Patents by Inventor Wen Chen

Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12166965
    Abstract: A computer implemented method for symmetrical motion vector difference (SMVD) mode, apparatus, and a non-transitory computer-readable storage medium are provided. The decoder obtains a first and second reference picture associated with a current video block, a first reference picture list of the current video block, and a second reference picture list of the current video block. The decoder receives motion parameters and calculates a first motion vector associated with the first reference picture by adding the MVD to corresponding motion vector predictor associated with the first reference picture, and calculates a second motion vector associated with second reference picture by subtracting the MVD from corresponding motion vector predictor associated with the second reference picture. The decoder obtains a prediction signal of the current video block by combining the prediction blocks generated based on the first motion vector and the second motion vector.
    Type: Grant
    Filed: November 30, 2021
    Date of Patent: December 10, 2024
    Assignee: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Xiaoyu Xiu, Yi-Wen Chen, Xianglin Wang, Shuiming Ye, Tsung-Chuan Ma, Hong-Jheng Jhu
  • Patent number: 12166989
    Abstract: Methods are provided for reducing the computation complexity and on-chip memory requirements as well as the decoding latency introduced by LMCS. In one method, a luma prediction sample is obtained for decoding a luma residual sample, a scaling factor is derived using the luma prediction sample, the scaling factor is used to scale the luma residual sample, and the reconstructed luma sample is calculated by adding the luma prediction sample and the scaled luma residual sample.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: December 10, 2024
    Assignee: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Xiaoyu Xiu, Yi-Wen Chen, Xianglin Wang, Tsung-Chuan Ma, Shuiming Ye, Hong-Jheng Jhu
  • Patent number: 12163132
    Abstract: SARS-CoV-2 causes pandemic COVID19. Developing an effective treatment to directly target the virus could significantly impact viral burden in those most vulnerable to the devastating effects of this virus. The invention provides antisense oligonucleotides (AOs) to target the single stranded RNA genome of the SARS-CoV-2 viruses. The administration of AOs can significantly reduce the target viral RNAs.
    Type: Grant
    Filed: September 10, 2021
    Date of Patent: December 10, 2024
    Assignee: CHILDREN'S NATIONAL MEDICAL CENTER
    Inventors: Yi-Wen Chen, Alexander E. Liu
  • Publication number: 20240401697
    Abstract: An sealing device for a display device is provided. The display device includes a display surface and an outer periphery surface. The sealing device comprises a base and a sealing ring component. The base has an inner side surface and an inner bottom surface. The sealing ring component is disposed in the base along the inner side surface. The sealing ring component is propped against the outer periphery surface without in contact with the display surface when the display device is arranged on the base, and then a to-be-evacuated space is formed between the display surface and the inner bottom surface.
    Type: Application
    Filed: October 23, 2023
    Publication date: December 5, 2024
    Applicant: DATA IMAGE CORPORATION
    Inventors: Ching-Wen CHEN, Hsien-Kuan WANG, Hao-Yu CHUANG
  • Publication number: 20240397081
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video coding. In one method, a decoder derives a reference picture for a current coding block; the decoder derives a predictor sample based on a motion vector associated with the reference picture using a motion compensation process from the reference picture; the decoder determines whether the predictor sample is located outside the reference picture by a certain margin; and the decoder determines the predictor sample is out-of-boundary (OOB) in response to determining the predictor sample is located outside the reference picture by a certain margin.
    Type: Application
    Filed: May 24, 2024
    Publication date: November 28, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Yi-Wen CHEN, Xiaoyu XIU, Che-Wei KUO, Hong-Jheng JHU, Wei CHEN, Ning YAN, Xianglin WANG, Bing YU
  • Publication number: 20240395605
    Abstract: A method of manufacturing a semiconductor memory device, including steps of providing a substrate, forming word lines extending in a first direction in the substrate, forming bit lines extending in a second direction over the word lines, forming partition structures between the bit lines and right above the word lines, forming storage node contacts in spaces defined by the bit lines and the partition structures, wherein a portion of each of the storage node contacts protruding from top surfaces of the bit lines and the partition structures is contact pad, forming a first dielectric layer on the contact pads, the bit lines and the partition structures, forming a second dielectric layer on the first dielectric layer, and performing an etch back process to remove parts of the second dielectric layer, so that only parts of the second dielectric layer on sidewalls of the contact pads remain.
