Patents by Inventor Wen Chen

Wen Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240040133
    Abstract: A computing device performs a method of decoding video data by generating a multi-model linear model (MMLM) including a first linear model between the minimum luma value and the threshold luma value, and a second linear model between the threshold luma value and the maximum luma value from a group of reference luma samples and a group of reference chroma samples; and reconstructing a respective sample value of the chroma block from a weighted combination of a respective first corresponding reconstructed sample value of the luma block using the multi-model linear model, and a respective second reconstructed sample value of a neighboring chroma block from an intra prediction mode.
    Type: Application
    Filed: October 12, 2023
    Publication date: February 1, 2024
    Inventors: Hong-Jheng Jhu, Xiaoyu Xiu, Yi-Wen Chen, Wei Chen, Che-wei Kuo, Xianglin Wang, Bing Yu
  • Publication number: 20240040134
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for video coding with a low-delay transform skip residual coding (TSRC) method. The TSRC method includes: deriving, by an encoder, a rice parameter based on coded information of a current slice of a video. The coded information may include one or more of following parameters: a quantization parameter or a coding bit-depth associated with a slice, a picture, or a sequence of the video; or a hash ratio associated with the slice, the picture, or the sequence of the video.
    Type: Application
    Filed: September 12, 2023
    Publication date: February 1, 2024
    Applicant: BEIJING DAJIA INTERNET INFORMATION TECHNOLOGY CO., LTD.
    Inventors: Hong-Jheng JHU, Xiaoyu XIU, Yi-Wen CHEN, Wei CHEN, Che-Wei KUO, Xianglin WANG, Bing YU
  • Publication number: 20240038459
    Abstract: A light-emitting keyboard includes a bracket, keycaps, a circuit layer and a composite light-emitting layer. The keycaps are disposed on the bracket and connected to the bracket. The circuit layer is disposed between the keycaps and the bracket. The composite light-emitting layer is disposed under the bracket, and includes a substrate, a conductive layer and light sources. The substrate includes a connection portion and extension portions respectively connected to the connection portion. A gap is positioned between any two adjacent extension portions, and a width of the gap is greater than or substantially equal to a width of any of the two adjacent extension portions. The conductive layer is disposed on the substrate. The light sources are disposed on the extension portions.
    Type: Application
    Filed: October 16, 2023
    Publication date: February 1, 2024
    Applicants: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED, Lite-On Technology Corporation
    Inventor: Yi-Wen Chen
  • Patent number: 11889110
    Abstract: Methods, apparatuses, and non-transitory computer-readable storage mediums are provided for decoding a video signal. The method includes obtaining a first reference picture I associated with a video block, obtaining control point motion vectors (CPMVs) of an affine coding block based on the video block, obtaining prediction samples I(i, j) of the affine coding block, deriving PROF prediction sample refinements of the affine coding block based on the PROF, receiving an LIC flag that indicates whether the LIC is applied to the affine coding block, deriving, and when the LIC is applied, LIC weight and offset based on neighboring reconstructed samples of the affine coding block and their corresponding reference samples in the first reference picture, and obtaining final prediction samples of the affine coding block based on the PROF prediction sample refinements and the LIC weight and offset.
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: January 30, 2024
    Assignee: Beijing Dajia Internet Information Technology Co., Ltd.
    Inventors: Xiaoyu Xiu, Yi-Wen Chen, Xianglin Wang, Shuiming Ye, Tsung-Chuan Ma, Hong-Jheng Jhu
  • Patent number: 11886263
    Abstract: A signal re-driving device, a data storage system and a mode control method are provided. The method includes the following steps. A first signal is received via a receiving circuit of the signal re-driving device. An analog signal feature is detected the receiving circuit. A first mode is entered according to the analog signal feature. The first signal is modulated and a second signal is outputted in the first mode. The second signal is sent via a sending circuit of the signal re-driving device. A digital signal feature is detected via the receiving circuit. And, the first mode is switched to a second mode according to the digital signal feature.
