Patents by Inventor Wen-An Liang

Wen-An Liang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OVERLAY MARK AND MEASUREMENT METHOD THEREOF
    Publication number: 20140132283
    Abstract: An overlay mark including at least one first overlay mark and at least one second overlay mark is provided. The first overlay mark includes a plurality of first bars and a plurality of first spaces arranged alternately, and the first spaces are not constant. The second overlay mark includes a plurality of second bars and a plurality of second spaces arranged alternately, and the second spaces are constant. Besides, the second overlay mark partially overlaps with the first overlay mark.
    Type: Application
    Filed: November 12, 2012
    Publication date: May 15, 2014
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Kuo-Chun Huang, Chien-Hao Chen, Wen-Liang Huang
  • SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20140127892
    Abstract: A method of manufacturing a semiconductor device having metal gate includes providing a substrate having a first transistor and a second transistor formed thereon, the first transistor having a first gate trench formed therein, forming a first work function metal layer in the first gate trench, forming a sacrificial masking layer in the first gate trench, removing a portion of the sacrificial masking layer to expose a portion of the first work function metal layer, removing the exposed first function metal layer to form a U-shaped work function metal layer in the first gate trench, and removing the sacrificial masking layer. The first transistor includes a first conductivity type and the second transistor includes a second conductivity type. The first conductivity type and the second conductivity type are complementary.
    Type: Application
    Filed: December 19, 2013
    Publication date: May 8, 2014
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Jui Liao, Tsung-Lung Tsai, Chien-Ting Lin, Shao-Hua Hsu, Yeng-Peng Wang, Chun-Hsien Lin, Chan-Lon Yang, Guang-Yaw Hwang, Shin-Chi Chen, Hung-Ling Shih, Jiunn-Hsiung Liao, Chia-Wen Liang
  • LIGHT EMITTING DIODE BULB
    Publication number: 20140119008
    Abstract: A light emitting diode (LED) bulb includes a connecting body, a mounting base located on the connecting body and a plurality of LED modules mounted on the mounting base. The mounting base has a top face spaced from the connecting body and at least three surrounding walls. The top face of the mounting base orients toward a direction different that of each of the at least three surrounding walls. A lamp cover is secured to the connecting body and encloses the LED modules. An extension of the top face of the mounting base interests with the lamp cover at a point. A tangent line of the lamp cover through the point and the extension of the top face form an included angle which is less than 60 degrees. Furthermore, a center of the lamp cover is located above the top face.
    Type: Application
    Filed: August 30, 2013
    Publication date: May 1, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: LUNG-HSIN CHEN, WEN-LIANG TSENG
  • LIGHT EMITTING DIODE BULB
    Publication number: 20140119009
    Abstract: A light emitting diode (LED) bulb includes a connecting body, a lamp cap located at a first end of the connecting body, a mounting base located at a second end of the connecting body opposite to the first end, a plurality of LED modules mounted on the mounting base and a sheath assembled to the second end of the connecting body. The sheath includes a first portion and a second portion detachably engaged with the first portion to cooperatively define an enclosed space enclosing the mounting base and the LED modules therein.
    Type: Application
    Filed: August 30, 2013
    Publication date: May 1, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: LUNG-HSIN CHEN, WEN-LIANG TSENG
  • METHOD AND SYSTEM FOR DETECTING WEBSITE VISIT ATTEMPTS BY BROWSERS
    Publication number: 20140115700
    Abstract: A method and system of detecting website visit attempts by browsers includes monitoring networking operations generated by a client and intercepting a network address associated with the networking operations, detecting a type of website from the intercepted network address, and determining that a browser on the client has attempted to visit a website of the detected type based on the browser being in a running state and a website identified as historically visited by the browser matching the detected type of website. This can allow for the accurate detection of a browser's attempt to visit a restricted website, thereby accomplishing accurate monitoring of networking activities of the browser and enhancing the accuracy of subsequent prompting or intercepting of the networking activities of the browser.
