Patents by Inventor Wen-Cheng Liu

Wen-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240093373
    Abstract: A method for preparing antibacterial stainless steel by surface alloying includes the steps of coating an infiltration promoter layer on a stainless steel surface, coating an antibacterial metal layer on a surface of the infiltration promoter layer, and performing heat treatment of the stainless steel to diffuse an antibacterial metal into the stainless steel. This method can be applied to various types of stainless steel, and the antibacterial metal can be diffused and quenched into the stainless steel, such that the finally formed surface of the stainless steel has an antibacterial alloy layer with a specific thickness to provide better corrosion resistance and antibacterial ability without changing the advantages and properties of the antibacterial metal or stainless steel substrate, and the thickness and concentration of the antibacterial metal layer, and the parameters for heat treatment can be adjusted to control the chemical composition and thickness of the antibacterial alloy layer.
    Type: Application
    Filed: November 16, 2022
    Publication date: March 21, 2024
    Inventors: WEN-TA TSAI, BERNARD HAOCHIH LIU, ZHI-YAN CHEN, CHONG-CHENG HUANG
  • Publication number: 20240088246
    Abstract: Various embodiments of the present application are directed towards a control gate layout to improve an etch process window for word lines. In some embodiments, an integrated chip comprises a memory array, an erase gate, a word line, and a control gate. The memory array comprises a plurality of cells in a plurality of rows and a plurality of columns. The erase gate and the word line are elongated in parallel along a row of the memory array. The control gate is elongated along the row and is between and borders the erase gate and the word line. Further, the control gate has a pad region protruding towards the erase gate and the word line. Because the pad region protrudes towards the erase gate and the word line, a width of the pad region is spread between word-line and erase-gate sides of the control gate.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Yu-Ling Hsu, Ping-Cheng Li, Hung-Ling Shih, Po-Wei Liu, Wen-Tuo Huang, Yong-Shiuan Tsair, Chia-Sheng Lin, Shih Kuang Yang
  • Patent number: 11923432
    Abstract: A method of manufacturing a semiconductor device includes forming a multi-layer stack of alternating first layers of a first semiconductor material and second layers of a second semiconductor material on a semiconductor substrate, forming a first recess through the multi-layer stack, and laterally recessing sidewalls of the second layers of the multi-layer stack. The sidewalls are adjacent to the first recess. The method further includes forming inner spacers with respective seams adjacent to the recessed second layers of the multi-layer stack and performing an anneal treatment on the inner spacers to close the respective seams.
    Type: Grant
    Filed: January 3, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yoh-Rong Liu, Wen-Kai Lin, Che-Hao Chang, Chi On Chui, Yung-Cheng Lu, Li-Chi Yu, Sen-Hong Syue
  • Patent number: 11914541
    Abstract: In example implementations, a computing device is provided. The computing device includes an expansion interface, a first device, a second device, and a processor communicatively coupled to the expansion interface. The expansion interface includes a plurality of slots. Two slots of the plurality of slots are controlled by a single reset signal. The first device is connected to a first slot of the two slots and has a feature that is compatible with the single reset signal. The second device is connected to a second slot of the two slots and does not have the feature compatible with the single reset signal. The process is to detect the first device connected to the first slot and the second device connected to the second slot and disable the feature by preventing the first slot and the second slot from receiving the single reset signal.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: February 27, 2024
    Assignee: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Wen Bin Lin, ChiWei Ding, Chun Yi Liu, Shuo-Cheng Cheng, Chao-Wen Cheng
  • Patent number: 11772318
    Abstract: A fiber product folding apparatus includes a first dashed-line cutting device used to form a plurality of first dashed lines on a first fiber product. Through control of the rotational speed of the first dashed-line roller, the interval between adjacent first dashed lines is adjusted. A first severing device receives the first fiber product with the first dashed lines by a predetermined length and cuts off the first fiber product. A second dashed-line cutting device is used to form a plurality of second dashed lines on a second fiber product. Through control of the rotational speed of the second dashed-line roller, the interval between adjacent second dashed lines can be adjusted. A second severing device receives the second fiber product that includes the second dashed lines by a predetermined length and cuts off the second fiber product. Finally, the first fiber product and the second fiber product are conducted to pass between a first folding roller and a second folding roller to proceed with folding.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: October 3, 2023
    Assignee: Chan Li Machinery Co., Ltd.
    Inventor: Wen-Cheng Liu
  • Publication number: 20220314524
    Abstract: A fiber product folding apparatus includes a first dashed-line cutting device used to form a plurality of first dashed lines on a first fiber product. Through control of the rotational speed of the first dashed-line roller, the interval between adjacent first dashed lines is adjusted. A first severing device receives the first fiber product with the first dashed lines by a predetermined length and cuts off the first fiber product. A second dashed-line cutting device is used to form a plurality of second dashed lines on a second fiber product. Through control of the rotational speed of the second dashed-line roller, the interval between adjacent second dashed lines can be adjusted. A second severing device receives the second fiber product that includes the second dashed lines by a predetermined length and cuts off the second fiber product. Finally, the first fiber product and the second fiber product are conducted to pass between a first folding roller and a second folding roller to proceed with folding.
