Patents by Inventor Wen-Cheng Liu
Wen-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 8351194Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.Type: GrantFiled: December 29, 2010Date of Patent: January 8, 2013Assignee: Datavan International Corp.Inventors: Kang Ku, Hsien-Tang Liu, Wen-Cheng Liu
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Publication number: 20120270401Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.Type: ApplicationFiled: April 26, 2012Publication date: October 25, 2012Inventors: Hui-Fang HOU, Wen Cheng LIU, Yen-Liang CHEN, Jui-Ching CHEN
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Publication number: 20120170199Abstract: A mainframe structure includes a housing having a detachable front cover, and a circuit module accommodated in the housing. The circuit module includes a main circuit board affixed to the back side of the detachable front cover in vertical and carrying first and second electrical connectors, a chip (or chips) and memory devices, a functional circuit board horizontally mounted in the housing at the bottom side and having a first connection port connected to the first electrical connector of the main circuit board, and a display circuit board vertically mounted in the housing at the top side and having a second connection port connected to the second electrical connector of the main circuit board. The detachable design of the circuit module minimizes the sizes of the main circuit board and facilitates maintenance of the main circuit board.Type: ApplicationFiled: December 29, 2010Publication date: July 5, 2012Inventors: Kang Ku, Hsien-Tang Liu, Wen-Cheng Liu
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Publication number: 20120170233Abstract: A mainframe structure includes a housing having a front opening, flanges on one same plane around the front opening and stop members suspending on the inside corresponding to the flanges, a circuit module accommodated in the housing, and a cover detachably mounted in the front opening of the housing and stopped against the flanges and the stop member. The cover has two slots symmetrically disposed at two opposite lateral sides, two lugs respectively disposed adjacent to the slots and two handles respectively mounted in the slots and pivoted to the lugs in reversed directions. By means of biasing the two handles to stop against respective stop members, the user can detach the cover from the housing conveniently with the hands without any hand tools.Type: ApplicationFiled: December 29, 2010Publication date: July 5, 2012Inventors: Kang KU, Hsien-Tang Liu, Wen-Cheng Liu
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Patent number: 8167684Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.Type: GrantFiled: August 27, 2007Date of Patent: May 1, 2012Assignee: Cabot Microelectronics CorporationInventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen
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Patent number: 8067352Abstract: The invention relates to an aqueous cleaning composition for use in a cleaning process during or after a chemical mechanical planarization for a copper integrated circuit processing, comprising 0.05 to 20 wt % of a nitrogen-containing heterocyclic organic base, 0.05 to 50 wt % of an alcohol amine, 0.01-10 wt % of a quaternary ammonium hydroxide, and water. When used during or after the planarization process, the inventive cleaning composition of the invention can effectively remove residual contaminants from the surfaces of the wafers and simultaneously maintain a good surface roughness of the wafers.Type: GrantFiled: March 14, 2008Date of Patent: November 29, 2011Assignee: Epoch Material Co., Ltd.Inventors: Chien Ching Chen, Wen Cheng Liu, Tsung Hsien Chuang, Jui Ching Chen
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Patent number: 8063006Abstract: The invention relates to an aqueous cleaning composition for wafers with copper wires that have been treated by chemical mechanical planarization in an integrated circuit processing, comprising 0.1 to 15 wt % of a nitrogen-containing heterocyclic organic base, 0.1 to 35 wt % of an alcohol amine and water. Upon contact with copper-containing semiconductor wafers that have been treated by chemical mechanical planarization for an effective period of time, the aqueous cleaning composition can effectively remove residual contaminants from the surfaces of the wafers, and simultaneously provide the copper-containing semiconductor wafers with a better surface roughness.Type: GrantFiled: May 18, 2006Date of Patent: November 22, 2011Assignee: Epoch Material Co., Ltd.Inventors: Chien Ching Chen, Wen Cheng Liu, Jing-Chiuan Shiue, Teng Yan Huo
