Abstract: This invention discloses a reflective illumination system for supplying an optical radiation beam along a folded path for illuminating a planar object. The system includes a radiation source, and two facing parabolic dish-shaped arrays of parabolic or dished reflectors. Divergent light received from the light source incident on a first of the arrays is reflected as a larger collimated beam comprising plural separated sub-beams. Each of the reflectors or facets from the first array directs one of the sub-beams to a facet on the second array. The second array reflects the light it receives with a substantially uniform intensity onto a rectangular target location.

Abstract: An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.

Abstract: An electronic assembly is disclosed which includes a printed circuit board. A computer processor package is centrally positioned on an upper surface of the printed circuit board. A computer processor is positioned on an upper surface of the computer processor package. A first plurality of power delivery components is positioned on an upper surface of the printed circuit board on one side of the computer processor package. One or more additional pluralities of power delivery components may be positioned on the upper surface of the printed circuit board on other sides of the computer processor package. A high frequency current may be routed from one or more of the first and/or additional pluralities of power delivery components over an elongate flex circuit to the computer processor. A series of decoupling capacitors may be coupled to the elongate flex circuit to enhance a transfer of high frequency current over the elongate flex circuit.

Abstract: The present invention features an ultra high density, high frequency, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the package before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.

Abstract: The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.

Abstract: An interposer for a land grid array includes a dielectric grid having an array of holes and a resilient, conductive button disposed in one or more of the holes. The button includes an insulating core, a conducting element wound around the insulating core, and an outer shell surrounding the conducting element. The characteristics of the conducting element and the buttons may be chosen such that the contact force and resistance, and compressibility or relaxability of the conductive buttons can be selected within wide limits. Contact areas between the shell and the conducting element urge a substantially corresponding displacement in both the conducting element and the shell when the button is under compression or relaxation. The interposer alternatively can include an insulating sheet and rather than conductive buttons contain conducting elements disposed therein having contact areas with the block.

Abstract: There is a memory module for use in conjunction with high speed, impedance-controlled buses. Each memory card may be a conventional printed circuit card with memory chips attached directly to the card. Alternately, high density memory modules assembled from pluggable sub-modules may be used. These sub-modules may be temporarily assembled for testing and/or burn-in. Bus terminations mounted directly on the memory card or the memory module eliminate the need for bus exit connections, allowing the freed up connection capacity to be used to address additional memory capacity on the module. An innovative pin-in-hole contact system is used both to connect sub-modules to the memory module and, optionally, to connect the memory module to a mother board or similar structure. A thermal control structure may be placed in the memory module to cool the increased number of memory chips to prevent excess heat build-up and ensure reliable memory operation.

Abstract: A method and apparatus are provided for generating x-ray photon radiation. A liquid cone anode and an extraction electrode spaced therefrom are disposed in a vacuum chamber. The liquid cone anode comprises a liquid material, a reservoir for holding the liquid material having an opening for passage of the liquid material, and a liquid material feeding and cone forming mechanism operatively associated with the reservoir for feeding liquid material through the opening in the reservoir and for forming a liquid cone from the liquid material A power supply is connected to the liquid cone anode and the extraction electrode for creating an electric field therebetween of sufficient strength to cause particles to be extracted from the liquid cone anode to form a plasma ball in the space between the liquid cone anode and the extraction electrode which emits x-ray photon radiation.

Abstract: A device for the measurement of the blood pressure of a patient includes an arrangement for transmitting a light through an optical fiber; an arrangement for receiving and measuring a reflected light through an optical fiber; and a cylindrically shaped pressure sensor having a side window and a plate having two sections which moves in accordance with the applied blood pressure thereby causing the reflection and detection of different amounts of light based on the applied blood pressure at the window.