Patents by Inventor Wen-Chieh Wu

Wen-Chieh Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12015023
    Abstract: An integrated circuit package and a method of forming the same are provided. The method includes attaching an integrated circuit die to a first substrate. A dummy die is formed. The dummy die is attached to the first substrate adjacent the integrated circuit die. An encapsulant is formed over the first substrate and surrounding the dummy die and the integrated circuit die. The encapsulant, the dummy die and the integrated circuit die are planarized, a topmost surface of the encapsulant being substantially level with a topmost surface of the dummy die and a topmost surface of the integrated circuit die. An interior portion of the dummy die is removed. A remaining portion of the dummy die forms an annular structure.
    Type: Grant
    Filed: June 23, 2021
    Date of Patent: June 18, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Yushun Lin, Heh-Chang Huang, Hsing-Kuo Hsia, Chih-Chieh Hung, Ying-Ching Shih, Chin-Fu Kao, Wen-Hsin Wei, Li-Chung Kuo, Chi-Hsi Wu, Chen-Hua Yu
  • Publication number: 20240170506
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first pixel region and a second pixel region within a substrate. A first recess region is disposed along a back-side of the substrate within the first pixel region. The back-side of the substrate within the first pixel region is asymmetric about a center of the first pixel region in a cross-sectional view. A second recess region is disposed along the back-side of the substrate and within the second pixel region. The back-side of the substrate within the second pixel region is asymmetric about a center of the second pixel region in the cross-sectional view. The first recess region and the second recess region are substantially symmetric about a vertical line laterally between the first pixel region and the second pixel region.
    Type: Application
    Filed: February 1, 2024
    Publication date: May 23, 2024
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11982866
    Abstract: An optical element driving mechanism is provided and includes a fixed assembly, a movable assembly, a driving assembly and a stopping assembly. The fixed assembly has a main axis. The movable assembly is configured to connect an optical element, and the movable assembly is movable relative to the fixed assembly. The driving assembly is configured to drive the movable assembly to move relative to the fixed assembly. The stopping assembly is configured to limit the movement of the movable assembly relative to the fixed assembly within a range of motion.
    Type: Grant
    Filed: December 15, 2022
    Date of Patent: May 14, 2024
    Assignee: TDK TAIWAN CORP.
    Inventors: Chao-Chang Hu, Liang-Ting Ho, Chen-Er Hsu, Yi-Liang Chan, Fu-Lai Tseng, Fu-Yuan Wu, Chen-Chi Kuo, Ying-Jen Wang, Wei-Han Hsia, Yi-Hsin Tseng, Wen-Chang Lin, Chun-Chia Liao, Shou-Jen Liu, Chao-Chun Chang, Yi-Chieh Lin, Shang-Yu Hsu, Yu-Huai Liao, Shih-Wei Hung, Sin-Hong Lin, Kun-Shih Lin, Yu-Cheng Lin, Wen-Yen Huang, Wei-Jhe Shen, Chih-Shiang Wu, Sin-Jhong Song, Che-Hsiang Chiu, Sheng-Chang Lin
  • Publication number: 20240118477
    Abstract: A backlight module includes a back board, a lamp board, a wavelength conversion film, an optical film, a coating layer and a reflective component. The back board includes a side wall. The lamp board is arranged on the back board, and includes plural light emitting units. The wavelength conversion film is arranged on the light emitting units. The optical film is arranged on the wavelength conversion film. The coating layer is arranged on the optical film, and adjacent to the optical film. The reflective component is arranged between the side wall and the optical film, and surrounds the wavelength conversion film and the optical film. At an optical wavelength of 450 nanometers, a brightness of a first surface of the reflective component is between 70 and 100, a first chromaticity thereof is between ?10 and 10, and a second chromaticity thereof is between ?10 and 10.
    Type: Application
    Filed: September 11, 2023
    Publication date: April 11, 2024
    Inventors: Ling-Chieh SHEN, Ting-Ying WU, Yang-Ruei LI, Wen-Yu LIN
  • Publication number: 20240113143
    Abstract: Various embodiments of the present disclosure are directed towards an imaging device including a first image sensor element and a second image sensor element respectively comprising a pixel unit disposed within a semiconductor substrate. The first image sensor element is adjacent to the second image sensor element. A first micro-lens overlies the first image sensor element and is laterally shifted from a center of the pixel unit of the first image sensor element by a first lens shift amount. A second micro-lens overlies the second image sensor element and is laterally shifted from a center of the pixel unit of the second image sensor element by a second lens shift amount different from the first lens shift amount.
