Patents by Inventor Wen-Chieh Lee

Wen-Chieh Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9377920
    Abstract: An electromagnetic induction panel structure includes a multilayer substrate, a first cover unit and a second cover unit. The multilayer substrate includes a first outermost lateral conductive layer and a second outermost lateral conductive layer respectively disposed on two opposite outermost surfaces thereof. The first cover unit is disposed on the first outermost lateral conductive layer. The second cover unit is disposed on the second outermost lateral conductive layer. For example, the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer for directly contacting the first outermost lateral conductive layer. The second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer for directly contacting the second outermost lateral conductive layer.
    Type: Grant
    Filed: July 2, 2013
    Date of Patent: June 28, 2016
    Assignee: Wacom Co., Ltd.
    Inventors: Wen-Chieh Lee, Chia-Jui Yeh, Shang-Jen Hsu
  • Patent number: 9267311
    Abstract: A lock structure includes a mounting plate, a positioning member, an escutcheon and a constraining member, wherein the mounting plate comprises a ring wall, guiding slot and a limiting slot, and the escutcheon comprises a limiting protrusion. The positioning member is disposed in the limiting slot and clamped between the escutcheon and the constraining member. The limiting protrusion penetrates the guiding slot of the escutcheon and is constrained inside the limiting slot. The limiting protrusion of the escutcheon is blockable by the constraining member to prevent the rotating escutcheon from separation from the mounting plate.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: February 23, 2016
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Patent number: 9175499
    Abstract: A handle assembly of a lock includes a handle, a sleeve, a stopper and an engaging member, wherein the handle comprises an accommodating slot, a lodge hole and a penetrating hole. The sleeve is disposed at the accommodating slot along the direction of a major axis and comprises a through hole. The stopper is disposed at the sleeve and protrudes to the sleeve via the through hole of the sleeve. Owing to the through hole corresponded to the lodge hole, the stopper is lodged in the lodge hole of the handle. The engaging member is disposed in the accommodating slot and adjustably movable along the direction of a transverse axis so that the handle and the sleeve are steadily engaged from each other.
    Type: Grant
    Filed: February 14, 2014
    Date of Patent: November 3, 2015
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Patent number: 9115509
    Abstract: An adjustable button apparatus of a lock includes an adjusting sleeve, a transmission rod, a driving plate and a positioning pin, the adjusting sleeve is movable between a positioning position and an adjusting position. When the adjusting sleeve is located at the positioning position, the adjusting sleeve presses the positioning pin and makes the positioning pin engaged with the transmission rod and the driving plate, when the adjusting sleeve is located at the adjusting position, the positioning pin separates apart from the driving plate to make the driving plate transversely movable in the transmission rod. Via the positioning pin inserted at various positions of the driving plate for adjusting a joint length formed by jointing the transmission rod and the driving plate, the lock is applicable for installation in doors of various door thicknesses.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: August 25, 2015
    Assignee: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Publication number: 20150181154
    Abstract: The present invention discloses a method for playing a video, which includes the following steps: a selected video is played on a first display unit through a video player. A corresponding script related to the selected video is received through a handheld electrical device. A currently playing time of the selected video is received through the handheld electrical device from the video player. Metadata, which is related to the corresponding script and has a plurality of time stamps, is played through a second display unit of the handheld electrical device according to the currently playing time. During a process that the selected video is played on the first display unit, the handheld electrical device is utilized to re-receive the currently playing time of the selected video from the video player at a preset time interval.
    Type: Application
    Filed: March 20, 2014
    Publication date: June 25, 2015
    Applicant: COMPAL ELECTRONICS, INC.
    Inventors: Wen-Chieh LEE, Ching-Hsiang LIN, Chiao-Chih CHANG
  • Publication number: 20140347313
    Abstract: An electromagnetic induction panel structure includes a multilayer substrate, a first cover unit and a second cover unit. The multilayer substrate includes a first outermost lateral conductive layer and a second outermost lateral conductive layer respectively disposed on two opposite outermost surfaces thereof. The first cover unit is disposed on the first outermost lateral conductive layer. The second cover unit is disposed on the second outermost lateral conductive layer. For example, the first cover unit includes a first insulating layer directly formed on the first outermost lateral conductive layer for directly contacting the first outermost lateral conductive layer. The second cover unit includes a second insulating layer directly formed on the second outermost lateral conductive layer for directly contacting the second outermost lateral conductive layer.
