Abstract: A hardware-in-the-loop (HIL) simulation device is provided, which includes a processing circuit and a pulse-width modulation (PWM) signal observation circuit. The PWM signal observation circuit includes an energy storage unit and the energy storage unit is coupled to the processing circuit. A signal source transmits a PWM signal to the processing circuit and the PWM signal observation circuit, and the energy storage unit is charged when the PWM signal is at high level. The processing circuit detects the voltage of the energy storage unit when detecting the falling edge of the PWM signal so as to calculate the duty cycle of the PWM signal.

Abstract: An online prediction method of tool-electrode consumption adapted for an electrical discharge machining (EDM) apparatus includes an experimental design; extracting electrode consumption variables from machining parameters of the electrical discharge machining (EDM) apparatus; and obtaining a correlation between the machining parameters and the electrode consumption variables through a correlation analysis to obtain a prediction model capable of predicting an effective contact area of a tool-electrode and a workpiece. In addition, a prediction method of machining accuracy is provided.

Abstract: An antenna structure includes a ground element, a dielectric substrate, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a seventh radiation element. The dielectric substrate has a first surface and a second surface. The first radiation element and the third radiation element are coupled to a first feeding point. The second radiation element and the fourth radiation element are coupled to the ground element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are on the first surface. The fifth radiation element is coupled to a second feeding point. The sixth radiation element and the seventh radiation element are coupled to the fifth radiation element. The fifth radiation element, the sixth radiation element, and the seventh radiation element are on the second surface.

Abstract: The present application discloses a method for fabricating the semiconductor device including providing a substrate in a reaction chamber, forming an untreated silicon nitride film on the substrate, and forming a treated silicon nitride film on the untreated silicon nitride film. Forming the untreated silicon nitride film includes the steps of: (a) supplying a first silicon precursor into the reaction chamber, thereby allowing chemical species from the first silicon precursor to be adsorbed on the substrate, and (b) supplying a first nitrogen precursor into the reaction chamber, thereby nitriding the chemical species to deposit resultant silicon nitride. The step (a) and the step (b) are sequentially and repeatedly performed to form the untreated silicon nitride film.

Abstract: A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and/or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.

Abstract: The present invention is a probe forming device, the probe forming device comprises a spinning shaft, a first adjusting structure, a second adjusting structure, an electrolyte conveying member and a power supply. One of the holding member of the spinning shaft holds a workpiece, and a driving member drives the workpiece to move and abut the first adjusting structure and the second modulating structure. The electrolyte conveying member conveys an electrolyte to the workpiece, the first adjusting structure and the second adjusting structure, and is electrically connected. At least one positive end of the power supply is connected to the workpiece or the spinning shaft, and at least one negative end is connected to the first adjusting structure and the second modulating structure.

Abstract: The present disclosure provides a method for manufacturing a semiconductor memory device. Because the present method includes applying a dopant-implanted layer on a semiconductor memory substrate before growing a silicon nitride layer on the substrate, the silicon nitride layer can be grown at an increased rate. The present disclosure avoids a problem encountered in the prior art wherein a seam having a greater length contacts an edge of a contact plug of a semiconductor memory device. Hence, a leakage problem at subsequent operations of semiconductor manufacture can be avoided, and the product yield can be significantly improved.

Abstract: A multi-object tracking method includes generating multi-dimensional physical characterization data associated with a plurality of objects; simplifying the multi-dimensional physical characterization data to reduce at least one dimension thereof, thereby resulting in a simplified data set; and tracking by comparing a current simplified data set and a stored data set in a database. If the current simplified data set conforms to the stored data set in the database, a proper operation is correspondingly performed; otherwise the current simplified data set is defined as a new event and stored in the database.

Abstract: An antenna structure includes a ground element, a dielectric substrate, a first radiation element, a second radiation element, a third radiation element, a fourth radiation element, a fifth radiation element, a sixth radiation element, and a seventh radiation element. The dielectric substrate has a first surface and a second surface. The first radiation element and the third radiation element are coupled to a first feeding point. The second radiation element and the fourth radiation element are coupled to the ground element. The first radiation element, the second radiation element, the third radiation element, and the fourth radiation element are on the first surface. The fifth radiation element is coupled to a second feeding point. The sixth radiation element and the seventh radiation element are coupled to the fifth radiation element. The fifth radiation element, the sixth radiation element, and the seventh radiation element are on the second surface.

Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.

Abstract: An online prediction method of tool-electrode consumption adapted for an electrical discharge machining (EDM) apparatus includes an experimental design; extracting electrode consumption variables from machining parameters of the electrical discharge machining (EDM) apparatus; and obtaining a correlation between the machining parameters and the electrode consumption variables through a correlation analysis to obtain a prediction model capable of predicting an effective contact area of a tool-electrode and a workpiece. In addition, a prediction method of machining accuracy is provided.

Abstract: The present application discloses a method for fabricating the semiconductor device including providing a substrate in a reaction chamber, forming an untreated silicon nitride film on the substrate, and forming a treated silicon nitride film on the untreated silicon nitride film. Forming the untreated silicon nitride film includes the steps of: (a) supplying a first silicon precursor into the reaction chamber, thereby allowing chemical species from the first silicon precursor to be adsorbed on the substrate, and (b) supplying a first nitrogen precursor into the reaction chamber, thereby nitriding the chemical species to deposit resultant silicon nitride. The step (a) and the step (b) are sequentially and repeatedly performed to form the untreated silicon nitride film.

Abstract: A projecting apparatus is provided, and includes a frame, a light source module, at least one collimator lens, at least one adhesive, and a microelectromechanical systems (MEMS) module. The frame includes a first frame portion and a second frame portion. The first frame portion has a carrier and a carrying bridge having an end connected to the carrier. The frame has a processing slot that uses the carrying bridge as a bottom thereof, and the carrying bridge has at least one thru-hole that is in spatial communication with the processing slot. The second frame portion is connected to the carrier and another end of the carrying bridge of the first frame portion. The at least one adhesive corresponds in position to the at least one thru-hole, and connects the at least one collimator lens onto the carrying bridge. The MEMS module is disposed on the second frame portion.

Abstract: A projecting apparatus is provided, and includes a frame, a light source module, and a microelectromechanical systems (MEMS) module. The frame includes two lateral boards respectively arranged on two opposite sides thereof, and a transverse beam that connects the two lateral boards. Each of the two lateral boards has a guiding slot recessed in a portion thereof. The MEMS module is configured to transmit light emitted from the light source module, and includes a flexible circuit board, a first MEMS unit, and a second MEMS unit, the latter two of which are connected to the flexible circuit board. The first MEMS unit is inserted into the guiding slots of the two lateral boards. The second MEMS unit abuts against the two lateral boards and/or the transverse beam. The first MEMS unit and the second MEMS unit have a predetermined angle there-between by the second frame portion.

Abstract: An apparatus capable of local polishing and suitable for performing a plasma-electrolytic polishing process on an object is provided. The apparatus capable of local polishing includes a fixing seat, a motion mechanism, and a jet module connected to the motion mechanism and including an electrolyte communication port, a gas communication port, a power connection area, and a jet flow outlet. The jet flow outlet faces the fixing seat and is communicated with the electrolyte communication port and the gas communication port to be suitable for performing the plasma-electrolytic polishing process on the object fixed on the fixing seat. A plasma-electrolytic polishing system including an apparatus capable of local polishing is also provided.

Abstract: The present application discloses a method for processing probe. Firstly, a clamping member of a rotation shaft is clamped with a workpiece, and then the workpiece is moved to a processed area by the rotation shaft. The workpiece is rotated by the rotation shaft, and an electrochemical process of the workpiece is performed under the rotation of the shaft and an electrolyte sprayed between the workpiece and the polished module. During the performing of the electrochemical process, it can be that the rotation shaft is moved a processing distance or the included angle of the polish module is changed, for a probe being accomplished from the workpiece. Thereby, the abrasion of the polish module is lower and the performance for processing the probe under the electrochemical process.

Abstract: The present invention is a probe forming device, the probe forming device comprises a spinning shaft, a first adjusting structure, a second adjusting structure, an electrolyte conveying member and a power supply. One of the holding member of the spinning shaft holds a workpiece, and a driving member drives the workpiece to move and abut the first adjusting structure and the second modulating structure. The electrolyte conveying member conveys an electrolyte to the workpiece, the first adjusting structure and the second adjusting structure, and is electrically connected. At least one positive end of the power supply is connected to the workpiece or the spinning shaft, and at least one negative end is connected to the first adjusting structure and the second modulating structure.

Abstract: A mobile device includes a host upper cover, a host lower cover, a metal cavity structure, a protruding radiation element, a nonconductive connection element, and a feeding element. The metal cavity structure is coupled between the host upper cover and the host lower cover. The metal cavity structure includes a first metal partition and a second metal partition. The first metal partition has an opening. The nonconductive connection element is connected to the edge of the opening of the first metal partition. The nonconductive connection element is configured to support and surround the protruding radiation element. The feeding element is coupled to a signal source and is disposed adjacent to the protruding radiation element. An antenna structure is formed by the feeding element and the protruding radiation element.

Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.

Abstract: A communication device and a power control method thereof are provided. The power control method, performed by a communication device, includes: determining a power range of a transmit power of an uplink signal; determining a gain switch range based on the power range; when the transmit power of the uplink signal is within the gain switch range, determining a first gain mode for amplifying the uplink signal; and when the transmit power of the uplink signal is out of the gain switch range, determining a second gain mode for amplifying the uplink signal.