Abstract: An actuator for controlling an air damper includes a motor, an output connector for connecting the actuator to the air damper, a transmission mechanism connecting the motor to the output connector, and an energy storage device that drives the output connector to close the air damper when power to the motor is cut off. The motor has a stator and a rotor. The stator has a stator core including a yoke and nine poles extending from the yoke. The rotor has a shaft and an annular permanent magnet. The magnet forms twelve poles with alternate N and S polarities. An inclination angle of boundaries between adjacent poles of the magnet relative to an axis of the motor is in the range of 13 to 17 degrees.

Abstract: An exposure-suppressing imaging system has a first optical assembly forming a first image of an object on a focal plane thereof, a beam splitter positioned between the first optical assembly and the focal plane of the first optical assembly; an LCOS reflective light modulator positioned on the focal plane, and selectively and partially altering the reflectivity thereof to reflect the first image back to the beam splitter; a second optical assembly positioned on a side of the beam splitter and receiving the reflected first image to form a second image on a focal plane of the second optical assembly; a light sensor converting the second image into a signal; and a controller receiving the signal computed as a third image, and selectively controlling the reflectivity of the LCOS reflective light modulator according to whether the signal contains information of overexposure on the third image.

Abstract: An exemplary lead frame includes a substrate and a bonding electrode, a first connecting electrode, and a second connecting electrode embedded in the substrate. A top surface of the bonding electrode includes a first bonding surface and a second bonding surface spaced from the first bonding surface. A top surface of the first connecting electrode includes a first connecting surface and a second connecting surface spaced from the first connecting surface. Top surfaces of the bonding electrode, the first connecting electrode and the second connecting electrode are exposed out of the substrate to support and electrically connect with light emitting chips. Light emitting chips can be mounted on the lead frame and electrically connect with each other in parallel or in series; thus, the light emitting chips can be connected with each in a versatile way.

Abstract: A patterning method is provided. First, a material layer is formed over a substrate. Thereafter, a plurality of directed self-assembly (DSA) patterns are formed on the material layer. Afterwards, a patterned photoresist layer is formed by using a single lithography process. The patterned photoresist layer covers a first portion of the DSA patterns and exposes a second portion of the DSA patterns. Further, the material layer is patterned by an etching process, using the patterned photoresist layer and the second portion of the DSA patterns as a mask.

Abstract: A semiconductor structure includes a gate structure disposed on a substrate and having an outer spacer, a recess disposed in the substrate and adjacent to the gate structure, a doped epitaxial material filling up the recess, a cap layer including an undoped epitaxial material and disposed on the doped epitaxial material, a lightly doped drain disposed below the cap layer and sandwiched between the doped epitaxial material and the cap layer, and a silicide disposed on the cap layer and covering the doped epitaxial material to cover the cap layer together with the outer spacer without directly contacting the lightly doped drain.

Abstract: A method of manufacturing the glass substrate is provided. First, a glass substrate having a target surface is provided. Next, an abrasive blasting process for the target surface is performed. After the abrasive blasting process, an etching process for the target surface is performed. The present invention further provides a glass substrate having a target surface. The target surface has an average etching depth between 1 ?m and 100 ?m, a roughness (Ra) between 0.05 ?m and 1.5 ?m, and a friction below 0.4.

Abstract: A pharmaceutical composition for treating diabetes is provided in this invention. The composition contains a lanostane compound as a potent component. A suitable source of the lanostane compound is a Poria extract from metabolite, sclerotium, or fermentation product of Poria cocos (Schw) Wolf. The Poria extract contains 1-60% of the lanostane compounds by weight of the extract, and is devoid of secolanostane.

Abstract: A multifunction socket device is connected to a main AC power and comprises a frame unit, at least one power outlet, a cover unit and a first illuminating unit. The multifunction socket device can provide power source and illumination device, which bring more convenience and options to modern lifestyle.

Abstract: A method for packaging an light emitting diode, includes: arranging one or more light emitting diode dies on a film; encapsulating the one or more light emitting diode dies on the film; removing the film from the one or more encapsulated light emitting diode dies to expose a surface of the one or more encapsulated light emitting diode dies; forming an isolating layer on the exposed surface encapsulation surface portion of the one or more encapsulated light emitting diode dies so as to define a plurality of recesses; and forming a plurality of leads in the plurality of recesses of the one or more encapsulated light emitting diode dies, with each one of the plurality of leads being connected to one of the un-encapsulated electrodes of the one or more light emitting diode dies.

Abstract: A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of Poria cocas (Schw) Wolf. The extract contains 5-60% of the lanostane compounds by weight of the extract. The extract is devoid of secolanostane capable of inhibiting immunity development.

Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die and the coating layer. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of each of the connecting pins is smaller than that of the conductive sheet. A top surface of each of the connecting pins is lower than that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract: A light emitting diode package (LED) includes two electrodes spaced from each other, an insulating layer sandwiched between the two electrodes, an LED die arranged on the two electrodes and electrically connecting therewith, and an encapsulation layer covering the LED die. Each electrode includes a conductive sheet and a plurality of connecting pins connecting to the conductive sheet. A thickness of the connecting pin is smaller than that of the conductive sheet. A top surface of the connecting pin is coplanar with that of the conductive sheet. The LED package further includes a coating layer coating the connecting pin, part of the coating pin is sandwiched between the top surface of the connecting pin and the encapsulation layer.

Abstract: An exposure-suppressing imaging system has a first optical assembly forming a first image of an object on a focal plane thereof, a beam splitter positioned between the first optical assembly and the focal plane of the first optical assembly; an LCOS reflective light modulator positioned on the focal plane, and selectively and partially altering the reflectivity thereof to reflect the first image back to the beam splitter; a second optical assembly positioned on a side of the beam splitter and receiving the reflected first image to form a second image on a focal plane of the second optical assembly; a light sensor converting the second image into a signal; and a controller receiving the signal computed as a third image, and selectively controlling the reflectivity of the LCOS reflective light modulator according to whether the signal contains information of overexposure on the third image.

Abstract: A curable composition comprises the following: (A) a polymer having at least two silicon-bonded alkenyl groups and having an average unit formula (I?): (R12SiO2/2)a1(R23SiO1/2)b1(CH2CH2)e1; (B) a branched organopolysiloxane having at least one silicon-bonded alkenyl group and having a siloxane unit of formula R4SiO3/2; (C) an organopolysiloxane having an average unit formula (II) being capped with H: (R52SiO2/2)f(R63SiO1/2)g(R7SiO3/2)h(SiO4/2)i(CH2CH2)j; and (D) a catalyst, wherein R1, R2 and R4 to R7 and a1, b1, e1 and f to j are as defined in the specification.

Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.

Abstract: A photomask including first opaque patterns and second opaque patterns is provided. The first opaque patterns are distributed in a first plane defined in the photomask, while the second opaque patterns are disposed above the first opaque patterns and spaced apart from the first opaque patterns. In other words, the first opaque pattern and second opaque pattern are not distributed in the same plane.

Abstract: A block for electrical bonding and grounding made by punching and bending a metal sheet is provided. The block for electrical bonding and grounding has a fixing section formed on its bottom end and a connecting section formed uprightly on one side of the fixing section. The fixing section has a ground portion formed thereon by bending a cut portion into a U-shape portion, and the ground portion has a ground wire passage for passing through of a ground wire. The ground wire passage has a shrunk neck portion provided for limiting the ground wire. A threaded hole is provided correspondingly such that a fastening screw can be threaded through the threaded hole to clamp the ground wire securely in position. The overall manufacturing process is easier, more convenient and quicker so that the overall cost is lowered.

Abstract: A bicycle pedal with a locking function has a base and a securing member. The base is positioned on a side of the bicycle and has a U-shaped main body and a through hole disposed on the main body. The securing member has a securing rod with an end attached to the bicycle and disposed through the through hole, and a stopping portion disposed at another end of the securing rod. wherein the main body is capable of sliding along the securing rod between a locking position and a non-locking position, and when the main body is at the locking position, the main body moves to one end of the securing rod and pushes against the stopping portion to prevent wheels from rotating, and when the main body is at the non-locking position, the main body moves to another end of the securing rod to release the wheels.

Abstract: A method for packaging an LED includes steps: providing a substrate with a circuit structure formed thereon, stacking the substrate on a supporting board, and arranging a plurality of LED dies on the substrate; providing a mold and a gelatinous-state fluorescent film, positioning the supporting board in the mold and covering the mold with the gelatinous-state fluorescent film to cooperatively define a receiving space among the fluorescent film, the mold and the supporting board, the substrate and the LED dies being received in the receiving space; exhausting air in the receiving space to attach the gelatinous-state fluorescent film on the LED dies; solidifying the gelatinous-state fluorescent film and removing the mold; forming an encapsulation on the substrate to cover the LED dies; cutting the substrate and removing the supporting board to obtain several individual LED packages.

Abstract: The present invention relates to photo processing. Disclosed is a method for processing photos from multiple sources and its apparatus. In the present invention, the method of processing photos from multiple sources include: obtaining photo files from at least two sources; for the obtained photo files, merging the photo files originating from the same primitive photo into one photo object for post-processing in the unit of photo objects, each photo object contains pointer(s) to the photo file(s) corresponding with the photo object. In the present invention, while substantial contents of photo files from different sources are identical, the photo files are merged into one photo object, then users can operate in the unit of photo objects, a system automatically processes respective files of the photo objects according to different operation types, and users do not need to care about the detail of the level of the photo files, such as the sources of the photo files etc., which simplifies the user operations.