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Method for polishing through-silicon via (TSV) wafers and a polishing composition used in the method
Publication number: 20110070736Abstract: A method for polishing Through-Silicon Via (TSV) wafers is provided. The method comprises a step of subjecting the surface of a TSV wafer to a polishing treatment with a polishing composition containing an organic alkaline compound, an oxidizing agent selected from sodium chlorite and/or potassium bromate, silicon oxide abrasive particles, and a solvent to simultaneously remove Si and conductive materials at their respective removal rates. By using the method of this invention, Si and conductive materials can be simultaneously polished at higher removal rates to significantly save the necessary working-hour costs for polishing TSV wafers. A polishing composition used in the above method is also provided.Type: ApplicationFiled: September 16, 2010Publication date: March 24, 2011Inventors: Kang-Hua Lee, Wen-Cheng Liu -
Publication number: 20090170742Abstract: An aqueous cleaning composition for cleaning wafer contaminants after a chemical mechanical planarization process, includes: 0.1-20 wt % of an alkanolamine selected from the group consisting of 2-amino-1,3-propanediol, 2-amino-2-(hydroxymethyl)-1,3-propanediol, and combinations thereof; 0.05-20 wt % of a quaternary amine; and water. The cleaning composition is capable of removing efficiently residual contaminants from a polished surface of a wafer and imparting the wafer with a better surface roughness.Type: ApplicationFiled: August 19, 2008Publication date: July 2, 2009Applicant: EPOCH MATERIAL CO., LTD.Inventors: Tsung-Hsien Chuang, Chien-Ching Chen, Wen-Cheng Liu
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Patent number: 7550092Abstract: A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue inhibitor is selected from the group of compounds having the following formulas: and combinations thereof, wherein R1, R2, R3, and R4 are independently selected from H, C1-C6 alkyl, C2-C6 alkenyl, and C2-C6 alkylidyne; and R5, R6, R7, R8, R9, and R10 are independently selected from H and C1-C6 alkyl.Type: GrantFiled: June 19, 2006Date of Patent: June 23, 2009Assignee: Epoch Material Co., Ltd.Inventors: Hui-Fang Hou, Wen-Cheng Liu, Pao-Cheng Chen, Yen-Liang Chen, Jui-Ching Chen
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Publication number: 20090036343Abstract: The invention relates to an aqueous cleaning composition for use in a cleaning process during or after a chemical mechanical planarization for a copper integrated circuit processing, comprising 0.05 to 20 wt % of a nitrogen-containing heterocyclic organic base, 0.05 to 50 wt % of an alcohol amine, 0.01-10 wt % of a quaternary ammonium hydroxide, and water. When used during or after the planarization process, the inventive cleaning composition of the invention can effectively remove residual contaminants from the surfaces of the wafers and simultaneously maintain a good surface roughness of the wafers.Type: ApplicationFiled: March 14, 2008Publication date: February 5, 2009Applicant: Epoch Material Co., Ltd.Inventors: Chien Ching Chen, Wen Cheng Liu, Tsung Hsien Chuang, Jui Ching Chen
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Patent number: 7466693Abstract: A global communication internet telephone system is a new software Web Call structure, in which the system user only requires a computer with Windows 98® or above, a duplex sound card, a display interface and internet access, and logging directly into a GTD Web 800 web page thereafter, receiving a automatic number dispensing function and GTD automatic number skipping function. The characteristics of the system lies in that a signature which can be linked to the GTD Web 800 web pages for browsing is added into an e-mail of a user computer. As long as an e-mail receiver clicks on the signature file of the e-mail, he can be linked to the web pages and conduct a VoIP dialog with the e-mail sender. If a computer at a sending side is not powered on the sending side can freely choose whether to forward incoming calls to a designated cellular phone or local phone by automatically appointing a number.Type: GrantFiled: January 26, 2005Date of Patent: December 16, 2008Inventors: Erh-Jen Hou, Chun-Wei Lien, Guan-Hung Yeh, Er-Ta Ma, Ming-Shun Hsiao, Wen-Cheng Liu