    Type: Application
    Filed: July 31, 2024
    Publication date: November 28, 2024
    Applicant: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Janbo Zhang, Chao-Wei Lin, Chia-Yi Chu, Yu-Cheng Tung, Ken-Li Chen, Tsung-Wen Chen
  • Publication number: 20240391991
    Abstract: The present invention provides methods of treating pulmonary disorders with modulators of the Wnt signaling pathway. Also provided are methods of related methods of dosing and pharmaceutical compositions.
    Type: Application
    Filed: September 14, 2022
    Publication date: November 28, 2024
    Inventors: Russell FLETCHER, Kuo-Pao LAI, Yang LI, Wen-Chen YEH
  • Patent number: 12155818
    Abstract: Methods of selectively applying Bi-directional Optical Flow (BDOF) and Decoder-side Motion Vector Refinement (DMVR) on inter mode coded blocks employed in video coding standards, such as the now-current Versatile Video Coding (VVC) design, are performed at a computing device. In one method, when a current block is eligible for both applications of DMVR and BDOF based on a plurality of pre-defined conditions, the computing device uses a pre-defined criterion to classify the current block and then uses the classification in applying either BDOF or DMVR, but not both, on the block.
    Type: Grant
    Filed: August 6, 2021
    Date of Patent: November 26, 2024
    Assignee: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Yi-Wen Chen, Xiaoyu Xiu, Xianglin Wang, Tsung-Chuan Ma
  • Patent number: 12154848
    Abstract: A substrate structure is provided, in which an insulating protection layer is formed on a substrate body having a plurality of electrical contact pads, and the insulating protection layer has a plurality of openings corresponding to the plurality of exposed electrical contact pads, and the insulating protection layer is formed with a hollow portion surrounding a partial edge of at least one of the electrical contact pads at at least one of the openings, so as to reduce the barrier of the insulating protection layer.
    Type: Grant
    Filed: December 22, 2022
    Date of Patent: November 26, 2024
    Assignee: Siliconware Precision Industries Co., Ltd.
    Inventors: Chia-Wen Tsao, Wen-Chen Hsieh, Yi-Lin Tsai, Hsiu-Fang Chien
  • Patent number: 12155851
    Abstract: An electronic apparatus performs a method of decoding video data. The method includes receiving, from the video signal, a picture frame that includes a first component and a second component, receiving, from the video signal, a plurality of sample offsets associated with the second component, reconstructing the samples of the first component before a first in-loop filter module, reconstructing the samples of the second component after a second in-loop filter module, determining a classifier for the second component from one or more reconstructed samples of the first component relative to each sample of the second component, selecting a sample offset from the plurality of sample offsets for the second component according to the classifier, and modifying the reconstructed samples of the second component based on the selected sample offset.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: November 26, 2024
    Assignee: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Che-Wei Kuo, Xiaoyu Xiu, Wei Chen, Xianglin Wang, Yi-Wen Chen, Tsung-Chuan Ma, Hong-Jheng Jhu, Bing Yu
  • Publication number: 20240383094
    Abstract: A polishing pad is provided. The polishing pad includes a polishing layer and at least one detection window. The at least one detection window is located in the polishing layer. The at least one detection window includes a center portion and a cover portion surrounding the center portion. The cover portion is joined to the polishing layer, and a ratio of an area of the center portion to an area of the cover portion is between about 0.03 to about 5.00.
