Abstract: A chip on film package includes a base film, a patterned circuit layer, a solder resist layer, a chip and a graphite sheet. The base film includes a first surface and a mounting region located on the first surface. The patterned circuit layer is disposed on the first surface. The solder resist layer partially covers the patterned circuit layer. The chip is disposed on the mounting region and electrically connected to the patterned circuit layer. The graphite sheet covers at least a part of the solder resist layer, wherein an outer edge of the graphite sheet is substantially aligned with an outer edge of the solder resist layer.

Abstract: A chip on film package includes a base film, a chip and a heat-dissipation sheet. The base film includes a first surface. The chip is disposed on the first surface and having a chip length along a first axis of the chip. The heat-dissipation sheet includes a covering portion and a first extending portion connected to the covering portion and attached to first surface. The covering portion at least partially covers the chip and having a first length along the first axis. The first extending portion has a second length along the first axis substantially longer than the first length of the covering portion, and the covering portion exposes a side surface of the chip, wherein the side surface connects a top surface and a bottom surface of the chip.

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.

Abstract: A semiconductor device includes a chip, a plurality of first bumps, and a plurality of second bumps. The chip includes an active surface. The first bumps are disposed on the active surface along a first direction. The second bumps are disposed on the active surface along a second direction parallel to the first direction, wherein one of the second bumps is located between adjacent two of the first bumps, a closest distance from the second bumps to the fan-out region is smaller than a closest distance from the first bumps to the fan-out region, and a first width of one of the first bumps is larger than a second width of one of the second bumps.

Abstract: A wearable device with a chip on film package structure is provided. The wearable device with the chip on film package structure includes a display device and a chip device. The display device includes a display area and a non-display area. The non-display area includes a bonding area. The chip device is bonded to the display device via the chip on film package structure. The chip device is configured to drive the display device to display images. The chip on film package structure includes a film having a first end and a second end. The chip device is located on the film, and the first end of the film is bonded to the bonding area of the display device.

Abstract: A chip on film package includes a base film, a chip and a heat-dissipation sheet. The base film includes a first surface. The chip is disposed on the first surface and having a chip length along a first axis of the chip. The heat-dissipation sheet includes a covering portion and a first extending portion connected to the covering portion and attached to first surface. The covering portion at least partially covers the chip and having a first length along the first axis. The first extending portion has a second length along the first axis substantially longer than the first length of the covering portion, and the covering portion exposes a side surface of the chip, wherein the side surface connects a top surface and a bottom surface of the chip.

Abstract: A mediator-type photocell system is provided. The mediator-type photocell system includes a galvanic cell having a galvanic cell anode and a galvanic cell cathode; and a light capturing portion, including a light capturing cathode corresponding to the galvanic cell anode; and a light capturing anode electrically connected to the light capturing cathode via a conductive element, and corresponding to the galvanic cell cathode, wherein the galvanic cell cathode and the light capturing anode have a first mediator therebetween, the galvanic cell anode and the light capturing cathode have a second mediator therebetween, an oxide is generated to be provided to the galvanic cell cathode when the first mediator is illuminated, and a reducing substance is generated to be provided to the galvanic cell anode when the second mediator is illuminated.

Abstract: A grate panel with upright brace structures is provided and characterized by: a plurality of upright brace structures vertically aligned and centrally disposed inside a plurality of side panels of the grate panel, and transversely spaced apart from one another at an appropriate distance; a plurality of reinforcing panels disposed between, and welded to, the upright brace structures; and the plurality of side panels configured to surround the upright brace structures and the reinforcing panels by being welded thereto. Thus, the grate panel is equipped with corrugated upright brace structures to provide such advantages as high-strength support, ease of construction, and low production costs.

Abstract: A replaceable bedding structure for double uses in winter and summer mainly includes a bottom cover which has an opening with a coupling section located on the periphery thereof. The upper cover has a connecting section corresponding to the coupling section and a plurality of spaced blocks. Users can rapidly change and replace the upper cover according to seasonal reasons and personal preference. Thus the practicality and versatility of the bedding goods are improved. Moreover, the blocks are spaced to form passages there between to enhance air ventilation. As a result, air permeability and comfort of the bedding goods are also improved.