    Type: Application
    Filed: April 28, 2021
    Publication date: October 6, 2022
    Inventor: WEN-CHENG LIU
  • Patent number: 11345563
    Abstract: A folding machine for folding fiber products and fiber products formed and stacked thereby are disclosed. The folding machine includes two folding devices, each of which includes a cutting device, a delivery wheel, a folding-line wheel, a platen wheel, and a folding wheel. The cutting device cuts the fiber product and transports the cut fiber product to the delivery wheel. The folding-line wheel is adjacent to the delivery wheel for making a first folding line on the fiber product carried by the delivery wheel, and then the platen wheel folds the fiber product along the first folding line. Subsequently, the once-folded fiber product is transported to the folding wheel. The folding wheels of the two folding devices are adjacent to each other and are used to fold the fiber product passing therethrough for a second time, and thus fiber products with three folds are formed.
    Type: Grant
    Filed: April 12, 2019
    Date of Patent: May 31, 2022
    Assignee: CHAN LI MACHINERY CO., LTD.
    Inventor: Wen-Cheng Liu
  • Publication number: 20210371751
    Abstract: An aromatic liquid crystal polyester, having repeating units represented by formulae (1) and (2), respectively: where R?, Ar1, Ar2, Ar3, X, Y1, Y2 and Z are those as defined in the specification. Also, a liquid crystal polyester composition including the aromatic liquid crystal polyester and a solvent. The composition has an improved viscosity stability. Also, a liquid crystal polyester film prepared from the liquid crystal polyester composition and a method for manufacturing the same. The liquid crystal polyester film according to the present disclosure has excellent properties such as a low hygroscopicity and a low dissipation factor (Df).
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Applicant: ETERNAL MATERIALS CO., LTD.
    Inventors: JIA-CHENG CHANG, WEI-TING YEH, WEN-CHENG LIU
  • Publication number: 20200247639
    Abstract: A folding machine for folding fiber products and fiber products formed and stacked thereby are disclosed. The folding machine includes two folding devices, each of which includes a cutting device, a delivery wheel, a folding-line wheel, a platen wheel, and a folding wheel. The cutting device cuts the fiber product and transports the cut fiber product to the delivery wheel. The folding-line wheel is adjacent to the delivery wheel for making a first folding line on the fiber product carried by the delivery wheel, and then the platen wheel folds the fiber product along the first folding line. Subsequently, the once-folded fiber product is transported to the folding wheel. The folding wheels of the two folding devices are adjacent to each other and are used to fold the fiber product passing therethrough for a second time, and thus fiber products with three folds are formed.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 6, 2020
    Inventor: WEN-CHENG LIU
  • Publication number: 20180309274
    Abstract: A combination cable mounting fixture structure is disclosed. The structure includes plural cable units that can be distinguished as first cable units, second cable units, and third cable units. The first cable unit can be selected to be fixed to a flat surface, each of the cable units is provided with at least one male head connecting portion, at least one female head connecting portion, or is provided with both a male head connecting portion and a female head connecting portion. The female (male) head connecting portion of the second cable unit is connected to the adjacent male (female) head connecting portion, and the female (male) head connecting portion of the third cable unit is connected to the adjacent male (female) head connecting portion.
    Type: Application
    Filed: October 10, 2017
    Publication date: October 25, 2018
    Inventors: Wen-Cheng Liu, Jerric Paul
  • Patent number: 9892822
    Abstract: The present invention relates to a self-winding modular linear unit, which comprises: a center connection portion, a left connection portion horizontally connected to the center connection portion, and a right connection portion horizontally connected to the center connection portion, wherein the left connection portion includes a left extending portion extending downwardly from the left connection portion and forming a left connection space with the center connection space. The right connection portion includes a right extending portion extending upwardly from the right connection portion, and forming a right connection space with the center connection portion. When the left extending portion is embedded into the right connection space or the right extending portion is embedded into the left connection space, the present invention achieves self-winding.
    Type: Grant
    Filed: November 22, 2016
    Date of Patent: February 13, 2018
    Inventor: Wen-Cheng Liu
  • Patent number: 9718991
    Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.
    Type: Grant
    Filed: May 28, 2015
    Date of Patent: August 1, 2017
    Assignee: UWIZ TECHNOLOGY CO., LTD.
    Inventors: Yi Han Yang, Wen Cheng Liu, Ming Che Ho, Ming Hui Lu, Song Yuan Chang
  • Publication number: 20170148543
    Abstract: The present invention relates to a self-winding modular linear unit, which comprises: a center connection portion, a left connection portion horizontally connected to the center connection portion, and a right connection portion horizontally connected to the center connection portion, wherein the left connection portion includes a left extending portion extending downwardly from the left connection portion and forming a left connection space with the center connection space. The right connection portion includes a right extending portion extending upwardly from the right connection portion, and forming a right connection space with the center connection portion. When the left extending portion is embedded into the right connection space or the right extending portion is embedded into the left connection space, the present invention achieves self-winding or self-stacking in a row so as to form a variety of wire organizers.