    Type: Application
    Filed: May 13, 2024
    Publication date: November 21, 2024
    Applicant: IV Technologies CO., Ltd.
    Inventor: Ko-Wen Chen
  • Publication number: 20240387411
    Abstract: Semiconductor structures and methods of testing the same are provided. A semiconductor structure according to the present disclosure includes a substrate, a semiconductor device over the substrate, wherein the semiconductor device includes an interconnect structure, and the interconnect structure includes a plurality of metallization layers disposed in a dielectric layer; and a delamination sensor. The delamination sensor includes a connecting structure and a plurality of contact vias in at least one of the plurality of metallization layers. The connecting structure bonds the semiconductor device to the substrate and does not functionally couple the semiconductor device to the substrate. The plurality of contact vias fall within a first region of a vertical projection area of the connecting structure but do not overlap a second region of the vertical projection area.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Inventors: Chih-Hsuan Tai, Ming-Chung Wu, Kuo-Wen Chen, Hsiang-Tai Lu
  • Publication number: 20240388695
    Abstract: A method for video encoding is provided. The method includes obtaining, by an encoder, a plurality of blocks from a video picture, wherein each of the plurality of blocks is to be encoded by an intra prediction mode or an inter prediction mode; in response to a first pre-defined condition being satisfied, determining, by the encoder, that a current block in the plurality of blocks is eligible for an application of Decoder-side Motion Vector Refinement (DMVR); in response to the current block being eligible for both applications of DMVR and Bi-Directional Optical Flow (BDOF), determining, by the encoder, whether a pre-defined criterion based on mode information of the current block is satisfied; avoiding, by the encoder in response to the pre-defined criterion being satisfied, applying BDOF to a subblock in the current block; and outputting, by the encoder by a bitstream, prediction mode information of the current block.
    Type: Application
    Filed: July 26, 2024
    Publication date: November 21, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Yi-Wen CHEN, Xiaoyu XIU, Xianglin WANG, Tsung-Chuan MA
  • Publication number: 20240387269
    Abstract: A method for fabricating an integrated circuit structure is provided. The method includes forming a gate structure over a semiconductor substrate; forming a source/drain epitaxial structure adjacent a side of the gate structure; forming a first isolation structure in the gate structure, wherein the first isolation structure spaces apart a first portion of the gate structure from a second portion of the gate structure; forming a front-side metallization layer over a frontside of the semiconductor substrate, wherein the front-side metallization layer comprises a front-side metal feature overlapping the first isolation structure; depositing a dielectric layer over a backside of the semiconductor substrate; forming a conductive via in the dielectric layer and the first isolation structure, wherein the conductive via is in contact with a backside of the front-side metal feature.
    Type: Application
    Filed: May 17, 2023
    Publication date: November 21, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Hsin CHAN, Chang-Wen CHEN
  • Publication number: 20240385509
    Abstract: A method includes: determining whether a first pellicle is to be inspected for inner particles; and in response to the first pellicle being to be inspected: forming a mask layer on a substrate; forming a defocused light path by shifting a mask assembly; exposing the mask layer by defocused light having a focal plane separated from the first pellicle by a distance; taking an image of the substrate; determining whether a threshold value is exceeded by analyzing the image; in response to the threshold value being exceeded, replacing the first pellicle with a second pellicle; and in response to the threshold value not being exceeded, processing production wafers using the first pellicle.
    Type: Application
    Filed: May 19, 2023
    Publication date: November 21, 2024
    Inventors: Chi YANG, Yao-Tang LIN, Zi-Wen CHEN, Jian-Yuan SU
  • Publication number: 20240387265
    Abstract: A method includes forming a dielectric layer over an epitaxial source/drain region. An opening is formed in the dielectric layer. The opening exposes a portion of the epitaxial source/drain region. A barrier layer is formed on a sidewall and a bottom of the opening. An oxidation process is performing on the sidewall and the bottom of the opening. The oxidation process transforms a portion of the barrier layer into an oxidized barrier layer and transforms a portion of the dielectric layer adjacent to the oxidized barrier layer into a liner layer. The oxidized barrier layer is removed. The opening is filled with a conductive material in a bottom-up manner. The conductive material is in physical contact with the liner layer.