    Type: Application
    Filed: December 27, 2013
    Publication date: April 24, 2014
    Applicant: Tencent Technology (Shenzhen) Company Limited
    Inventors: Wen Liang Tang, Xiao Dong Ou
  • Semiconductor device having metal gate and manufacturing method thereof
    Patent number: 8704294
    Abstract: A method of manufacturing a semiconductor device having metal gate includes providing a substrate having a first transistor and a second transistor formed thereon, the first transistor having a first gate trench formed therein, forming a first work function metal layer in the first gate trench, forming a sacrificial masking layer in the first gate trench, removing a portion of the sacrificial masking layer to expose a portion of the first work function metal layer, removing the exposed first function metal layer to form a U-shaped work function metal layer in the first gate trench, and removing the sacrificial masking layer. The first transistor includes a first conductivity type and the second transistor includes a second conductivity type. The first conductivity type and the second conductivity type are complementary.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: April 22, 2014
    Assignee: United Microelectronics Corp.
    Inventors: Po-Jui Liao, Tsung-Lung Tsai, Chien-Ting Lin, Shao-Hua Hsu, Yeng-Peng Wang, Chun-Hsien Lin, Chan-Lon Yang, Guang-Yaw Hwang, Shin-Chi Chen, Hung-Ling Shih, Jiunn-Hsiung Liao, Chia-Wen Liang
  • SEMICONDUCTOR DEVICE HAVING METAL GATE AND MANUFACTURING METHOD THEREOF
    Publication number: 20140103443
    Abstract: A semiconductor device having a metal gate includes a substrate having a first gate trench and a second gate trench formed thereon, a gate dielectric layer respectively formed in the first gate trench and the second gate trench, a first work function metal layer formed on the gate dielectric layer in the first gate trench and the second gate trench, a second work function metal layer respectively formed in the first gate trench and the second gate trench, and a filling metal layer formed on the second work function metal layer. An opening width of the second gate trench is larger than an opening width of the first gate trench. An upper area of the second work function metal layer in the first gate trench is wider than a lower area of the second work function metal layer in the first gate trench.
    Type: Application
    Filed: December 20, 2013
    Publication date: April 17, 2014
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Jui Liao, Tsung-Lung Tsai, Chien-Ting Lin, Shao-Hua Hsu, Yeng-Peng Wang, Chun-Hsien Lin, Chan-Lon Yang, Guang-Yaw Hwang, Shin-Chi Chen, Hung-Ling Shih, Jiunn-Hsiung Liao, Chia-Wen Liang
  • Method and electronic device for improving communication quality based on ambient noise sensing
    Patent number: 8687796
    Abstract: A method and an electronic device for communication quality improvement based on ambient noise sensing are provided for improving communication quality. The method includes: during a call, dynamically setting a noise reduction mode in response to the varying of an ambient noise amount of at least one audio signal received by the electronic device. The setting step includes: during the call, dynamically determining whether the ambient noise amount indicates the needs of the application of noise reduction. If the ambient noise amount indicates the needs of the application of noise reduction, then one of a plurality of noise reduction levels is selected according to the ambient noise amount, and the noise reduction mode is set according to the selected noise reduction level, wherein the noise reduction levels include at least two levels corresponding to two different amounts of noise reduction.
    Type: Grant
    Filed: November 19, 2010
    Date of Patent: April 1, 2014
    Assignee: HTC Corporation
    Inventors: Ting-Wei Sun, Hann-Shi Tong, Wen-Liang Tseng
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140084315
    Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with the electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Bottom surfaces of the first and second electrodes are exposed out of a bottom surface of the substrate to connect with welding pads of a printed circuit board. A bottom surface of the third electrode is received in the substrate.
    Type: Application
    Filed: July 31, 2013
    Publication date: March 27, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
  • LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF
    Publication number: 20140084326
    Abstract: A light-emitting diode includes a ceramic substrate, an electrode group setting on the substrate and co-fired with the ceramic substrate, an LED chip setting on the substrate and electrically connecting the electrode group. The electrode includes a first electrode and a second electrode spacing from the first electrode. The first electrode and the second electrode extend from a top surface of the substrate to a bottom surface of the substrate via side surfaces of the substrate. The light-emitting diode can be connected to a power source by the electrode group on the bottom surface of the substrate or by the electrode group on the side surfaces of the substrate.