    Type: Application
    Filed: July 2, 2013
    Publication date: November 27, 2014
    Inventors: WEN-CHIEH LEE, CHIA-JUI YEH, SHANG-JEN HSU
  • Publication number: 20140319858
    Abstract: A lock structure includes a mounting plate, a positioning member, an escutcheon and a constraining member, wherein the mounting plate comprises a ring wall, guiding slot and a limiting slot, and the escutcheon comprises a limiting protrusion. The positioning member is disposed in the limiting slot and clamped between the escutcheon and the constraining member. The limiting protrusion penetrates the guiding slot of the escutcheon and is constrained inside the limiting slot. The limiting protrusion of the escutcheon is blockable by the constraining member to prevent the rotating escutcheon from separation from the mounting plate.
    Type: Application
    Filed: February 14, 2014
    Publication date: October 30, 2014
    Applicant: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Publication number: 20140290427
    Abstract: A handle assembly of a lock includes a handle, a sleeve, a stopper and an engaging member, wherein the handle comprises an accommodating slot, a lodge hole and a penetrating hole. The sleeve is disposed at the accommodating slot along the direction of a major axis and comprises a through hole. The stopper is disposed at the sleeve and protrudes to the sleeve via the through hole of the sleeve. Owing to the through hole corresponded to the lodge hole, the stopper is lodged in the lodge hole of the handle. The engaging member is disposed in the accommodating slot and adjustably movable along the direction of a transverse axis so that the handle and the sleeve are steadily engaged from each other.
    Type: Application
    Filed: February 14, 2014
    Publication date: October 2, 2014
    Applicant: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Publication number: 20140238180
    Abstract: An adjustable button apparatus of a lock includes an adjusting sleeve, a transmission rod, a driving plate and a positioning pin, the adjusting sleeve is movable between a positioning position and an adjusting position. When the adjusting sleeve is located at the positioning position, the adjusting sleeve presses the positioning pin and makes the positioning pin engaged with the transmission rod and the driving plate, when the adjusting sleeve is located at the adjusting position, the positioning pin separates apart from the driving plate to make the driving plate transversely movable in the transmission rod. Via the positioning pin inserted at various positions of the driving plate for adjusting a joint length formed by jointing the transmission rod and the driving plate, the lock is applicable for installation in doors of various door thicknesses.
    Type: Application
    Filed: March 15, 2013
    Publication date: August 28, 2014
    Applicant: TAIWAN FU HSING INDUSTRIAL CO., LTD.
    Inventors: Chao-Ming Huang, Wen-Chieh Lee
  • Patent number: 8362588
    Abstract: A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
    Type: Grant
    Filed: June 13, 2011
    Date of Patent: January 29, 2013
    Assignee: Megica Corporation
    Inventors: Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou, Jin-Yuan Lee
  • Patent number: 8338969
    Abstract: A serial advanced technology attachment (SATA) interface storage device. The SATA interface storage device can be used in cooperation with an electrical apparatus and comprises a substrate, a chip set, a SATA interface and a shell. The substrate has a first surface, a second surface corresponding to the first surface and a plurality of connectors between the first surface and the second surface. The chip set is disposed on the first surface. The SATA interface is disposed on the second surface and is electrically connected to the chip set via a part of the connectors so that the electrical apparatus may be electrically connected to the chip set via the SATA interface to access the chip set. The shell has a width and a thickness and defines a receiving space for receiving the substrate, the chip set and the SATA interface, where the width and the thickness conform to a micro-memory card standard.
    Type: Grant
    Filed: January 27, 2010
    Date of Patent: December 25, 2012
    Assignee: Waltop International Corp.
    Inventors: I-An Chen, Wen-Chieh Lee
  • Publication number: 20110233776
    Abstract: A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
    Type: Application
    Filed: June 13, 2011
    Publication date: September 29, 2011
    Applicant: MEGICA CORPORATION
    Inventors: Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou, Jin-Yuan Lee
  • Patent number: 7985653
    Abstract: A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
    Type: Grant
    Filed: November 24, 2008
    Date of Patent: July 26, 2011
    Assignee: Megica Corporation
    Inventors: Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou, Jin-Yuan Lee
  • Publication number: 20110029708
    Abstract: A serial advanced technology attachment (SATA) interface storage device. The SATA interface storage device can be used in cooperation with an electrical apparatus and comprises a substrate, a chip set, a SATA interface and a shell. The substrate has a first surface, a second surface corresponding to the first surface and a plurality of connectors between the first surface and the second surface. The chip set is disposed on the first surface. The SATA interface is disposed on the second surface and is electrically connected to the chip set via a part of the connectors so that the electrical apparatus may be electrically connected to the chip set via the SATA interface to access the chip set. The shell has a width and a thickness and defines a receiving space for receiving the substrate, the chip set and the SATA interface, where the width and the thickness conform to a micro-memory card standard.