    Type: Grant
    Filed: August 27, 2021
    Date of Patent: January 30, 2024
    Assignee: PHISON ELECTRONICS CORP.
    Inventors: Po-Jung Chou, Sheng-Wen Chen, Chung-Kuang Chen
  • Patent number: 11888549
    Abstract: A mobile device includes an NFC (Near Field Communication) antenna including a metal coil and a first dielectric substrate, a coupling metal element, and a second dielectric substrate. The metal coil is disposed on the first dielectric substrate. The coupling metal element is adjacent to the metal coil. The coupling metal element does not directly touch the metal coil. The coupling metal element is disposed on the second dielectric substrate. The coupling metal element is configured to adjust the operational frequency of the NFC antenna.
    Type: Grant
    Filed: January 11, 2022
    Date of Patent: January 30, 2024
    Assignee: WISTRON NEWEB CORP.
    Inventors: Ting-Han Shih, Ching-Wen Chen
  • Patent number: 11887934
    Abstract: The present disclosure relates to methods and apparatus for forming a thin-form-factor semiconductor package. In one embodiment, a glass or silicon substrate is structured by micro-blasting or laser ablation to form structures for formation of interconnections therethrough. The substrate is thereafter utilized as a frame for forming a semiconductor package with embedded dies therein.
    Type: Grant
    Filed: December 5, 2022
    Date of Patent: January 30, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Han-Wen Chen, Steven Verhaverbeke, Giback Park, Giorgio Cellere, Diego Tonini, Vincent DiCaprio, Kyuil Cho
  • Patent number: 11881447
    Abstract: The present disclosure relates to semiconductor core assemblies and methods of forming the same. The semiconductor core assemblies described herein may be utilized to form semiconductor package assemblies, PCB assemblies, PCB spacer assemblies, chip carrier assemblies, intermediate carrier assemblies (e.g., for graphics cards), and the like. In one embodiment, a silicon substrate core is structured by direct laser patterning. One or more conductive interconnections are formed in the substrate core and one or more redistribution layers are formed on surfaces thereof. The silicon substrate core may thereafter be utilized as a core structure for a semiconductor package, PCB, PCB spacer, chip carrier, intermediate carrier, or the like.
    Type: Grant
    Filed: April 12, 2021
    Date of Patent: January 23, 2024
    Assignee: Applied Materials, Inc.
    Inventors: Han-Wen Chen, Steven Verhaverbeke, Giback Park, Kyuil Cho, Kurtis Leschkies, Roman Gouk, Chintan Buch, Vincent Dicaprio, Bernhard Stonas, Jean Delmas
  • Patent number: 11881503
    Abstract: The present invention provides a semiconductor memory device including a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.
    Type: Grant
    Filed: December 9, 2022
    Date of Patent: January 23, 2024
    Assignee: Fujian Jinhua Integrated Circuit Co., Ltd.
    Inventors: Pei-Ting Tsai, Yu-Cheng Tung, Tsuo-Wen Lu, Min-Teng Chen, Tsung-Wen Chen
  • Patent number: 11882733
    Abstract: An organic semiconductor substrate includes a base, a first conductive pattern, a second conductive pattern, a first metal oxide pattern, a second metal oxide pattern, an organic flat pattern layer, a source, a drain, an organic semiconductor pattern, an organic gate insulating layer, and a gate. The first conductive pattern and the second conductive pattern are disposed on the base and separated from each other. The first metal oxide pattern and the second metal oxide pattern respectively cover and are electrically connected to the first conductive pattern and the second conductive pattern, respectively. A first portion of the organic flat pattern layer is disposed between the first metal oxide pattern and the second metal oxide pattern. A surface of the first metal oxide pattern has a first distance from the base. A surface of the first portion of the organic flat pattern layer has a second distance from the base. The second distance is less than or equal to the first distance.
