydraulic control system. The ultra-high pressure generating device is connected to the master cylinder mold-locked booster cylinder through a pipeline. The hydraulic control system is also connected to the left mold opening mechanism and the right mold opening mechanism.
    Type: Application
    Filed: May 23, 2023
    Publication date: September 21, 2023
    Applicant: FRD SCIENCE & TECHNOLOGY (JIANGSU) CO., LTD.
    Inventors: Hongming PAN, Heng XIAO, Weimin SHI
  • Publication number: 20230252043
    Abstract: A method, terminal, and system for transmitting a file between multiple terminals is described. The method includes obtaining a picture, which is photographed by a file receiving end from a file sending end from a file sending end and includes a to-be-transmitted file, and performing image recognition on the obtained picture to determine the to-be-transmitted file of the file sending end, the picture of the to-be-transmitted file being displayed on a display interface of the file sending end. The method further includes determining a file path of the to-be-transmitted file according to the determined to-be-transmitted file, obtaining the to-be-transmitted file according to the file path of the to-be-transmitted file, and transmitting the to-be-transmitted file to the file receiving end.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 10, 2023
    Applicant: TENCENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED
    Inventors: Yuan NIU, Xiaoye WANG, Weimin SHI, Guodong CHEN, Min ZHANG, Fang YU, Pei LIU, Baike LIN, Zhikai LIU, Yuanzhi TU
  • Patent number: 11621981
    Abstract: An originating user equipment may generate a request to utilize a service that links over-the-top content with a voice call, and may provide the request to an entitlement server of a core network associated with the originating user equipment. The originating user equipment may receive, from the entitlement server, information verifying entitlement of the originating user equipment for the service. The information may include a tag identifying the service. The originating user equipment may provide an invite message, with the tag, to a terminating user equipment and may establish the voice call with the terminating user equipment based on providing the invite message and via an Internet protocol multimedia subsystem (IMS) network and the core network. The originating user equipment may establish, concurrently with the voice call, a connection for the over-the-top content with the terminating user equipment via a data network and the core network.
    Type: Grant
    Filed: January 28, 2021
    Date of Patent: April 4, 2023
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Jun Yuan, Hesham Elbatouti, Weimin Shi
  • Publication number: 20220322151
    Abstract: An improved cellular network communications scheme enables synchronization of end-to-end session parameters between a radio access network and user equipment. In one embodiment, a method is disclosed comprising receiving, at an access point, a first notification from user equipment (UE), the first notification including data representing a capability of the UE; receiving, at the access point, a second notification from the UE, the second notification including data representing a negotiated session parameter; detecting, by the access point, a change in quality of a network link associated with the UE; and disabling, by the access point, a transmission of a recommendation to the UE based on the negotiated session parameter.
    Type: Application
    Filed: April 2, 2021
    Publication date: October 6, 2022
    Inventors: Weimin SHI, Jun YUAN, Hui ZHAO, Nanjun QIAN
  • Publication number: 20220239704
    Abstract: An originating user equipment may generate a request to utilize a service that links over-the-top content with a voice call, and may provide the request to an entitlement server of a core network associated with the originating user equipment. The originating user equipment may receive, from the entitlement server, information verifying entitlement of the originating user equipment for the service. The information may include a tag identifying the service. The originating user equipment may provide an invite message, with the tag, to a terminating user equipment and may establish the voice call with the terminating user equipment based on providing the invite message and via an Internet protocol multimedia subsystem (IMS) network and the core network. The originating user equipment may establish, concurrently with the voice call, a connection for the over-the-top content with the terminating user equipment via a data network and the core network.
    Type: Application
    Filed: January 28, 2021
    Publication date: July 28, 2022
    Applicant: Verizon Patent and Licensing Inc.
    Inventors: Jun YUAN, Hesham ELBATOUTI, Weimin SHI
  • Publication number: 20220139843
    Abstract: An integrated circuit assembly may be formed having at least one integrated circuit device electrically attached to an electronic substrate. The integrated circuit assembly may further include at least one electromagnetic interference structure attached to the electronic substrate adjacent to the at least one integrated circuit device. The at least one electromagnetic interference structure may be electrically attached to the electronic substrate with at least one resilient connector extending therebetween. In one embodiment, the at least one electromagnetic interference structure may be grounded to the electronic substrate.