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Publication number: 20080096470Abstract: A chemical mechanical polishing slurry for polishing a copper layer without excessively or destructively polishing a barrier layer beneath the copper layer is disclosed and includes an acid, a surfactant, and a silica sol having silica polishing particles that are surface modified with a surface charge modifier and that have potassium ions attached thereto. A method for preparing the chemical mechanical polishing slurry and a chemical mechanical polishing method using the chemical mechanical polishing slurry are also disclosed.Type: ApplicationFiled: August 27, 2007Publication date: April 24, 2008Applicant: EPOCH MATERIAL CO., LTD.Inventors: Hui-Fang Hou, Wen-Cheng Liu, Yen-Liang Chen, Jui-Ching Chen
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Publication number: 20070290165Abstract: A chemical mechanical polishing composition includes: an abrasive component, a corrosion inhibitor, a surfactant, a diacid compound, a metal residue inhibitor, and water. The metal residue inhibitor is selected from the group of compounds having the following formulas: and combinations thereof, wherein R1, R2, R3, and R4 are independently selected from H, C1-C6 alkyl, C2-C6 alkenyl, and C2-C6 alkylidyne; and R5, R6, R7, R8, R9, and R10 are independently selected from H and C1-C6 alkyl.Type: ApplicationFiled: June 19, 2006Publication date: December 20, 2007Applicant: Epoch Material Co., Ltd.Inventors: Hui-Fang Hou, Wen-Cheng Liu, Pao-Cheng Chen, Yen-Liang Chen, Jui-Ching Chen
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Publication number: 20060165061Abstract: A global communication internet telephone system is a new software Web Call structure, wherein the system user only requires a computer with Windows 98 or above, a duplex sound card, a display interface and internet access, and logging directly into a GTD Web 800 wed page thereafter, receiving a automatic number dispensing function and GTD automatic number skipping function. The characteristics of the system lies in that a signature which can be linked to the GTD Web800 web pages for browsing is added into an e-mail of a user computer. As long as an e-mail receiver clicks on the signature file of the e-mail, he can be linked to the web pages and conduct a VOID dialog with the e-mail sender. If a computer at a sending side is not power on, the sending side can freely choose whether to forward incoming calls to a designated cellular phone or local phone by automatically appointing a number.Type: ApplicationFiled: January 26, 2005Publication date: July 27, 2006Inventors: Erh-Jen Hou, Chun-Wei Lien, Guan-Hung Yeh, Er-Ta Ma, Ming-Shun Hsiao, Wen-Cheng Liu
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Publication number: 20060069781Abstract: A global communication internet telephone system and method is a new software Web Call structure, wherein the system user only requires a computer with Windows 98 or above, a duplex sound card, a display interface and internet access, and logging directly into a GTD Web 800 wed page thereafter, receiving a automatic number dispensing function and GTD automatic number skipping function.Type: ApplicationFiled: September 8, 2004Publication date: March 30, 2006Inventors: Erh-Jen Hou, Chun-Wei Lien, Guan-Hung Yeh, Er-Ta Ma, Ming-Shun Hsiao, Wen-Cheng Liu
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Publication number: 20050136669Abstract: The present invention relates to a chemical mechanical abrasive slurry for polishing a color photoresist, comprising composite abrasive particles and an aqueous medium. The abrasive slurry of the present invention can effectively polish off horn-like protuberances color filter processing.Type: ApplicationFiled: May 18, 2004Publication date: June 23, 2005Applicant: Eternal Chemical Co., Ltd.Inventors: Chia-Hao Lee, Wen-Cheng Liu, Deng-Yann Huoh
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Publication number: 20040202188Abstract: The invention herein relates to an IP (internet protocol) voice packet network voice system, wherein a plurality of IP servers is capable of data sharing, mutual support and compatible to a variety of medium servers. Said voice packet is transmitted in the point to point internet mode to individual voice terminals where a plurality of (internet) add-on medium servers will provide specific function in accordance with the voice packet.Type: ApplicationFiled: April 14, 2003Publication date: October 14, 2004Applicant: CaManGi CorporationInventors: Erh-Jen Hou, Wen-Cheng Liu, Er-Ta Ma, Ming-Shun Hsiao, Chun-Wei Lien