Patents by Inventor Wen-Chih Wu

Wen-Chih Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12237284
    Abstract: A semiconductor structure and a manufacturing method thereof are provided. The semiconductor structure includes an interconnect structure disposed over a semiconductor substrate, contact pads disposed on the interconnect structure, a dielectric structure disposed on the interconnect structure and covering the contact pads, bonding connectors covered by the dielectric structure and landing on the contact pads, and a dummy feature covered by the dielectric structure and laterally interposed between adjacent two of the bonding connectors. Top surfaces of the bonding connectors are substantially coplanar with a top surface of the dielectric structure, and the bonding connectors are electrically coupled to the interconnect structure through the contact pads.
    Type: Grant
    Filed: February 16, 2022
    Date of Patent: February 25, 2025
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chen-Yu Tsai, Ku-Feng Yang, Tsang-Jiuh Wu, Wen-Chih Chiou
  • Patent number: 12230517
    Abstract: An exhaust structure includes a piping section, wherein the piping section has a first inner diameter in a central region of the piping section, the piping section has a second diameter in at least one of an inlet or an outlet, and the second diameter has a same value as the first inner diameter. The exhaust structure further includes a plurality of smoothing layers configured to resist turbulence and condensation produced by a flow of one or more gasses in the piping section.
    Type: Grant
    Filed: May 26, 2022
    Date of Patent: February 18, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsien-Chang Hsieh, Chun-Chih Lin, Tah-te Shih, Wen-Hsong Wu, Chune-Te Yang, Yu-Jen Su
  • Patent number: 8445070
    Abstract: A biodegradable waterproof paper coated with PLA film and the manufacturing method for the same are disclosed. The biodegradable waterproof paper includes a PLA film on at least one surface of the paper and the PLA film partially infiltrates into the fibers of the paper.
    Type: Grant
    Filed: January 15, 2009
    Date of Patent: May 21, 2013
    Assignee: Wei Mon Industry Co., Ltd.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu
  • Publication number: 20120010311
    Abstract: A biodegradable two-liquid type foaming composition, which comprises main liquid and auxiliary liquid, is disclosed. The main liquid is formed by mixing polylactic acid powder, polycaprolactone polyol and foaming agent. The auxiliary liquid is formed by mixing polyol and isocyanate. Once the main liquid and the auxiliary liquid are mixed, the foaming reaction proceeds and the biodegradable foam is formed.
    Type: Application
    Filed: March 17, 2010
    Publication date: January 12, 2012
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu
  • Publication number: 20110049425
    Abstract: Biodegradable desiccant grains include 80-85 weight parts of a polylactide matrix and 20-30 weight parts of water absorbent particles dispersed in the matrix. The water absorbent particles include polysaccharide, biodegradable polymers, natural calcium carbonate, and activated charcoal. A method for making the biodegradable desiccant grains is also disclosed.
    Type: Application
    Filed: September 2, 2010
    Publication date: March 3, 2011
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Chih-Hsien HUANG, Wen-Chih WU
  • Publication number: 20100323212
    Abstract: A biodegradable waterproof paper coated with PLA film and the manufacturing method for the same are disclosed. The biodegradable waterproof paper includes a PLA film on at least one surface of the paper and the PLA film partially infiltrates into the fibers of the paper.
    Type: Application
    Filed: January 15, 2009
    Publication date: December 23, 2010
    Applicant: WEI MON INDUSTRY CO., LTD.
    Inventors: Ching-Hsin Chang, Wen-Chih Wu
  • Patent number: 7794260
    Abstract: A memory card fixing device including a base and two resilient fastening structures is disclosed. The resilient fastening structures are provided at the two opposite sides of the base. Each fastening structure has a guiding portion and a recess. A memory card slides into the recess along the guiding portion and can be fixed in the recess by the resilience of the fastening structures.
    Type: Grant
    Filed: September 4, 2008
    Date of Patent: September 14, 2010
    Assignee: ASUSTek Computer Inc.
    Inventors: Yi-An Chen, Wen-Chih Wu
  • Publication number: 20090068874
    Abstract: A memory card fixing device including a base and two resilient fastening structures is disclosed. The resilient fastening structures are provided at the two opposite sides of the base. Each fastening structure has a guiding portion and a recess. A memory card slides into the recess along the guiding portion and can be fixed in the recess by the resilience of the fastening structures.
    Type: Application
    Filed: September 4, 2008
    Publication date: March 12, 2009
    Applicant: ASUSTEK COMPUTER INC.
    Inventors: Yi-An Chen, Wen-Chih Wu
  • Publication number: 20060185062
    Abstract: A head-mounted MP3 player usable during sports has a head-mounted sports device, an MP3 module, a fixing device, and at least an earphone. The MP3 module is fixed by the fixing device on the head-mounted sports device such as a hat, a sun-hat, a hard helmet, a soft helmet, a head band, a hair ring, a headscarf, a swimming hat, or a diving helmet. The earphone is electrically connected to the MP3 module via a signal cable. The MP3 player can thus be fixed on a user's head. When the user exercises, the MP3 module can be worn on his head with the head-mounted sports device. Moreover, the MP3 module won't fall to cause its damage during sports.
    Type: Application
    Filed: April 14, 2005
    Publication date: August 24, 2006
    Applicant: Gaiatek Inc.
    Inventors: Yan-Ru Peng, Tzu-Ping Lee, Wen-Chih Wu