    Type: Application
    Filed: July 28, 2024
    Publication date: November 21, 2024
    Inventors: Pin-Wen Chen, Chang-Ting Chung, Yi-Hsiang Chao, Yu-Ting Wen, Kai-Chieh Yang, Yu-Chen Ko, Peng-Hao Hsu, Ya-Yi Cheng, Min-Hsiu Hung, Chun-Hsien Huang, Wei-Jung Lin, Chih-Wei Chang, Ming-Hsing Tsai
  • Publication number: 20240388730
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video decoding. In one method, a decoder determines a coding bit depth for at least one sample in a bitstream; the decoder determines a value of a first Sequence Parameter Set (SPS) flag for the at least one sample; and the decoder further determines a second SPS flag for the at least one sample based on the value of the first SPS flag in combination of a coding bit depth for the at least one sample.
    Type: Application
    Filed: July 8, 2022
    Publication date: November 21, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Hong-Jheng JHU, Xiaoyu XIU, Yi-Wen CHEN, Wei CHEN, Chen-Wei KUO, Ning YAN, Xianglin WANG, Bing YU
  • Publication number: 20240383268
    Abstract: A laser colored product, a laser coloring method therefor, and a laser coloring system using the same are provided. The laser coloring method comprises the following steps. First, provide a processing workpiece which includes a processing part, and the processing part includes a pattern region. The processing part within the pattern region includes an inner portion and an outer layer, and the outer layer includes metal materials. Use the laser coloring system to irradiate the outer layer of the pattern region in stages to convert the outer layer of the pattern region into a metal color pattern layer. The metal color pattern layer includes metal materials or metal compounds of metal materials, and the metal color pattern layer includes a plurality of pixel units arranged in arrays, wherein each of the pixel units includes a pixel color, and each of the pixel units has a pixel width or a pixel length between 1 ?m to 500 ?m.
    Type: Application
    Filed: December 27, 2023
    Publication date: November 21, 2024
    Applicant: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hung-Wen Chen, Chia-Hung Chou, Yi-Jiun Shen, Chien-Hung Chen
  • Patent number: 12147255
    Abstract: Systems and methods as described herein may take a variety of forms. In one example, systems and methods are provided for a circuit for powering a voltage regulator. A voltage regulator circuit has an output electrically coupled to a gate of an output driver transistor, the output driver transistor having a first terminal electrically coupled to a voltage source and a second terminal electrically coupled to a first terminal of a voltage divider, the voltage divider having an second terminal electrically coupled to ground, and the voltage divider having an output of a stepped down voltage. A power control circuitry transistor has a first terminal electrically coupled to the voltage source, the power control circuitry transistor having a second terminal electrically coupled to the gate terminal of the output driver transistor, and the power control circuitry transistor having a gate terminal electrically coupled to a status voltage signal.
    Type: Grant
    Filed: April 6, 2023
    Date of Patent: November 19, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Szu-Chun Tsao, Jaw-Juinn Horng, Bindu Madhavi Kasina, Yi-Wen Chen
  • Patent number: 12149809
    Abstract: A camera module comprises a supporting member for supporting a sensor chip to move relative to a lens for correcting camera shake, a plurality of bulges is provided between the supporting member and a bottom plate. The bulges provide a reduced resistance to sliding on the supporting member. An electronic device using the module is also disclosed.
    Type: Grant
    Filed: November 2, 2022
    Date of Patent: November 19, 2024
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO. LTD.
    Inventors: Zhuang-Zhuang Jing, Shin-Wen Chen, Jing-Wei Li, Shuai-Peng Li, Cong Cao