    Type: Application
    Filed: April 10, 2019
    Publication date: May 5, 2022
    Applicant: INTEL CORPORATION
    Inventors: Jun LU, Wei LIAO, Chen ZHANG, Guangying ZHANG, Liguang DU, Chuansheng LIU, Michael LEDDIGE, Weimin SHI, Eduardo MICHEL, Guillermo RENTERIA ZAMUDIO
  • Patent number: 11038293
    Abstract: Apparatuses and systems associated with power provision for packages mounted to a printed circuit board are disclosed herein. In embodiments, a socket arrangement may include a header and a first bus bar, wherein the first bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source, wherein a power output of the power source is electrically coupled to the power supply connection. The socket arrangement may further include a second bus bar, wherein the second bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a ground contact of the component package and a ground connection within the proximity of the power source. Other embodiments may be described and/or claimed.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: June 15, 2021
    Assignee: Intel Corporation
    Inventors: Brian D. Aspnes, Jeffory L. Smalley, Weimin Shi
  • Publication number: 20190044264
    Abstract: Apparatuses and systems associated with power provision for packages mounted to a printed circuit board are disclosed herein. In embodiments, a socket arrangement may include a header and a first bus bar, wherein the first bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a power supply contact of a component package and to a power supply connection within a proximity of a power source, wherein a power output of the power source is electrically coupled to the power supply connection. The socket arrangement may further include a second bus bar, wherein the second bus bar is to extend from the header adjacent to the PCB, and is to electrically couple to a ground contact of the component package and a ground connection within the proximity of the power source. Other embodiments may be described and/or claimed.
    Type: Application
    Filed: January 12, 2018
    Publication date: February 7, 2019
    Inventors: BRIAN D. ASPNES, JEFFORY L. SMALLEY, WEIMIN SHI
  • Publication number: 20150254301
    Abstract: A method, terminal, and system for transmitting a file between multiple terminals is described. The method includes obtaining a picture, which is photographed by a file receiving end from a file sending end from a file sending end and includes a to-be-transmitted file, and performing image recognition on the obtained picture to determine the to-be-transmitted file of the file sending end, the picture of the to-be-transmitted file being displayed on a display interface of the file sending end. The method further includes determining a file path of the to-be-transmitted file according to the determined to-be-transmitted file, obtaining the to-be-transmitted file according to the file path of the to-be-transmitted file, and transmitting the to-be-transmitted file to the file receiving end.
    Type: Application
    Filed: May 27, 2015
    Publication date: September 10, 2015
    Inventors: Yuan NIU, Xiaoye WANG, Weimin SHI, Guodong CHEN, Min ZHANG, Fang YU, Pei LIU, Baike LIN, Zhikai LIU, Yuanzhi TU
  • Patent number: 7436277
    Abstract: A multi-phase transformer is provided that includes a first layer having at least a first planar wire and a second planar wire and a second layer formed on the first layer and having at least a third planar wire and a fourth planar wires. At least the first planar wire and the second planar wire of the first layer to form two transformers with at least two planar wires of the second layer. The multi-phase transformer may also include a coupling device to couple one end of the planar wires of the first layer with one of the planar wires of the second layer.
    Type: Grant
    Filed: June 1, 2005
    Date of Patent: October 14, 2008
    Assignee: Intel Corporation
    Inventors: Peter Hazucha, Gerhard Schrom, Weimin Shi, Edward Burton, Trang Nguyen, Mary Bloechel, legal representative, Tanay Karnik, Bradley Bloechel
  • Patent number: 7324317
    Abstract: Reduce breakdown voltage and control breakdown path for electrostatic discharge to terminals of microelectronic packages, such as no-connect Land Grid Array (LGA) pads. In one embodiment, solder resist openings with a small separation distance are used to provide an air breakdown path between a no-connect LGA pad and the surrounding metal and to reduce the breakdown voltage. In one implementation, the no-connect pad has a non-round shape with a protruding portion on the dielectric layer. The air surrounding a solder resist opening over the tip of the protruding portion of the no-connect pad and a nearby solder resist opening over the surrounding metal provides a shortest air breakdown path and the lowest breakdown voltage. Alternatively, sharp features (e.g., metal traces) with a minimum separation distance can be arranged pointing at each other under the solder resist layer, or other dielectric layer inside the package, to provide a non-exposed breakdown path.