    Type: Application
    Filed: July 23, 2013
    Publication date: March 27, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: LUNG-HSIN CHEN, WEN-LIANG TSENG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140084312
    Abstract: An light-emitting diode (LED) package includes a substrate, a electrode structure embedded in the substrate, and a plurality of LED chips electrically connecting with the electrode structure. The substrate includes a main portion and a protruding portion extending from a bottom surface of the main portion. The main portion is located above the protruding portion. The electrode structure includes a first, a second and a third electrode spaced from each other. The third electrode is located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of the top surface of the main portion. Bottom surfaces of the first and second electrodes are exposed out of the bottom surface of the main portion. Bottom surface of the third electrode is covered by the protruding portion. The present disclosure also relates to a method for manufacturing the LED package.
    Type: Application
    Filed: August 12, 2013
    Publication date: March 27, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140084313
    Abstract: An exemplary light-emitting diode (LED) package includes an electrically insulating substrate, an electrode structure embedded in the insulating substrate, and a plurality of LED chips electrically connecting with electrodes of the electrode structure respectively. The electrode structure includes a first electrode, a second electrode and a third electrode located between the first and second electrodes. Top surfaces of the first, second and third electrodes are exposed out of a top surface of the insulating substrate to support the LED chips. Front side and rear side faces of the first and second electrodes are exposed out of a front side face and a rear side face of the substrate whereby the front or rear side faces of the first and second electrodes can connect with welding pads of a printed circuit board. Circumferential side faces of the third electrode are encapsulated in the substrate.
    Type: Application
    Filed: August 27, 2013
    Publication date: March 27, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHE-HSANG HUANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG, YU-LIANG HUANG
  • LED LAMP HAVING A LARGE ILLUMINATION ANGLE
    Publication number: 20140071675
    Abstract: An LED bulb includes a connecting member having an Edison male screw base and an LED module engaging with the connecting member. The LED module includes a circuit board, a first LED and a plurality of second LEDs mounted on the circuit board. The first LED is arranged on a center of the circuit board. The second LEDs are located surround the first LED. The LED bulb furthermore includes a plurality of lens. Each lens covers a corresponding second LED. Each lens includes a light-guiding portion which includes a light input surface and a light output surface. Light emitted from each of the second LEDs travels into the lens via the light input surface, and is refracted out to lateral directions of the LED bulb by the light output surface of the light-guiding portion to obtain a wider illumination range.
    Type: Application
    Filed: July 30, 2013
    Publication date: March 13, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: CHAO-HSIUNG CHANG, LUNG-HSIN CHEN, PIN-CHUAN CHEN, WEN-LIANG TSENG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140061697
    Abstract: An LED package includes adjacent first and second electrodes, first and second extension electrodes protruding sideward from the first and second electrodes, a molded body surrounding the first and second electrodes and an LED die. The molded body forms a reflecting cup located over the first and second electrodes, with each reflecting cup defining a receiving cavity in a top face thereof to receive the LED die. The first and second extension electrodes are exposed from an outer periphery of the molded body. The first electrode has a first bottom face. The second electrode has a second bottom face. The first and second bottom faces of the first and second electrodes are exposed out from a bottom face of the molded body. A method for manufacturing the LED package is also provided.
    Type: Application
    Filed: June 7, 2013
    Publication date: March 6, 2014
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • PHARMACEUTICAL COMPOSITION FOR ENHANCHING IMMUNITY, AND EXTRACT OF PORIA
    Publication number: 20140065174
    Abstract: A pharmaceutical composition is used to enhance immunity of the human body. The composition contains potent components of lanostane compounds. A method is devised to obtain an extract from metabolite, sclerotium, or fermentation product of Poria cocos (Schw) Wolf. The extract contains 5-60% of the lanostane compounds by weight of the extract. The extract is devoid of secolanostane capable of inhibiting immunity development.