    Type: Application
    Filed: January 27, 2010
    Publication date: February 3, 2011
    Applicant: MEMOCOM CORP.
    Inventors: I-An Chen, Wen-Chieh Lee
  • Publication number: 20090104769
    Abstract: A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
    Type: Application
    Filed: November 24, 2008
    Publication date: April 23, 2009
    Applicant: MEGICA CORPORATION
    Inventors: Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou, Jin-Yuan Lee
  • Patent number: 7470927
    Abstract: A method for fabricating a circuitry component includes providing a semiconductor substrate, a first coil over said semiconductor substrate, a passivation layer over said first coil; and depositing a second coil over said passivation layer and over said first coil. Said second coil may be deposited by forming a first metal layer over said passivation layer, forming a pattern defining layer over said first metal layer, a first opening in said pattern defining layer exposing said first metal layer, forming a second metal layer over said first metal layer exposed by said first opening, removing said pattern defining layer, and removing said first metal layer not under said second metal layer.
    Type: Grant
    Filed: May 17, 2006
    Date of Patent: December 30, 2008
    Assignee: Megica Corporation
    Inventors: Wen-Chieh Lee, Mou-Shiung Lin, Chien-Kang Chou, Yi-Cheng Liu, Chiu-Ming Chou, Jin-Yuan Lee
  • Patent number: 7457522
    Abstract: A system and method of a DVD player for displaying multiple subtitles includes a loading platform for reading digital data of DVD storage media; an interface management platform of receiving end for transmitting a decoded message of a first subtitle set image to a comparison platform. The comparison platform is for checking whether control signal of the first subtitle set image from the loading platform exists in an accumulator register. If not, the digital data is analyzed and decoded through an analytic platform and a decoder platform according to an identifying code of data flow and the first subtitle set image control signal. Then a mixed digital video signal and a digital audio signal are outputted by an image construct platform and an output platform.
    Type: Grant
    Filed: January 7, 2005
    Date of Patent: November 25, 2008
    Assignee: Corel TW Corp.
    Inventors: Eldon Liu, Wen-Chieh Lee
  • Patent number: 7433996
    Abstract: A method for operating a memory device that comprises periodically generating a refresh request signal for performing a refresh operation, providing an access request signal for performing an access operation, performing the refresh operation if the refresh request signal occurs prior to the access request signal, and performing the access operation if the access request signal occurs prior to the refresh request signal.
    Type: Grant
    Filed: July 1, 2004
    Date of Patent: October 7, 2008
    Assignee: MEMOCOM Corp.
    Inventors: Hong-Gee Fang, Wen-Chieh Lee, Wei-Chieh Wu
  • Publication number: 20080109215
    Abstract: High frequency components of audio signals are reconstructed from the aspects of envelope and fine detail. The envelopes of the high frequency components are found through linear extrapolation of signals with frequencies lower than a cutoff frequency point. One method of reconstructing high frequency components is based on the linear extrapolation on the logarithm scale magnitudes of the transform coefficients of the audio signal in a frequency domain. The linear extrapolation is a linear approximation based on minimizing least squares of the logarithm scale magnitudes of the transform coefficients of the low frequency components. Another method is based on the linear extrapolation on the logarithm scale magnitudes of the envelope elements of the filterbank signals of the audio signal over a time segment. The linear extrapolation is a linear approximation based on minimizing least squares of the logarithm scale magnitudes of the envelope elements of the low frequency filterbank signals.
    Type: Application
    Filed: June 26, 2006
    Publication date: May 8, 2008
    Inventors: Chi-min Liu, Wen-chieh Lee, Han-Wen Hsu
  • Publication number: 20080074914
    Abstract: A memory device comprises a first memory cell and a second memory cell. The first memory cell includes a first transistor coupled to a bit line and the second memory cell includes a second transistor coupled to a bit line bar. The first transistor includes a first gate terminal coupled to a first word line. The second transistor includes a second gate terminal coupled to a second word line. The first transistor and the second transistor are controlled by the first word line and the second word line respectively. A first sense amplifier having an asymmetric configuration is coupled to the bit line and the bit line bar and is capable to sense a status of at least one of the bit line and the bit line bar.
    Type: Application
    Filed: September 21, 2007
    Publication date: March 27, 2008
    Applicant: MEMOCOM CORP.
    Inventors: Hong-Gee FANG, Wen-Chieh LEE, Ching-Wen CHEN, Chih-Yuan CHENG, Chung-Cheng WU