    Type: Application
    Filed: January 6, 2023
    Publication date: April 4, 2024
    Inventors: Cheng Yu Huang, Wen-Hau Wu, Chun-Hao Chuang, Keng-Yu Chou, Wei-Chieh Chiang, Chih-Kung Chang
  • Publication number: 20240088182
    Abstract: In some embodiments, an image sensor is provided. The image sensor includes a photodetector disposed in a semiconductor substrate. A wave guide filter having a substantially planar upper surface is disposed over the photodetector. The wave guide filter includes a light filter disposed in a light filter grid structure. The light filter includes a first material that is translucent and has a first refractive index. The light filter grid structure includes a second material that is translucent and has a second refractive index less than the first refractive index.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Cheng Yu Huang, Chun-Hao Chuang, Chien-Hsien Tseng, Kazuaki Hashimoto, Keng-Yu Chou, Wei-Chieh Chiang, Wen-Chien Yu, Ting-Cheng Chang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11923386
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes a first photodetector disposed in a first pixel region of a semiconductor substrate and a second photodetector disposed in a second pixel region of the semiconductor substrate. The second photodetector is laterally separated from the first photodetector. A first diffuser is disposed along a back-side of the semiconductor substrate and over the first photodetector. A second diffuser is disposed along the back-side of the semiconductor substrate and over the second photodetector. A first midline of the first pixel region and a second midline of the second pixel region are both disposed laterally between the first diffuser and the second diffuser.
    Type: Grant
    Filed: April 24, 2023
    Date of Patent: March 5, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Keng-Yu Chou, Chun-Hao Chuang, Kazuaki Hashimoto, Wei-Chieh Chiang, Cheng Yu Huang, Wen-Hau Wu, Chih-Kung Chang
  • Patent number: 11904399
    Abstract: An online prediction method of tool-electrode consumption adapted for an electrical discharge machining (EDM) apparatus includes an experimental design; extracting electrode consumption variables from machining parameters of the electrical discharge machining (EDM) apparatus; and obtaining a correlation between the machining parameters and the electrode consumption variables through a correlation analysis to obtain a prediction model capable of predicting an effective contact area of a tool-electrode and a workpiece. In addition, a prediction method of machining accuracy is provided.
    Type: Grant
    Filed: November 30, 2020
    Date of Patent: February 20, 2024
    Assignee: Metal Industries Research & Development Centre
    Inventors: Chia-Ming Jan, Wen-Chieh Wu
  • Patent number: 11670853
    Abstract: An antenna structure includes a ground element, a dielectric substrate, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a seventh radiation element. The dielectric substrate has a first surface and a second surface. The first radiation element and the third radiation element are coupled to a first feeding point. The second radiation element and the fourth radiation element are coupled to the ground element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are on the first surface. The fifth radiation element is coupled to a second feeding point. The sixth radiation element and the seventh radiation element are coupled to the fifth radiation element. The fifth radiation element, the sixth radiation element, and the seventh radiation element are on the second surface.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: June 6, 2023
    Assignee: WISTRON CORP.
    Inventors: Yu-Liang Wang, Yu-Chia Chang, Jung-Chin Hsieh, Wen-Chieh Wu
  • Patent number: 11646195
    Abstract: The present application discloses a method for fabricating the semiconductor device including providing a substrate in a reaction chamber, forming an untreated silicon nitride film on the substrate, and forming a treated silicon nitride film on the untreated silicon nitride film. Forming the untreated silicon nitride film includes the steps of: (a) supplying a first silicon precursor into the reaction chamber, thereby allowing chemical species from the first silicon precursor to be adsorbed on the substrate, and (b) supplying a first nitrogen precursor into the reaction chamber, thereby nitriding the chemical species to deposit resultant silicon nitride. The step (a) and the step (b) are sequentially and repeatedly performed to form the untreated silicon nitride film.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: May 9, 2023
    Assignee: NANYA TECHNOLOGY CORPORATION
    Inventors: Shih-En Lin, Wei-Zeng Wu, Wei-Lun Zeng, Wen-Chieh Wu
  • Patent number: 11550210
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and/or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: January 10, 2023
    Assignee: MEGA1 COMPANY LTD.
    Inventors: Makoto Masuda, Wen-Chieh Wu, Chang-Wei Huang, Chia-Yu Chang, Chih-Han Yen, Chih-Yu Yang
  • Patent number: 11491565
    Abstract: The present invention is a probe forming device, the probe forming device comprises a spinning shaft, a first adjusting structure, a second adjusting structure, an electrolyte conveying member and a power supply. One of the holding member of the spinning shaft holds a workpiece, and a driving member drives the workpiece to move and abut the first adjusting structure and the second modulating structure. The electrolyte conveying member conveys an electrolyte to the workpiece, the first adjusting structure and the second adjusting structure, and is electrically connected. At least one positive end of the power supply is connected to the workpiece or the spinning shaft, and at least one negative end is connected to the first adjusting structure and the second modulating structure.
    Type: Grant
    Filed: December 23, 2019
    Date of Patent: November 8, 2022
    Assignee: Metal Industries Research & Development Centre
    Inventors: Wen-Chieh Wu, Zhi-Wen Fan, Chun-Wei Chen, Tzu-Hung Chen
  • Publication number: 20220319909
    Abstract: The present disclosure provides a method for manufacturing a semiconductor memory device. Because the present method includes applying a dopant-implanted layer on a semiconductor memory substrate before growing a silicon nitride layer on the substrate, the silicon nitride layer can be grown at an increased rate. The present disclosure avoids a problem encountered in the prior art wherein a seam having a greater length contacts an edge of a contact plug of a semiconductor memory device. Hence, a leakage problem at subsequent operations of semiconductor manufacture can be avoided, and the product yield can be significantly improved.
    Type: Application
    Filed: April 1, 2021
    Publication date: October 6, 2022
    Inventors: CHING-LIANG KAO, WEN-CHIEH WU, LI-LING KE
  • Patent number: 11454717
    Abstract: A multi-object tracking method includes generating multi-dimensional physical characterization data associated with a plurality of objects; simplifying the multi-dimensional physical characterization data to reduce at least one dimension thereof, thereby resulting in a simplified data set; and tracking by comparing a current simplified data set and a stored data set in a database. If the current simplified data set conforms to the stored data set in the database, a proper operation is correspondingly performed; otherwise the current simplified data set is defined as a new event and stored in the database.
    Type: Grant
    Filed: September 25, 2018
    Date of Patent: September 27, 2022
    Assignee: Wistron Corporation
    Inventors: Fang-Ming Wu, Wen-Chieh Wu
  • Publication number: 20220255226
    Abstract: An antenna structure includes a ground element, a dielectric substrate, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a seventh radiation element. The dielectric substrate has a first surface and a second surface. The first radiation element and the third radiation element are coupled to a first feeding point. The second radiation element and the fourth radiation element are coupled to the ground element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are on the first surface. The fifth radiation element is coupled to a second feeding point. The sixth radiation element and the seventh radiation element are coupled to the fifth radiation element. The fifth radiation element, the sixth radiation element, and the seventh radiation element are on the second surface.
    Type: Application
    Filed: March 22, 2021
    Publication date: August 11, 2022
    Inventors: Yu-Liang WANG, Yu-Chia CHANG, Jung-Chin HSIEH, Wen-Chieh WU
  • Patent number: 11402733
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
    Type: Grant
    Filed: May 28, 2021
    Date of Patent: August 2, 2022
    Assignee: MEGA1 COMPANY LTD.
    Inventors: Makoto Masuda, Wen-Chieh Wu, Hsiang-Chen Ho, Chih-Han Yen, Chih-Yu Yang
  • Publication number: 20220168834
    Abstract: An online prediction method of tool-electrode consumption adapted for an electrical discharge machining (EDM) apparatus includes an experimental design; extracting electrode consumption variables from machining parameters of the electrical discharge machining (EDM) apparatus; and obtaining a correlation between the machining parameters and the electrode consumption variables through a correlation analysis to obtain a prediction model capable of predicting an effective contact area of a tool-electrode and a workpiece. In addition, a prediction method of machining accuracy is provided.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Applicant: Metal Industries Research & Development Centre
    Inventors: Chia-Ming Jan, Wen-Chieh Wu
  • Publication number: 20220130657
    Abstract: The present application discloses a method for fabricating the semiconductor device including providing a substrate in a reaction chamber, forming an untreated silicon nitride film on the substrate, and forming a treated silicon nitride film on the untreated silicon nitride film. Forming the untreated silicon nitride film includes the steps of: (a) supplying a first silicon precursor into the reaction chamber, thereby allowing chemical species from the first silicon precursor to be adsorbed on the substrate, and (b) supplying a first nitrogen precursor into the reaction chamber, thereby nitriding the chemical species to deposit resultant silicon nitride. The step (a) and the step (b) are sequentially and repeatedly performed to form the untreated silicon nitride film.
    Type: Application
    Filed: October 22, 2020
    Publication date: April 28, 2022
    Inventors: Shih-En LIN, Wei-Zeng WU, Wei-Lun ZENG, Wen-Chieh WU
  • Publication number: 20210373419
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and/or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventors: MAKOTO MASUDA, WEN-CHIEH WU, CHANG-WEI HUANG, CHIA-YU CHANG, CHIH-HAN YEN, CHIH-YU YANG
  • Publication number: 20210373420
    Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.
    Type: Application
    Filed: May 28, 2021
    Publication date: December 2, 2021
    Inventors: MAKOTO MASUDA, WEN-CHIEH WU, HSIANG-CHEN HO, CHIH-HAN YEN, CHIH-YU YANG