    Type: Application
    Filed: November 1, 2013
    Publication date: March 6, 2014
    Applicant: Sinphar Pharmaceutical Co., Ltd.
    Inventors: Hang-Ching Lin, Jerming Tseng, Hsiou-Yu Ding, Wen-Liang Chang, Chien-Lian Chao, Hsin-Wen Huang
  • SIDE VIEW LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140061712
    Abstract: A side view light emitting diode (LED) package includes an electrode structure, an LED die disposed on the electrode structure and an encapsulation layer covering the LED die. The encapsulation layer includes a light outputting surface. The electrode structure includes a first electrode and a second electrode spaced from each other to define a tortuous gap therebetween. Resin material for forming a substrate of the LED package fills in the gap to interconnect the first and second electrode together. The LED die is electrically connected to the first electrode and the second electrode. The present disclosure also provides a method for manufacturing the side view LED package.
    Type: Application
    Filed: August 21, 2013
    Publication date: March 6, 2014
    Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    Publication number: 20140061698
    Abstract: An LED package includes a first electrode, a second electrode adjacent to the first electrode, a molded body surrounding and encapsulating the first and second electrodes, and an LED die mounted on the second electrode. The molded body includes a reflecting cup located over the first and second electrodes and the reflecting cup defines a receiving cavity in a top face to receive the LED die. A first extension electrode protrudes sideward from the first electrode and a second extension electrode protrudes sideward from the second electrode. The first and second extension electrodes are exposed from an outer periphery of the molded body. A method for manufacturing the LED package is also provided.
    Type: Application
    Filed: June 26, 2013
    Publication date: March 6, 2014
    Inventors: HOU-TE LIN, CHAO-HSIUNG CHANG, PIN-CHUAN CHEN, LUNG-HSIN CHEN, WEN-LIANG TSENG
  • Manufacturing method for LED package
    Patent number: 8664018
    Abstract: The disclosure provides a manufacturing method for an LED package. A first luminescent conversion layer comprising one first luminescent conversion element is located on an LED chip, wherein the first luminescent conversion element is precipitated via centrifugation around the LED chip without sheltering the LED chip. Thereafter, a second luminescent conversion layer is located on the first luminescent conversion layer. The second luminescent layer has a second luminescent conversion element which has an excited efficiency lower that that of the first luminescent conversion element.
    Type: Grant
    Filed: November 7, 2011
    Date of Patent: March 4, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Hsin-Chiang Lin, Wen-Liang Tseng, Chieh-Ling Chang
  • Method for manufacturing phosphor film and method for making LED package having the phosphor film
    Patent number: 8658445
    Abstract: A method for manufacturing a phosphor film for use in the an LED package, includes following steps: providing a mold comprising a first and a second molding part, the first molding part and the second molding part cooperatively forming a molding chamber, the first molding part defining an opening communicating with the molding chamber; filling a mixture of phosphor particles and a transparent glue into the first opening; moving a piston in the first opening along a direction from the first molding part to the second molding part, thereby pressing the mixture into the molding chamber; solidifying the mixture to form a phosphor film; and removing the phosphor film from the mold. The phosphor film is used to be attached to a top face of an LED chip opposite a substrate on which the LED chip is mounted.
    Type: Grant
    Filed: August 30, 2012
    Date of Patent: February 25, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Lung-Hsin Chen, Wen-Liang Tseng, Pin-Chuan Chen
  • Traffic light assembly
    Patent number: 8657469
    Abstract: A traffic light assembly includes at least one light module, at least one lens located in front of the at least one light module, a housing enclosing the at lest one light module and the at least one lens therein, and a foldable cover located in front of the at least one lens and connected to the housing. A cleaning device is located on an outer surface of the foldable cover to clean snow and dust accumulated on the outer surface of the foldable cover.
    Type: Grant
    Filed: May 9, 2013
    Date of Patent: February 25, 2014
    Assignee: Advanced Optoelectronic Technology, Inc.
    Inventors: Chi-Wei Liao, Wen-Liang Tseng, Min-Tsun Hsieh, Chih-Yung Lin, Ching-Lien Yeh