Abstract: The present invention relates to a device and method for brazing a heat pipe assembly with copper-silver alloy filler rings to improve heat dissipation efficiency of a heat pipe. The device comprises a brazing furnace and a conveyor. The brazing furnace comprises an open ended passage with a multi-stage brazing heater and cooler. The conveyor comprises an input bracket assembly, an output bracket assembly and a steel mesh belt. The method comprises steps of (A) providing multiple heat pipe components, (B) assembling the heat pipe components to form heat pipe assemblies, (C) injecting mixed gas, (D) turning on the multi-stage brazing heater and cooler, (E) placing the heat pipe assemblies on the conveyor, (F) brazing the heat pipe assemblies to form heat pipes, (G) cooling the heat pipes and (H) removing the heat pipes from the conveyor.

Abstract: A heat sink assembly in accordance with the present invention increases heat dissipation area, improves heat dissipation efficiency and comprises a base, a core pipe, an outer pipe, a top cover and a working fluid. The base has a top surface. The core pipe is mounted securely on and protrudes from the top surface with an air-tight fit and comprises an inner surface, an outer surface, a wick, multiple holes and a top. The wick is formed on the inner and outer surface. The outer pipe is mounted securely on and protrudes from the base concentrically around the core pipe and comprises an inner surface, an outer surface, a wick and a top. The wick is formed on the inner surface. The holes are formed around the core pipe away from the base. The top cover closes the top of the core pipe and the top of the outer pipe.

Abstract: A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.

Abstract: A heat sink module for light and thin electronic equipment, where the module includes a concave top cover, and a bottom cover having on its top surface several equidistantly spaced heat conducting fins of a certain height separated by gaps. Copper powder may cover the concave side of the top cover, and in the gaps between the fins on the top surface of the bottom to form a heat conductor. The top cover and the bottom cover are fit and brazed together to form a unit, where the gaps between the fins form a plurality of connected heat-circulating chambers that are evacuated of air and completely filled with a working fluid. Also, a method of making a heat sink module for light and thin electronic equipment is described.

Abstract: A method of brazing components of a heat sink module is described. The method may include the steps of assembling the components to be brazed, and placing a copper-silver alloy filler at junctions between the components. The assembled components may be pre-heated in an air-tight environment to burn up most of the oxygen present, and then heated to the melting point of the copper-silver alloy filler in an air-tight environment having an amount of inert gas sufficient to displace oxygen so as to avoid oxidation of the components, making the filler melt and evenly spread over the gaps at the junctions of the components. The assembled components may then be cooled to solidify the liquid filler at the junctions, to form a finished product. Also, an assembly line system for brazing the components of a heat sink module is described.