Abstract: A fiber product folding apparatus includes a first dashed-line cutting device used to form a plurality of first dashed lines on a first fiber product. Through control of the rotational speed of the first dashed-line roller, the interval between adjacent first dashed lines is adjusted. A first severing device receives the first fiber product with the first dashed lines by a predetermined length and cuts off the first fiber product. A second dashed-line cutting device is used to form a plurality of second dashed lines on a second fiber product. Through control of the rotational speed of the second dashed-line roller, the interval between adjacent second dashed lines can be adjusted. A second severing device receives the second fiber product that includes the second dashed lines by a predetermined length and cuts off the second fiber product. Finally, the first fiber product and the second fiber product are conducted to pass between a first folding roller and a second folding roller to proceed with folding.

Abstract: A fiber product folding apparatus includes a first dashed-line cutting device used to form a plurality of first dashed lines on a first fiber product. Through control of the rotational speed of the first dashed-line roller, the interval between adjacent first dashed lines is adjusted. A first severing device receives the first fiber product with the first dashed lines by a predetermined length and cuts off the first fiber product. A second dashed-line cutting device is used to form a plurality of second dashed lines on a second fiber product. Through control of the rotational speed of the second dashed-line roller, the interval between adjacent second dashed lines can be adjusted. A second severing device receives the second fiber product that includes the second dashed lines by a predetermined length and cuts off the second fiber product. Finally, the first fiber product and the second fiber product are conducted to pass between a first folding roller and a second folding roller to proceed with folding.

Abstract: A folding machine for folding fiber products and fiber products formed and stacked thereby are disclosed. The folding machine includes two folding devices, each of which includes a cutting device, a delivery wheel, a folding-line wheel, a platen wheel, and a folding wheel. The cutting device cuts the fiber product and transports the cut fiber product to the delivery wheel. The folding-line wheel is adjacent to the delivery wheel for making a first folding line on the fiber product carried by the delivery wheel, and then the platen wheel folds the fiber product along the first folding line. Subsequently, the once-folded fiber product is transported to the folding wheel. The folding wheels of the two folding devices are adjacent to each other and are used to fold the fiber product passing therethrough for a second time, and thus fiber products with three folds are formed.

Abstract: An aromatic liquid crystal polyester, having repeating units represented by formulae (1) and (2), respectively: where R?, Ar1, Ar2, Ar3, X, Y1, Y2 and Z are those as defined in the specification. Also, a liquid crystal polyester composition including the aromatic liquid crystal polyester and a solvent. The composition has an improved viscosity stability. Also, a liquid crystal polyester film prepared from the liquid crystal polyester composition and a method for manufacturing the same. The liquid crystal polyester film according to the present disclosure has excellent properties such as a low hygroscopicity and a low dissipation factor (Df).

Abstract: A folding machine for folding fiber products and fiber products formed and stacked thereby are disclosed. The folding machine includes two folding devices, each of which includes a cutting device, a delivery wheel, a folding-line wheel, a platen wheel, and a folding wheel. The cutting device cuts the fiber product and transports the cut fiber product to the delivery wheel. The folding-line wheel is adjacent to the delivery wheel for making a first folding line on the fiber product carried by the delivery wheel, and then the platen wheel folds the fiber product along the first folding line. Subsequently, the once-folded fiber product is transported to the folding wheel. The folding wheels of the two folding devices are adjacent to each other and are used to fold the fiber product passing therethrough for a second time, and thus fiber products with three folds are formed.

Abstract: A combination cable mounting fixture structure is disclosed. The structure includes plural cable units that can be distinguished as first cable units, second cable units, and third cable units. The first cable unit can be selected to be fixed to a flat surface, each of the cable units is provided with at least one male head connecting portion, at least one female head connecting portion, or is provided with both a male head connecting portion and a female head connecting portion. The female (male) head connecting portion of the second cable unit is connected to the adjacent male (female) head connecting portion, and the female (male) head connecting portion of the third cable unit is connected to the adjacent male (female) head connecting portion.

Abstract: The present invention relates to a self-winding modular linear unit, which comprises: a center connection portion, a left connection portion horizontally connected to the center connection portion, and a right connection portion horizontally connected to the center connection portion, wherein the left connection portion includes a left extending portion extending downwardly from the left connection portion and forming a left connection space with the center connection space. The right connection portion includes a right extending portion extending upwardly from the right connection portion, and forming a right connection space with the center connection portion. When the left extending portion is embedded into the right connection space or the right extending portion is embedded into the left connection space, the present invention achieves self-winding.

Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.

Abstract: The present invention relates to a self winding linear unit. The linear unit is assembled from a center protruding body, a left-side protruding portion, and a right-side protruding portion, wherein the left-side protruding portion and the right-side protruding portion are respectively configured on the left and right sides of the center protruding body. Moreover, a spacing between the left and right-side protruding portions on a bottom portion of the center protruding body defines a holding space. When the center protruding body on one end of the linear unit is curved round and embedded in the holding space of its own main body, a self roll-up and winding cable arranger is achieved. When the center protruding body on one end of the linear unit is embedded in the holding space of another linear unit, then a plurality of the linear units may be stacked to form a tiered cable arranger.

Abstract: The present invention relates to a self-winding modular linear unit, which comprises: a center connection portion, a left connection portion horizontally connected to the center connection portion, and a right connection portion horizontally connected to the center connection portion, wherein the left connection portion includes a left extending portion extending downwardly from the left connection portion and forming a left connection space with the center connection space. The right connection portion includes a right extending portion extending upwardly from the right connection portion, and forming a right connection space with the center connection portion. When the left extending portion is embedded into the right connection space or the right extending portion is embedded into the left connection space, the present invention achieves self-winding or self-stacking in a row so as to form a variety of wire organizers.

Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.

Abstract: Chemical-mechanical polishing (CMP) compositions and methods are described, which are suitable for polishing an aluminum surface. The compositions comprise alumina abrasive particles coated with an anionic polymer, and suspended in an acidic or neutral pH carrier. In some cases, a polishing aid such as silica, a carboxylic acid, a phosphonic acid compound, or a combination thereof may be added to the CMP compositions. The described CMP compositions and methods improve polishing efficacy and reduce surface imperfections on a polished aluminum surface compared to CMP methods using uncoated alumina abrasive.

Abstract: A method for polishing Through-Silicon Via (TSV) wafers is provided. The method comprises a step of subjecting the surface of a TSV wafer to a polishing treatment with a polishing composition containing an organic alkaline compound, an oxidizing agent selected from sodium chlorite and/or potassium bromate, silicon oxide abrasive particles, and a solvent to simultaneously remove Si and conductive materials at their respective removal rates. By using the method of this invention, Si and conductive materials can be simultaneously polished at higher removal rates to significantly save the necessary working-hour costs for polishing TSV wafers. A polishing composition used in the above method is also provided.

Abstract: The present invention provides a material distribution system and method thereof, comprising first, second and third conveyors, first, second, third and fourth material distribution paths, first and second material distribution rockers, and a movable material-distributing guide plate. Material conveyed on the second conveyor is delivered to the first or second material distribution rocker by switching the movable material-distributing guide plate, material conveyed on the first or second conveyor is delivered to the first or second material distribution path by switching the first material distribution rocker, and material conveyed on the second or third conveyor is delivered to the third or fourth material distribution path by switching the second material distribution rocker.

Abstract: The present invention provides a material distribution system and method thereof, comprising first, second and third conveyors, first, second, third and fourth material distribution paths, first and second material distribution rockers, and a movable material-distributing guide plate. Material conveyed on the second conveyor is delivered to the first or second material distribution rocker by switching the movable material-distributing guide plate, material conveyed on the first or second conveyor is delivered to the first or second material distribution path by switching the first material distribution rocker, and material conveyed on the second or third conveyor is delivered to the third or fourth material distribution path by switching the second material distribution rocker.

Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.

Abstract: A mainframe structure includes a housing having a front opening, flanges on one same plane around the front opening and stop members suspending on the inside corresponding to the flanges, a circuit module accommodated in the housing, and a cover detachably mounted in the front opening of the housing and stopped against the flanges and the stop member. The cover has two slots symmetrically disposed at two opposite lateral sides, two lugs respectively disposed adjacent to the slots and two handles respectively mounted in the slots and pivoted to the lugs in reversed directions. By means of biasing the two handles to stop against respective stop members, the user can detach the cover from the housing conveniently with the hands without any hand tools.

Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.

Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.

Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.