Abstract: Disclosed are a feedblock multiplier with thickness gradient variation, a feedblock system, a method, and multilayer structure made by the method. The feedblock multiplier combines the functionalities of feedblock and multiplier conventionally used for producing the multilayer structure. The feedblock multiplier includes an input section for feeding fluid materials. A feedblock section is included for dividing the fluid delivered into multiple channels correspondingly. The fluids in the channels are segmented into two or more fluid segments by a segmenting section. The each fluid segment is delivered through corresponding channel-conversion section with thickness-gradient variation in the feedblock multiplier. Each channel-conversion section includes multiple channels with configurable positions. The fluids are then combined in a multiplier section for producing the multilayer structure with overlapped layers. The multilayer structure is outputted from an extruding section.

Abstract: A measuring device for measuring a response speed of a display panel is provided. The measuring device includes a microcontroller and at least one photo sensor. The microcontroller provides a control command, according to which a display controller of the display panel provides test pattern to the display panel. The photo sensor senses a test frame displayed corresponding to the test pattern by the display panel, and provides a corresponding sensing signal associated with brightness and a response signal. According to the response signal, the response speed of the display panel is calculated.

Abstract: A measuring device for measuring a response speed of a display panel is provided. The measuring device includes a microcontroller and at least one photo sensor. The microcontroller provides a control command, according to which a display controller of the display panel provides test pattern to the display panel. The photo sensor senses a test frame displayed corresponding to the test pattern by the display panel, and provides a corresponding sensing signal associated with brightness and a response signal. According to the response signal, the response speed of the display panel is calculated.

Abstract: Disclosed are a feedblock multiplier with thickness gradient variation, a feedblock system, a method, and multilayer structure made by the method. The feedblock multiplier combines the functionalities of feedblock and multiplier conventionally used for producing the multilayer structure. The feedblock multiplier includes an input section for feeding fluid materials. A feedblock section is included for dividing the fluid delivered into multiple channels correspondingly. The fluids in the channels are segmented into two or more fluid segments by a segmenting section. The each fluid segment is delivered through corresponding channel-conversion section with thickness-gradient variation in the feedblock multiplier. Each channel-conversion section includes multiple channels with configurable positions. The fluids are then combined in a multiplier section for producing the multilayer structure with overlapped layers. The multilayer structure is outputted from an extruding section.

Abstract: The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance.

Abstract: The present invention relates to a method for manufacturing a chip resistor having a low resistance. The method includes the following steps: (a) providing a substrate having a top surface; (b) sputtering a conducting layer directly on the top surface of the substrate, so that the conducting layer and the substrate contact each other, wherein the material of the conducting layer comprises nickel or copper; and (c) plating at least one metal layer directly on the conducting layer, so that the metal layer and the conducting layer contact each other, wherein the material of the metal layer comprises nickel or copper, and the conducting layer and the metal layer provide a resistive layer. As a result, the resistive layer has a precise pattern, and the duration of sputtering is reduced, so the yield rate and the efficiency are improved and the manufacturing cost is cut down.

Abstract: The present invention relates to a chip resistor and method for making the same. The chip resistor includes a substrate, a pair of bottom electrodes, a resistive film, a pair of main upper electrodes, a first protective coat, a pair of barrier layers, a second protective coat, a pair of side electrodes and at least one plated layer. The first protective coat is disposed over the resistive film, and covers part of the main upper electrodes. The barrier layers are disposed on the main upper electrodes, and cover part of the first protective coat. The second protective coat is disposed on the first protective coat, and covers part of the barrier layers. The plated layers cover the barrier layers, the bottom electrodes and the side electrodes. As a result, the chip resistor features high corrosion resistance.

Abstract: A holding device includes a receptacle having a base and an upper frame each of which includes four side grooves and four socket openings and four anchor members, four posts secured between the base and the upper frame with latch devices, and four boards engaged between the base and the upper frame and the posts, the upper frame and the posts and the boards may be disassembled from the base for allowing holding device to be disassembled to a compact folding structure that is excellent for the storing and the transportation purposes. The posts each may include a backup panel and two beams secured together that may also be disassembled from each other.

Abstract: A drug counter comprises a body having an upper utensil and a lower utensil; a surface of the upper utensil having a plurality of drug holes; one side of the lower utensil having an opening for receiving the sliding plate; a sliding plate being insertable into the lower utensil from the opening at one side of the body; the sliding plate resisting against a lower side of the drug holes of the upper utensil. In use, the drugs are placed upon a surface of the upper utensil. The surplus drugs are driven to the upper utensil. The sliding plate can be driven to move according to the amount of the drugs so that the drugs in the drug holes fall into the lower utensil. The drugs falling into the lower utensil further fall into the drug bag so as to count the number of the drugs.

Abstract: A pulsed voltage surges resistant enamelled wire comprises a metal conductive wire and at least one shield layer outside the wire, the shield layer is provided by a coating composition comprising (a) a synthetic resin, (b) an organic solvent and (c) metal oxide particles, wherein the metal oxide particles comprise &agr;-form Al2O3 particles, &ggr;-form Al2O3 particles and transition metal oxide particles.

Abstract: A high frequency-resistant thermosetting coating is provided for the manufacture of high frequency-resistant enamelled wires. A high frequency-resistant enamelled wire produced from the high frequency-resistant thermosetting coating is also provided. The adhesion, crosslinking density, abrasion resistance, and softening resistance of the coating are excellent. With the same nominal diameter and a coating thickness more than 85 &mgr;m, the high frequency resistant lifetime of the enamelled wire produced from the high frequency-resistant thermosetting coating is 3 to 4 times as that of conventional thermoplastic enamelled wires.

Abstract: A pulsed voltage surges resistant enamelled wire comprises a metal conductive wire and at least one shield layer outside the wire, the at least one shield layer is provided by a coating composition comprising (a) a synthetic resin, (b) an organic solvent and (c) &agr;-form Al2O3 particles and &ggr;-form Al2O3 particles.

Abstract: A high temperature resistant colored enamel wire comprises a metal conductive wire and at least one colored coating layer outside the wire, the at least one colored coating layer is provided by a coating composition comprising (a) a synthetic resin, (b) an organic solvent and (c) an inorganic pigment. In addition to having good appearance and uniform color, the high temperature resistant colored enamel wire can provide the temperature resistance and insulation properties meeting the requirements of the art.