    Type: Grant
    Filed: August 31, 2004
    Date of Patent: January 29, 2008
    Assignee: Intel Corporation
    Inventors: Michael J. Hill, Weimin Shi
  • Patent number: 7212347
    Abstract: This invention discloses a reflective illumination system for supplying an optical radiation beam along a folded path for illuminating a planar object. The system includes a radiation source, and two facing parabolic dish-shaped arrays of parabolic or dished reflectors. Divergent light received from the light source incident on a first of the arrays is reflected as a larger collimated beam comprising plural separated sub-beams. Each of the reflectors or facets from the first array directs one of the sub-beams to a facet on the second array. The second array reflects the light it receives with a substantially uniform intensity onto a rectangular target location.
    Type: Grant
    Filed: December 7, 2004
    Date of Patent: May 1, 2007
    Assignee: JDS Uniphase Corporation
    Inventors: Clark Pentico, Unsig Min, Weimin Shi
  • Publication number: 20060273872
    Abstract: A multi-phase transformer is provided that includes a first layer having at least a first planar wire and a second planar wire and a second layer formed on the first layer and having at least a third planar wire and a fourth planar wires. At least the first planar wire and the second planar wire of the first layer to form two transformers with at least two planar wires of the second layer. The multi-phase transformer may also include a coupling device to couple one end of the planar wires of the first layer with one of the planar wires of the second layer.
    Type: Application
    Filed: June 1, 2005
    Publication date: December 7, 2006
    Inventors: Peter Hazucha, Gerhard Schrom, Weimin Shi, Edward Burton, Trang Nguyen, Bradley Bloechel, Mary Bloechel, Tanay Karnik
  • Publication number: 20060044717
    Abstract: Reduce breakdown voltage and control breakdown path for electrostatic discharge to terminals of microelectronic packages, such as no-connect Land Grid Array (LGA) pads. In one embodiment, solder resist openings with a small separation distance are used to provide an air breakdown path between a no-connect LGA pad and the surrounding metal and to reduce the breakdown voltage. In one implementation, the no-connect pad has a non-round shape with a protruding portion on the dielectric layer. The air surrounding a solder resist opening over the tip of the protruding portion of the no-connect pad and a nearby solder resist opening over the surrounding metal provides a shortest air breakdown path and the lowest breakdown voltage. Alternatively, sharp features (e.g., metal traces) with a minimum separation distance can be arranged pointing at each other under the solder resist layer, or other dielectric layer inside the package, to provide a non-exposed breakdown path.
    Type: Application
    Filed: August 31, 2004
    Publication date: March 2, 2006
    Inventors: Michael Hill, Weimin Shi
  • Publication number: 20050122575
    Abstract: This invention discloses a reflective illumination system for supplying an optical radiation beam along a folded path for illuminating a planar object. The system includes a radiation source, and two facing parabolic dish-shaped arrays of parabolic or dished reflectors. Divergent light received from the light source incident on a first of the arrays is reflected as a larger collimated beam comprising plural separated sub-beams. Each of the reflectors or facets from the first array directs one of the sub-beams to a facet on the second array. The second array reflects the light it receives with a substantially uniform intensity onto a rectangular target location.
    Type: Application
    Filed: December 7, 2004
    Publication date: June 9, 2005
    Applicant: JDS UNIPHASE CORPORATION
    Inventors: Clark Pentico, Unsig Min, Weimin Shi
  • Patent number: 6862184
    Abstract: An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.
    Type: Grant
    Filed: June 27, 2002
    Date of Patent: March 1, 2005
    Assignee: Intel Corporation
    Inventors: Weimin Shi, Zane A. Ball