    Type: Grant
    Filed: July 1, 2021
    Date of Patent: January 23, 2024
    Assignee: Au Optronics Corporation
    Inventors: Shuo-Yang Sun, Shih-Hua Hsu, Ching-Wen Chen, Ying-Hui Lai
  • Publication number: 20240018594
    Abstract: A method for detecting or monitoring FSHD comprising detecting one or more biomarkers, such as miRNA biomarkers or protein biomarkers that are significantly decreased or increased in subjects having FSHD compared to normal control subjects. Methods for treatment of subjects at risk of having, or having FSHD.
    Type: Application
    Filed: November 3, 2021
    Publication date: January 18, 2024
    Applicant: CHILDREN'S NATIONAL MEDICAL CENTER
    Inventors: Yi-Wen CHEN, Christopher HEIER
  • Publication number: 20240018484
    Abstract: An in vitro co-culture system comprising cancer-associated fibroblasts (CAFs) and cancer cells for producing and maintaining cancer stem cells and uses thereof for identifying agents capable of reducing cancer cell stemness. Also disclosed herein are a paracrine network through which CAFs facilitate production and/or maintenance of cancer stem cells and the use of components of such a paracrine network for prognosis purposes and for identifying cancer patients who are likely to respond to certain treatment.
    Type: Application
    Filed: August 21, 2023
    Publication date: January 18, 2024
    Applicant: NATIONAL TAIWAN UNIVERSITY
    Inventors: Pan-Chyr Yang, Huei-Wen Chen, Wan-Jiun Chen
  • Publication number: 20240021468
    Abstract: In one example aspect, the present disclosure is directed to a method. The method includes receiving a workpiece having a conductive feature over a semiconductor substrate, forming a sacrificial material layer over the conductive feature, removing first portions of the sacrificial material layer to form line trenches and to expose a top surface of the conductive feature in one of the line trenches; forming line features in the line trenches, removing second portions of the sacrificial material layer to form gaps between the line features, and forming dielectric features in the gaps, the dielectric features enclosing an air gap.
    Type: Application
    Filed: August 8, 2023
    Publication date: January 18, 2024
    Inventors: Yu-Hsin Chan, Cai-Ling Wu, Chang-Wen Chen, Po-Hsiang Huang, Yu-Yu Chen, Kuan-Wei Huang, Jr-Hung Li, Jay Chiu, Ting-Kui Chang
  • Publication number: 20240023042
    Abstract: A method for small data transmission (SDT) in RRC_INACTIVE state and related devices are provided. The method includes receiving a Radio Resource Control (RRC) release message used for providing SDT configuration, and a first timing advance (TA) command transmitted along with the RRC release message; applying the first TA command upon the reception of the RRC release message; and starting or restarting Timing Alignment Timer (TAT) upon the reception of the first TA command transmitted along with the RRC release message, for keeping uplink (UL) time alignment during SDT in RRC_INACTIVE state. With this method, UL synchronization/timing maintenance in RRC_INACTIVE state is realized.
    Type: Application
    Filed: December 23, 2021
    Publication date: January 18, 2024
    Applicant: PURPLEVINE INNOVATION COMPANY LIMITED
    Inventor: Chiu-Wen CHEN
  • Publication number: 20240021533
    Abstract: The present disclosure relates to thin-form-factor reconstituted substrates and methods for forming the same. The reconstituted substrates described herein may be utilized to fabricate homogeneous or heterogeneous high-density 3D integrated devices. In one embodiment, a silicon substrate is structured by direct laser patterning to include one or more cavities and one or more vias. One or more semiconductor dies of the same or different types may be placed within the cavities and thereafter embedded in the substrate upon formation of an insulating layer thereon. One or more conductive interconnections are formed in the vias and may have contact points redistributed to desired surfaces of the reconstituted substrate. The reconstituted substrate may thereafter be integrated into a stacked 3D device.
    Type: Application
    Filed: July 31, 2023
    Publication date: January 18, 2024
    Inventors: Han-Wen CHEN, Steven VERHAVERBEKE, Guan Huei SEE, Giback PARK, Giorgio CELLERE, Diego TONINI, Vincent DICAPRIO, Kyuil CHO
  • Publication number: 20240021582
    Abstract: The present disclosure generally relates to stacked miniaturized electronic devices and methods of forming the same. More specifically, embodiments described herein relate to semiconductor device spacers and methods of forming the same. The semiconductor device spacers described herein may be utilized to form stacked semiconductor package assemblies, stacked PCB assemblies, and the like.