    Type: Application
    Filed: November 22, 2016
    Publication date: May 25, 2017
    Inventor: Wen-Cheng LIU
  • Publication number: 20170149230
    Abstract: The present invention relates to a self winding linear unit. The linear unit is assembled from a center protruding body, a left-side protruding portion, and a right-side protruding portion, wherein the left-side protruding portion and the right-side protruding portion are respectively configured on the left and right sides of the center protruding body. Moreover, a spacing between the left and right-side protruding portions on a bottom portion of the center protruding body defines a holding space. When the center protruding body on one end of the linear unit is curved round and embedded in the holding space of its own main body, a self roll-up and winding cable arranger is achieved. When the center protruding body on one end of the linear unit is embedded in the holding space of another linear unit, then a plurality of the linear units may be stacked to form a tiered cable arranger.
    Type: Application
    Filed: November 22, 2016
    Publication date: May 25, 2017
    Inventor: Wen-Cheng LIU
  • Publication number: 20160347971
    Abstract: A chemical mechanical polishing slurry for polishing a stainless steel substrate is provided, which comprises a content 10˜50 wt % of abrasive particles, a content 0.001˜2.0 wt % of a coolant, a content 0.001˜1.0 wt % of an oxidant, a content 10˜5000 ppm of a lubricity improver, and a content 10˜5000 ppm of a foam inhibitor. A particle size of the abrasive particles is in a range of 20˜500 nm. The alkaline polishing slurry according to the present invention is capable of increasing the polishing performance, surface quality, and surface passivation effect after the chemical-mechanical polishing process.
    Type: Application
    Filed: May 28, 2015
    Publication date: December 1, 2016
    Applicant: UWIZ TECHNOLOGY CO.,LTD.
    Inventors: YI HAN YANG, WEN CHENG LIU, MING CHE HO, MING HUI LU, SONG YUAN CHANG
  • Publication number: 20150368515
    Abstract: Chemical-mechanical polishing (CMP) compositions and methods are described, which are suitable for polishing an aluminum surface. The compositions comprise alumina abrasive particles coated with an anionic polymer, and suspended in an acidic or neutral pH carrier. In some cases, a polishing aid such as silica, a carboxylic acid, a phosphonic acid compound, or a combination thereof may be added to the CMP compositions. The described CMP compositions and methods improve polishing efficacy and reduce surface imperfections on a polished aluminum surface compared to CMP methods using uncoated alumina abrasive.
    Type: Application
    Filed: June 18, 2015
    Publication date: December 24, 2015
    Inventors: Lung-Tai Lu, Wen-Cheng Liu, Jiu-Ching Chen
  • Patent number: 8889553
    Abstract: A method for polishing Through-Silicon Via (TSV) wafers is provided. The method comprises a step of subjecting the surface of a TSV wafer to a polishing treatment with a polishing composition containing an organic alkaline compound, an oxidizing agent selected from sodium chlorite and/or potassium bromate, silicon oxide abrasive particles, and a solvent to simultaneously remove Si and conductive materials at their respective removal rates. By using the method of this invention, Si and conductive materials can be simultaneously polished at higher removal rates to significantly save the necessary working-hour costs for polishing TSV wafers. A polishing composition used in the above method is also provided.
    Type: Grant
    Filed: September 16, 2010
    Date of Patent: November 18, 2014
    Assignee: Cabot Microelectronics Corporation
    Inventors: Kang-Hua Lee, Wen-Cheng Liu
  • Patent number: 8851266
    Abstract: The present invention provides a material distribution system and method thereof, comprising first, second and third conveyors, first, second, third and fourth material distribution paths, first and second material distribution rockers, and a movable material-distributing guide plate. Material conveyed on the second conveyor is delivered to the first or second material distribution rocker by switching the movable material-distributing guide plate, material conveyed on the first or second conveyor is delivered to the first or second material distribution path by switching the first material distribution rocker, and material conveyed on the second or third conveyor is delivered to the third or fourth material distribution path by switching the second material distribution rocker.
    Type: Grant
    Filed: June 7, 2013
    Date of Patent: October 7, 2014
    Assignee: Chan Li Machinery Co., Ltd.
    Inventor: Wen-Cheng Liu
  • Publication number: 20140216895
    Abstract: The present invention provides a material distribution system and method thereof, comprising first, second and third conveyors, first, second, third and fourth material distribution paths, first and second material distribution rockers, and a movable material-distributing guide plate. Material conveyed on the second conveyor is delivered to the first or second material distribution rocker by switching the movable material-distributing guide plate, material conveyed on the first or second conveyor is delivered to the first or second material distribution path by switching the first material distribution rocker, and material conveyed on the second or third conveyor is delivered to the third or fourth material distribution path by switching the second material distribution rocker.
    Type: Application
    Filed: June 7, 2013
    Publication date: August 7, 2014
    Inventor: WEN-CHENG LIU
  • Patent number: 8557006
    Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.
    Type: Grant
    Filed: April 26, 2012
    Date of Patent: October 15, 2013
    Assignee: Epoch Material Co., Ltd.
    Inventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen