Patents by Inventor Wen-Chieh Wu

Wen-Chieh Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200018843
    Abstract: A multi-object tracking method includes generating multi-dimensional physical characterization data associated with a plurality of objects; simplifying the multi-dimensional physical characterization data to reduce at least one dimension thereof, thereby resulting in a simplified data set; and tracking by comparing a current simplified data set and a stored data set in a database. If the current simplified data set conforms to the stored data set in the database, a proper operation is correspondingly performed; otherwise the current simplified data set is defined as a new event and stored in the database.
    Type: Application
    Filed: September 25, 2018
    Publication date: January 16, 2020
    Inventors: Fang-Ming Wu, Wen-Chieh Wu
  • Publication number: 20200014092
    Abstract: A mobile device includes a host upper cover, a host lower cover, a metal cavity structure, a protruding radiation element, a nonconductive connection element, and a feeding element. The metal cavity structure is coupled between the host upper cover and the host lower cover. The metal cavity structure includes a first metal partition and a second metal partition. The first metal partition has an opening. The nonconductive connection element is connected to the edge of the opening of the first metal partition. The nonconductive connection element is configured to support and surround the protruding radiation element. The feeding element is coupled to a signal source and is disposed adjacent to the protruding radiation element. An antenna structure is formed by the feeding element and the protruding radiation element.
    Type: Application
    Filed: August 24, 2018
    Publication date: January 9, 2020
    Inventors: Wan Chu WEI, Hsieh Chih LIN, Yu-Chia CHANG, Jung-Chin HSIEH, Wen-Chieh WU
  • Patent number: 10498041
    Abstract: A mobile device includes a host upper cover, a host lower cover, a metal cavity structure, an H-shaped slot antenna, and a feeding element. The metal cavity structure is coupled between the host upper cover and the host lower cover. The H-shaped slot antenna is formed on the host upper cover, the host lower cover, the metal cavity structure, the host upper cover and the metal cavity structure, or the host lower cover and the metal cavity structure. The feeding element is coupled to a signal source. The feeding element is configured to excite the H-shaped slot antenna.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: December 3, 2019
    Assignee: Wistron Corp.
    Inventors: Hsieh-Chih Lin, Yu-Chia Chang, Wan Chu Wei, Jung-Chin Hsieh, Wen-Chieh Wu
  • Patent number: 10441260
    Abstract: An expander includes a first handle, a second handle, a first supporting member, and a second supporting member. The first handle includes a first gripping portion, a first pivoting portion, a first connecting portion, and an expanding compass. The second handle includes a second gripping portion, a second pivoting portion, and a second connecting portion. The second gripping portion includes a thru groove, and the expanding compass passes through the thru groove. The second pivoting portion is pivoted to the first pivoting portion. The second connecting portion and the second gripping portion are extending from two ends of the second pivoting portion, and the extension direction of the second connecting portion is not parallel to the extension direction of the second gripping portion.
    Type: Grant
    Filed: March 6, 2017
    Date of Patent: October 15, 2019
    Assignees: Megaforce Company Limited, Mackay Memorial Hospital
    Inventors: Wen-Chieh Wu, Shu-Fen Chen, Pei-Yi Lee
  • Patent number: 10413984
    Abstract: A method for predicting precision of an electrical discharge machine is provided. In the method, plural sets of process data are obtained while the electrical discharge machine processes workpiece samples. Process features are established based on the process data. Each of the workpiece samples with respect to each of at least one measurement item is measured by using a metrology tool, thereby obtaining measurement values of the workpiece samples with respect to each measurement item. A correlation analysis operation is performed to obtain correlation coefficients. At least one key feature is selected from the process features as representative according to the correlation coefficients. The measurement values of the workpiece samples with respect to each measurement item, and the sets of process data corresponding to the key features are used to build a predictive model for predicting the precision of the electrical discharge machine.
    Type: Grant
    Filed: December 7, 2017
    Date of Patent: September 17, 2019
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Haw-Ching Yang, Min-Nan Wu, Cheng-Yen Chen, Wen-Chieh Wu, Chia-Ming Jan
  • Patent number: 10317370
    Abstract: A method for acquiring a dynamic vibration frequency includes the following steps. At least five pairs of vibration measurement elements are selected. A bandwidth range of the vibration measurement elements is determined. The vibration measurement elements in sequence on a first side and a second side, which are geometrically symmetrical to each other, of a main shaft are used to measure vibration displacements in a symmetrical position arranging manner. The vibration displacements measured by the vibration measurement elements of either of the first side and second side are corrected, so as to differentially eliminate an ambient noise. Positions of nodes located on the first side and the second side are calculated. The vibration displacements in the preceding steps are used to deduce dynamic vibration frequencies of main harmonics. A vibration mode of the main shaft is confirmed.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: June 11, 2019
    Assignee: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE
    Inventors: Chia-Ming Jan, Wen-Chieh Wu
  • Publication number: 20180193974
    Abstract: The present invention relates to a polishing having a polishing layer, an elastic base layer and a binder layer. The binder layer binds the elastic base layer to the polishing layer. A compressibility of the elastic base layer is greater than a compressibility of the polishing layer. The present invention further provides a polishing apparatus and a method for polishing a substrate.
    Type: Application
    Filed: January 5, 2018
    Publication date: July 12, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, WEI-TE LIU, WEN-CHIEH WU, YUNG-CHANG HUNG
  • Publication number: 20180161900
    Abstract: A method for predicting precision of an electrical discharge machine is provided. In the method, plural sets of process data are obtained while the electrical discharge machine processes workpiece samples. Process features are established based on the process data. Each of the workpiece samples with respect to each of at least one measurement item is measured by using a metrology tool, thereby obtaining measurement values of the workpiece samples with respect to each measurement item. A correlation analysis operation is performed to obtain correlation coefficients. At least one key feature is selected from the process features as representative according to the correlation coefficients. The measurement values of the workpiece samples with respect to each measurement item, and the sets of process data corresponding to the key features are used to build a predictive model for predicting the precision of the electrical discharge machine.
    Type: Application
    Filed: December 7, 2017
    Publication date: June 14, 2018
    Inventors: Haw-Ching YANG, Min-Nan WU, Cheng-Yen CHEN, Wen-Chieh WU, Chia-Ming JAN
  • Patent number: 9889630
    Abstract: The sheet of a polishing equipment of the present invention includes a buffer layer, an adsorption layer, and an adhesion layer. The adhesion layer is disposed between the buffer layer and the adsorption layer. The adhesion layer has a plurality of adhesion points to bind the buffer layer and the adsorption layer together. The adhesion points are discontinuous and have gaps in between. Consequently, when the sheet is pressed, air can be vented out through the gaps between the adhesion points, so that the adsorption force is increased.
    Type: Grant
    Filed: August 5, 2009
    Date of Patent: February 13, 2018
    Assignee: BESTAC ADVANCED MATERIAL CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Lyang-Gung Wang, Wen-Chieh Wu
  • Publication number: 20180036861
    Abstract: The present invention relates to a polishing pad with improved slurry retention capacity, which includes a polishing layer. The polishing layer includes an elastomer main body and a plurality of titanium dioxide nanowires. Each of the titanium dioxide nanowires is independent and is distributed evenly and randomly in the elastomer main body. The present invention further provides a polishing apparatus and a method for manufacturing the polishing pad.
    Type: Application
    Filed: August 1, 2017
    Publication date: February 8, 2018
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, YUNG-CHANG HUNG, PIN-HSIEN SUNG, CHIN-WEI CHEN, WEN-CHIEH WU
  • Patent number: 9884400
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad includes a polymeric elastomer and a plurality of hollow structures. The hollow structures are distributed in the polymeric elastomer uniformly, and the sizes of the hollow structures are substantially equal to each other.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: February 6, 2018
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Hsin-Ru Song
  • Publication number: 20170273550
    Abstract: An expander includes a first handle, a second handle, a first supporting member, and a second supporting member. The first handle includes a first gripping portion, a first pivoting portion, a first connecting portion, and an expanding compass. The second handle includes a second gripping portion, a second pivoting portion, and a second connecting portion. The second gripping portion includes a thru groove, and the expanding compass passes through the thru groove. The second pivoting portion is pivoted to the first pivoting portion. The second connecting portion and the second gripping portion are extending from two ends of the second pivoting portion, and the extension direction of the second connecting portion is not parallel to the extension direction of the second gripping portion.
    Type: Application
    Filed: March 6, 2017
    Publication date: September 28, 2017
    Inventors: Wen-Chieh WU, Shu-Fen CHEN, Pei-Yi LEE
  • Publication number: 20170239783
    Abstract: The present invention relates to a mounting sheet comprising a mounting layer. The mounting layer comprises a mounting surface for mounting the substrate. The mounting surface comprises a first mounting area and a second mounting area, and wherein a mounting force of the first mounting area is stronger than a mounting force of the second mounting area. The sheet according to the invention has the different mounting areas, so that the substrate is easily unloaded when polishing is completed. Furthermore, the broken of the substrate due to removal and the duration and the difficulty of removal are reduced.
    Type: Application
    Filed: April 14, 2017
    Publication date: August 24, 2017
    Inventors: CHUNG-CHIH FENG, I-PENG YAO, LYANG-GUNG WANG, HSIN-RU SONG, WEN-CHIEH WU
  • Publication number: 20170175289
    Abstract: An electrochemical polishing apparatus is provided for polishing a workpiece having at least one sharp object. According to the present invention, the electrolyte is driven to flow to the sharp object and the electrochemical processing is performed for polishing the sharp object.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: JUNG-CHOU HUNG, WEN-CHIEH WU, DA-YU LIN
  • Publication number: 20170175287
    Abstract: An electrochemical polishing method is provided for polishing a workpiece having at least one sharp object. According to the present invention, the electrolyte is driven to flow to the sharp object and the electrochemical processing is performed for polishing the sharp object.
    Type: Application
    Filed: December 17, 2015
    Publication date: June 22, 2017
    Inventors: JUNG-CHOU HUNG, WEN-CHIEH WU, DA-YU LIN
  • Patent number: 9682457
    Abstract: The present invention relates to a composite polishing pad and a method for making the same. The composite polishing pad includes a cushion layer and a polishing layer. The cushion layer includes a first polymeric elastomer with a hardness of 10 to 70 shore D, and is attached to the polishing layer directly. The polishing layer includes a second polymeric elastomer with a hardness of 30 to 90 shore D, and has a polishing surface for polishing a workpiece. Whereby, the polishing layer will not peel off from the cushion layer easily, so that the polishing quality is raised.
    Type: Grant
    Filed: September 29, 2014
    Date of Patent: June 20, 2017
    Assignee: SAN FANG CHEMICAL INDUSTRY CO., LTD.
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Yung-Chang Hung
  • Publication number: 20170168023
    Abstract: A method for acquiring a dynamic vibration frequency includes the following steps. At least five pairs of vibration measurement elements are selected. A bandwidth range of the vibration measurement elements is determined. The vibration measurement elements in sequence on a first side and a second side, which are geometrically symmetrical to each other, of a main shaft are used to measure vibration displacements in a symmetrical position arranging manner. The vibration displacements measured by the vibration measurement elements of either of the first side and second side are corrected, so as to differentially eliminate an ambient noise. Positions of nodes located on the first side and the second side are calculated. The vibration displacements in the preceding steps are used to deduce dynamic vibration frequencies of main harmonics. A vibration mode of the main shaft is confirmed.
    Type: Application
    Filed: September 29, 2016
    Publication date: June 15, 2017
    Inventors: Chia-Ming JAN, Wen-Chieh WU
  • Publication number: 20170167047
    Abstract: The present invention relates to a continuous electrochemical processing apparatus, which comprises an electrode transport module, an electrode module, and a material-tape conveying mechanism. The electrode module is connected with the electrode transport module and includes an electrode. The material-tape conveying mechanism is disposed corresponding to the electrode module and used for conveying a material tape. Thereby, the electrode of the electrode module may continuously electrochemical process the material tape.
    Type: Application
    Filed: December 30, 2015
    Publication date: June 15, 2017
    Inventors: YOU-LUN CHEN, DA-YU LIN, HUNG-YI CHEN, WEN-CHIEH WU, CHIN-WEI LIU, CHEN-WEI WU, KUEN-CHIH LAN, HO-CHUNG FU
  • Patent number: 9669518
    Abstract: The present invention relates to a polishing pad and a method for making the same. The polishing pad has a grinding layer. The grinding layer includes a plurality of fibers and a main body. The fineness of the fibers is 0.001 den to 6 den. The main body is a foam and encloses the fibers. The main body has a plurality of first pores and a plurality of second pores, wherein the first pores are communicated with each other, and the second pores are independent from each other. The size of the first pores is at least 5 times greater than the size of the second pores. The hardness of the grinding layer is 30 to 90 shore D, and the compression ratio thereof is 1% to 10%.
    Type: Grant
    Filed: August 26, 2014
    Date of Patent: June 6, 2017
    Assignee: San Fang Chemical Industry Co., Ltd.
    Inventors: Chung-Chih Feng, I-Peng Yao, Wen-Chieh Wu, Yung-Chang Hung
  • Patent number: D873450
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: January 21, 2020
    Assignee: Juluen Enterprise Co., Ltd.
    Inventors: Lung-Yuan Chen, Wen-Chieh Wu