    Type: Application
    Filed: July 27, 2023
    Publication date: January 18, 2024
    Inventors: Kurtis LESCHKIES, Han-Wen CHEN, Steven VERHAVERBEKE, Giback PARK, Kyuil CHO, Jeffrey L. FRANKLIN, Wei-Sheng LEI
  • Patent number: 11873914
    Abstract: A buffer valve is installed on a pneumatic diaphragm valve. An inner flow channel of the buffer valve includes an inner micro gas hole, an inner chamber, an outer gas hole, and a floating ball. The buffer valve has functions with a high-filling action, a shielding action, a releasing action, a shielding time ?t, and an adjusting mechanism. When inflatable, the floating ball will not block the inner micro hole to be quickly filled with high-pressure gas. when gas discharge, the floating ball will move to the outer gas hole with the gas flow and produce the shielding action to reduce the discharge rate to reduce the vibration and slow down the approach speed of the diaphragm to reduce the impact against the valve seat. When the pressure of the gas decreases, the floating ball is separated from the outer gas hole by the releasing action to accelerate the discharge.
    Type: Grant
    Filed: October 20, 2022
    Date of Patent: January 16, 2024
    Assignee: Bueno Technology Co., Ltd.
    Inventors: Huan-Jan Chien, Po-Wen Chen
  • Publication number: 20240013473
    Abstract: A method for three dimensional medical image construction having steps of inputting multiple two-dimensional images and a known three-dimensional image into a processing module and inputting a new two-dimensional image into the processing module to obtain a reconstructed three-dimensional image, wherein the processing module utilizes a neural network to build a reconstructed three-dimensional image by unfolding the two-dimensional image to produce a three-dimensional reconstruction.
    Type: Application
    Filed: June 16, 2023
    Publication date: January 11, 2024
    Inventors: Yi-Wen Chen, Cheng-Ting Shih, Kui-Chou Huang, Hsin-Yuan Fang, Kai-Cheng Hsu
  • Publication number: 20240015316
    Abstract: A method for video decoding is provided. The method includes obtaining a plurality of sub-blocks within an affine coding unit (CU) of a video frame, where the plurality of sub-blocks include a plurality of boundary sub-blocks and a plurality of non-boundary sub-blocks. Further, the method may include applying both overlapped block motion compensation (OBMC) and affine secondary prediction (ASP) to at least one sub-block to generate a sub-block-based prediction for the affine CU or enabling the ASP for the plurality of non-boundary sub-block and disabling the OBMC for the plurality of non-boundary sub-blocks.
    Type: Application
    Filed: September 26, 2023
    Publication date: January 11, 2024
    Inventors: Xiaoyu Xiu, Che-Wei Kuo, Wei Chen, Yi-Wen Chen, Hong-Jheng Jhu, Xianglin Wang, Bing Yu
  • Patent number: 11870153
    Abstract: An electronic device and an antenna structure thereof are provided. The antenna structure includes a first, a second and a third radiating element and a grounding element. The first radiating element includes a first and a second radiating portion, a feeding portion and a grounding portion. The grounding portion includes a first, a second, a third, a fourth and a fifth section. The first section is connected between the first radiating portion and the feeding portion. The grounding element is connected with the fourth section and the fifth section. The second radiating element is connected with the grounding element. The second radiating element includes a third radiating portion, and the third and the second radiating portion are coupled with each other. The third radiating element is connected with the feeding portion, and the third radiating element and the first section are coupled with each other.
    Type: Grant
    Filed: July 5, 2022
    Date of Patent: January 9, 2024
    Assignee: WISTRON NEWEB CORPORATION
    Inventors: Cheng-Wei Chiang, Cheng-Rui Zhang, Ching-Wen Chen